無鉛錫合金系統主要是應用在電子封裝產業，Sn-Zn中添加過量的Zn元素與Bi元素會使延展性下降，低延展性對於電子封裝產業有不好的影響，所以對於高Zn與高Bi含量之研究，仍屬缺乏。但是低延展性可以應用在製作精密鑄造微晶蠟成型模具。本研究主要進行高Zn與高Bi含量的Sn-xZn ( x = 14, 17, 20, 23, 26 wt.% )二元合金系統、Sn-9Zn-11Bi與Sn-yZn-zBi ( y = 20, 23, 26 wt.%，z = 8, 11 wt.% )合金系統之機械性質探討，主要著重在高Zn含量與高Bi含量之顯微組織、凝固行為、導電、斷屑及拉伸機械性質之探討。由於金屬的熱傳性質與導電性質相似，因此本研究測量導電係數來評估金屬的熱傳性質。
實驗結果顯示，Sn-xZn合金中，Zn含量的增加會提升Zn-rich相面積率，降低延展性，對抗拉強度值沒有明顯的影響。其中高Zn含量之固液共存時間與熔點較低Zn含量高。
Sn-yZn-zBi系統中，Bi含量效應：增加Bi含量會提升Zn-rich相面積率；降低熔點與延展性，但是再添加過多的Bi含量，對於延展性沒有明顯的影響；導電係數與抗拉強度值沒有明顯的影響，其中Sn-26Zn-xBi系統添加過量的Bi會使抗拉強度值降低。Zn含量效應與Sn-Zn二元系統相似：增加Zn含量會提升Zn-rich相面積率、斷屑性質、降伏強度與抗拉強度；對延展性沒有明顯的影響，因為Sn-Zn-Bi合金材料的延展性皆在4%以下，其中值得一提的是低Zn高Bi含量的Sn-9Zn-11Bi之延展性為零；熔點與固液共存時間沒有明顯的影響，其中Sn-yZn-11Bi系統增加Zn含量會使熔點下降。

The lead-free stannum system is mainly applied in the electronic packaging industry. The ductility is decreased when the excessive Zn and Bi content is assed in the Sn-Zn binary alloys, and low ductility is detrimental to the electronic seal industry. The influence of high Zn and Bi elements content is still unknown. However, the low ductility property may be available in manufacturing precision casting wax molding mold. In this study, the influence of high Zn and Bi content in Sn-xZn (x = 14, 17, 20, 23, 26 wt.%) binary alloys system, Sn-9Zn-11Bi and Sn-yZn-zBi (y = 20, 23, 26 wt.%, z = 8, 11 wt.%) ternary alloys system on microstructures, coagulation behaviors, electric conduction, chip breaking and the stretching mechanical property are investigated. Because the thermal conduction and the electric conduction are similarly in metals, this research measures the electric conductivity to estimate the thermal conduction.
The experimental results show that the Zn-rich area fraction is increased, whereas the ductility is decreased with Zn content in the Sn-xZn binary alloys system. There is no obvious influence on the tensile strength. The liquid-solid coexistence interval and the melting point of high Zn content specimens is better than the low Zn content specimens.
The Zn-rich area fraction is increased, whereas the melting point and the ductility are decreased with increasing Bi content in the Sn-yZn-zBi trinary alloys system. There is no more obvious influence on the elongation, electric conduction and tensile strength when increasing more Bi content. But the tensile strength is decreased with adding excessively Bi content in the Sn-26Zn-xBi system.
The Zn-rich area rate, chip breaking property, and tensile strength are increased with increasing Zn content in the Sn-yZn-zBi trinary alloys system. Because the ductility of all the Sn-yZn-zBi alloys below 4%, it has no obvious influence on ductility. It should be noted that the ductility is zero for the low Zn-content, high Bi-content of Sn-9Zn-11Bi alloy. It has no obvious influence on the liquid-solid coexistence interval and melting point, but the melting point is decreased with increasing Zn content in Sn-yZn-11Bi system.

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