覆晶封裝現今為封裝技術業界相當關注的封裝技術，高接腳數與細間距為其特點。覆晶封裝在晶片與基板接合時，需於高溫下加壓，因而使錫球變形並黏於基板上。在利用理論分析封裝製程時，需要各個元件的材料參數，其中用於當作接點的合金錫球變形行為，屬於塑性變形行為，在取得其應力應變關係，須利用實驗搭配模擬分析。本論文探討合金錫球尺寸對其材料參數的關係，在取得合金錫球之應力應變關係時，必須先以實驗量測合金錫球的受力與變形關係，再利用試誤法搭配有限元素分析，吻合實驗量測值取得合金錫球之塑性變形參數，並探討合金錫球之溫度和尺寸與塑性變形參數之關係。最後利用有限元素模擬分析各尺寸合金錫球，在不同溫度下的應力分佈，觀察應力在Y方向的分量，並探討合金錫球的尺寸和溫度與Y方向之應力分量的趨勢。

Flip Chip Package, which have high pin density and fine pitch, is one of the most important technologies into the integrated circuit packaging industry. It is also used in liquid crystal displays which is called chip on glass packaging processes. To simulate the packaging process, the material properties of all components are required. The bump will have large plastic deformation during the packaging. This study employed a home-made machine to measure the relationship between the compression force and bump deformation. The results were used to match the simulated data by a CAE software. From matching the experimental and simulated data, the material constants for the plastic flow of the solder bumps was determined. This study discussed the effect of the bump size on the deformation of the solder bump. After obtaining material constants of the bumps, simulations by CAE software could provide the stress distribution around the bump. It also predicted the Y-component of stress for different bump sizes and the packaging temperatures.

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