本文發展一種新型之滾輪式紅外光輔助金屬轉印技術，利用一預先製作好的次微米或奈米等級的矽模仁當母模，矽模仁上會先蒸渡一層抗沾黏膜，再蒸鍍金屬層作為圖形轉印層，並且在基板表面沉積一層金屬薄膜當作黏著層；基板在ㄧ外加壓力下與矽模仁接觸，進行金屬層與金屬層的對壓，同時採用紅外光穿透基板後對金屬層進行加熱，讓矽模仁上的圖形轉印層與基板上的黏著層產生鍵結，因而將矽模仁上的金屬層圖形轉印到基板上。本文利用此金屬轉印技術，選用石英( Quartz )與鈮酸鋰( )二種基板，成功地將次微米與奈米等級之圖形轉印到兩種基板上，再分別進行後續蝕刻，製作出次微米與奈米等級之石英模仁與GHz 等級之表面聲波元件。
在紅外光輔助金屬轉印實驗中，本文準備2 cm × 2 cm大小的矽模仁來當轉印的母模，採用氣相沉積的方式在矽模仁上蒸渡一層抗沾黏膜，改變矽模仁表面的鍵結能力，讓圖形轉印層容易成功；而轉印層的金屬材料為金( Au )；另外，在石英基板與鈮酸鋰基板分別蒸鍍30 nm鉻( Cr )與10 nm鈦( Ti )當作轉印的黏著層，同時採用低成本的紅外燈管產生紅外光，作為金屬層轉印的加熱源，一方面成功地提昇了圖形轉印的成功率，二方面有效降低金屬轉印製程設備的成本。實驗架構方面，本文採用滾輪式轉印機構來進行金屬轉印，其優點是利用玻璃滾筒與基板進行線接觸的載重施加，同時將紅外光進行線聚焦，讓壓應力與加熱光源均壓縮在同一條線上，再藉由滾筒的連續滾動與紅外光照射，逐步地把矽模仁上的圖形完全轉印到基板。
本文成功完成面積2 cm × 2 cm大小的金屬轉印，最小線寬為100 nm；所發展之滾輪式紅外光輔助金屬轉印技術，使用低成本的紅外燈管光源與ㄧ般實驗室常用之儀器設備，因此可以廣泛推廣與應用，突破現有次微米與奈米結構製程上的困難。

This thesis investigates a new type of contact printing lithography method named Roller-Based and Infrared-Assisted Metal Contact Printing Technology. It utilizes a silicon mold which has some pre-fabricated micrometer/nanometer-scale features and is first deposited with a thin release layer and subsequently a thin metal film for pattern transferring. Another metal film which acts as an adhesion layer is also deposited on the substrate surface. The mold is then pressed against the substrate so that a contact pressure is exerted between the two metal films. An infrared light source incident from the substrate side heats up the metal films. Under the action of contact pressure and IR-light heating, a stronger bonding interface is formed between the two metal films and therefore, after separating the mold form the substrate, the patterned metal film defined by the surface features of the mold can be transferred from the mold to the substrate. In this study, quartz and Lithium Niobate (LiNbO3) substrates have been successfully patterned and, after appropriated etching processes, quartz molds and surface acoustic wave (SAW) devices are obtained.
In the experiment, we prepare silicon mold with 2×2 in dimension for pattern transferring. The releasing layer is prepared by vapor deposition method so that the transfer metal layer, a gold film, is only weakly attached to the silicon mold. A 30 nm thick chromium film and a 10 nm thick titanium film are deposited on the Quartz and LiNbO3 substrates for adhesion layer, respectively. An infrared lamp is adopted as the heating source. In the experimental setup, a roller-based mechanism with a glass roller is designed and constructed. The glass roller creates a line-shaped contact pressure as well as focuses the incident infrared light into a line so that the metal-to-metal pattern transformation can be continuously carried out until the whole pattern is transferred.
This thesis successfully demonstrates the pattern transformation on an area size of 2 × 2 with a smallest line-width of 100 nm. It should be emphasized that the proposed micro/nano-lithography method utilizes only a low-cost infrared lamp and other readily available equipments. Therefore, it does have the potential for a wide range of applications in the fabrication of micro/nano-structures.

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