本研究應用微機電系統(MEMS)製程，製作可量測衝擊加速度之感測器模組。我們利用多晶矽(Poly-silicon)壓阻特性，製作出壓阻式應變計；亦利用溶膠凝膠法(sol-gel)來製作以鋯鈦酸鉛(PZT)為材料之壓電式應變感知器。我們將這兩種感測器製作於矽晶圓上，並將矽晶圓連同感測器裁切下來，安裝於另外製作的基座中，使其具有懸臂樑的性質，成為可用於加速度量測的感測器模組。此模組之尺寸大小為長30mm，寬20mm，高15mm，較過去之設計尺寸更小，量測頻率範圍及加速度值更高，可使我們更進一步觀察到衝頭衝擊靶板的瞬間，衝頭加速度之細微變化。我們將製作完成之感測器模組安裝於衝擊系統中，以量測衝頭在衝擊單或多層靶板時所受之衝擊加速度。本研究中亦成功發展出能夠辨識衝擊訊號及計算衝擊次數之電路，並於雙層靶板衝擊試驗中，確實辨識出衝頭衝擊層板的數目。最後，藉由商用有限元素分析軟體LS-Dyna的輔助分析，可驗證實驗訊號有達到一定的準確性，並可從中了解衝擊時衝頭與靶板間的運動關係。

　　Applying the MEMS process, the sensing modulus can be fabricated to measure the acceleration due to impact. We can fabricate poly-silicon strain gauge with piezo-resistive property, and also fabricate PZT with piezo-electric property by sol-gel method. We fabricated both sensors on the silicon wafer, and a cantilever silicon beam with these micro-strain sensors is used to measure the acceleration. The new design is not only smaller than before, but also has high sensing frequency and acceleration. It gives us a better view and more details of the transient behavior of impact. We can use this modulus to measure the impact acceleration signal when the punch impacts a single-layer or multi-layers target boards. In order to establish a system that is able to identify the layer number of target board, we also developed the impacting signal identification circuit and the counting circuit to count the layer number of board. These circuits can identity the signal successfully in double-layer target boards impact test. Finally, we can use commercial numerical analysis software “LS-Dyna” to simulate the impact test as well to verify the accuracy in the experiment, and have the good result.

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