在電子IC封裝製程中，封膠材料(Epoxy Molding Compound, EMC)在熟化(Curing)成型中完成包覆電子晶片，整個過程會與封裝模具表面產生緊密的結合造成黏著的現象，稱之為黏著效應(Adhesion effects)；而此黏著效應會影響脫模作業過程，當黏著效應過大時會造成IC成品在脫模時可能破壞產品表面，進而導致封膠失敗、生產效率降低與可靠度不佳等結果。所以如何在不影響現有模具設計的前提下，能夠藉由特殊表面處理(Surface treatment)以及鍍層(Coating)選擇，來有效降低黏模力(Adhesion force)是目前產業界及研究單位所重視的主題。
本研究利用本實驗室所自行研發完成的自動化電子封裝黏模力檢測設備與量測技術，配合一組與實際封裝產線相當接近的製程參數，針對封裝模具進行放電加工(Electrical discharge machining, EDM)與噴砂(Sandblasting)處理兩種不同的表面處理配合鍍層，探討封膠材料在模具表面的黏著效應，並進行一系列的黏模力測試。
最後，本論文也針對不同封裝材料與不同的表面處理進行五百模次的長時效連續實驗，並觀察黏模力的變化趨勢，透過線性迴歸分析(Linear regression)將實驗數據擬合出一條黏模力特性曲線(Characteristic curve)，分別將每組實驗所擬合的特性曲線進行比對，了解特殊表面處理對於封膠材料的黏著影響程度，用以判斷最佳清模時機，找出黏模力增大的原因，才能減少因黏著效應所產生的不良影響。

In IC packaging, when epoxy molding compound (EMC) is filled in the cavity and cures in the mold, adhesion effects occur in the interface between EMC and mold surface, which may influence the ejection process of the molding. Excessive adhesion effects would cause the package fails, which decreases the yield rate and reliability etc.. For the premise that previous designed mold not be changed, how to improve the mold adhesion force effectively by surface treatment and coating on IC package mold is the main issue for industry and research institutes.
A semi-automatic adhesion force test instrument that had been developed and fabricated was used to measure normal and shear adhesion force between the mold surface and EMC in this study. This instrument was matched with optimum process conditions that were similar to the process of production line. The adhesion force between EMC and two different surface treatments which were electrical discharge machining and sandblasting for different coatings on IC package mold were measured. Then determine which one was the most effective surface coating.
In order to decrease the frequency and time for mold cleaning and increase productivity, it is important to find out the reason for increasing adhesion force. The same process conditions were also applied to conduct continuous molding experiment for EMC and different surface treatments to observe the variation of adhesion force. By linear regression, experiment data could be fitted to a characteristic curve to determine the best time for mold cleaning. Then, the characteristic curves of continuous experiments were compared respectively to figure out the adhesive effects of surface treatments on EMC.

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