| 研究生: |
度山曼 Abdul Samad |
|---|---|
| 論文名稱: |
積層製造 Gyroid 熱交換器之設計及其性能評估研究 Design and performance evaluation of additively manufactured Gyroid heat exchanger |
| 指導教授: |
賴維祥
Lai, Wei-Hsiang |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 航空太空工程學系 Department of Aeronautics & Astronautics |
| 論文出版年: | 2022 |
| 畢業學年度: | 110 |
| 語文別: | 英文 |
| 論文頁數: | 104 |
| 中文關鍵詞: | Gyroid 、熱交換器 、Ansys Fluent 、nTop 、積層製造 |
| 外文關鍵詞: | Gyroid, Heat Exchanger, 3D Printing, Ansys Fluent, nTop |
| 相關次數: | 點閱:37 下載:2 |
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在現代技術中,重量輕、節省空間和高性能熱交換器是高度要求的。汽車和航空航天行業對這種熱交換器的需求很大。本研究在 CAD 軟體(nTop)和選擇性雷射熔化(SLM)技術中執行Gyroid熱交換器模型設計和3D 列印。利用Ansys和SolidWorks的電腦模擬以及感測器的實驗數據已經成功的完成。由數值模擬結果和原型實驗結果比較來優化Gyroid熱交換器設計。重量减少了 87.21%,孔隙率计算为 82.29%。,与板框 HEX 的 Gyroid HEX 相比,由于表面对 - 的增加,效率提高到 33.33%,整体传热系数提高到 75.19%。体积比为 61.81%。這些確認了新Gyroid 熱交換器卓越的性能,提供最大的傳熱表面在較小的體積和更緊緻的空間效率,故在航太和汽車工業都是很有潛力的應用領域。
Lightweight, space-saving, and high-performance heat exchangers are highly required in modern technologies. There are significant needs for this heat exchanger in the automotive and aerospace industries. The Gyroid heat exchanger model is designed in CAD software (nTop platform and SolidWorks) and 3D printing from selective laser melting (SLM) technology. Computer simulation from Ansys and SolidWorks software as well as experimental data from sensors have been carried out successfully. Numerical simulation results and prototype experimental results are compared, and finally this result is feedbacked to SolidWorks to optimize Gyroid heat exchanger design accordingly.
Several novel features are observed in the Gyroid heat exchanger, weight is decreased by 87.21% and the porosity is calculated as 82.29%., When compared to Gyroid HEX with plate and frame HEX, effectiveness increased to 33.33% and overall heat transfer coefficient increased to 75.19% due to the increase of surface-to-volume ratio by 61.81%. In addition, pressure loss is reduced, and overall performance has improved. These confirm the novel Gyroid heat exchanger covering extraordinary performance, providing a maximum heat transfer surface in a smaller space, and more compactness are feasible for aerospace and automotive industries.
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