流體自我組裝具有能夠快速組裝大量元件，且基本製程能與半導體製程相容，能降低成本之特性，成為近年來較受矚目的技術。本研究中，分別就垂直與水平流道，觀察與探討疏液性二氧化矽元件在水中的運動情況。元件尺寸大小皆為0.5mmx1mm×1mm，放入裝水的垂直壓克力流道（10×10×55 cm）中，用CCD拍攝觀察。將元件從不同高度30、40cm，與不同的初始位置處放下，並重複60次相同步驟，紀錄其分布情形。改變水平流道角度分別為0、0.15、0.31、0.46、0.61度，紀錄元件之位移，得知元件在0.61度才開始有平順之運動。元件集中的位置分布，以及平穩的運動情形，經實驗計算得到低雷數流場，有助於自我組裝的效率。進一步將流道底部改為親/疏水性的玻璃，則元件在疏水區的平均速度為4.50cm/s，較元件在親水區的平均速度3.77cm/s為快。

　　To accomplish efficient assembly of a very large number of small components, parallel fluidic self-assembly approaches have emerged. In this research, the flow features hydrophobic silicon dioxide devices were observed in vertical and horizontal channels. The sizes of the devices are 0.5mmx1mmx1mm. The devices were dropped into water repeatedly 60 times from different initial positions and heights. Their motions were observed by a CCD to realize how they flow by fluidic transport. The angles of the horizontal channel were changed to 0, 0.15,0.31,0.46,0.61 degrees, and the moving distances of the devices were recorded. The smooth transportation, the centralized final positions, and the low Reynolds number are helpful for the efficiency of fluidic self-assembly of hydrophobic devices. Futher, changing the bottom of the horizontal channel to hydrophilic/hydrophobic areas, the average speed of devices in hydrophobic area was 4.50cm/s faster than 3.77cm/s in hydrophilic area.

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