本研究在探討綠色封裝材料的選擇與材料之間的交互影響。本實驗分為傳統封裝和CSP封裝兩大部分，結果如下:
現行傳統封裝中的導線架採用Sn85Pb15錫鉛合金鍍層為焊材，本實驗選擇純錫、錫鉍和錫銅三種無鉛鍍液進行電鍍。完成電鍍後，再進行鍍層的外觀、厚度、組成、附著力、可焊性、潤濕能力、上板和錫鬚的觀測。實驗結果顯示純錫和錫鉍兩種電鍍較好，未來比較有可能取代目前的錫鉛電鍍。
CSP封裝，挑選SnAg3.5Cu0.5無鉛錫球和兩種助焊劑進行實驗。實驗解果顯示，SnAg3.5Cu0.5無鉛錫球的熔點為218℃，但在實際的植球製程中熔點會偏移到較高溫221℃~228℃，所以在實際的製程中高溫熔融點要設定超過228℃。又無鉛錫球的熔融過程中若仍有液態助焊劑保護住錫球，則能提供較佳的表面張力環境，使熔融後的無鉛錫球會有較佳的外型和真圓度。

This study was performed to investigate the green package raw materials and the materials interworked. There are two sections in this study, the conventional package and chip scale package (CSP). And results are as follows.
Current surface finished applied was Sn85Pb5 to lead frame surface, this study we surveyed pure Sn, Sn/Bi and Sn/Cu three kinds of electrolyte for lead-free plating. After plating we verify quality related issue by visual inspection, plating thickness composition and adhesion, solderability, wettability, on board test and whisker monitoring. Based on this study result of pure Sn and Sn/Bi exhibited good performance that has possible to replace Sn/Pb for lead-free plating.
In CSP package we applied SnAg3.5Cu0.5 lead-free solder ball with two kinds of flux . Base on this study, it is clear that the typical melt transition of SnAg3.5Cu0.5 lead free solder ball should be at 218oC. In fact, during solder ball placement, the melt transition shift to higher temperature 221~228 oC, reflow peak temperature limitation should be over 228 oC. As lead-free solder ball melting, the remainder flux liquid cover the solder ball and provide a lower surface tension environment which affects the solder ball shape and roundness.

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