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研究生： 陳衍文
Chen, Yen-Wen
論文名稱： 低真空環境下濕度對印刷電路板材料機械性質影響之研究
Study on Hygro-Mechanical Behavior of Printed Circuit Board Materials in Rough Vacuum Environment
指導教授： 趙隆山
Chao, Long-Sun
學位類別： 碩士
Master
系所名稱： 工學院 - 工程科學系碩士在職專班
Department of Engineering Science (on the job class)
論文出版年： 2008
畢業學年度： 96
語文別： 中文
論文頁數： 96
中文關鍵詞： 分層 、爆米花 、低真空 、濕氣 、相對濕度 、機械性質
外文關鍵詞： Rough vacuum, Delamination, Moisture, Mechanical property, Relative humidity
相關次數： 點閱：163  下載：2 
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    • 水分含量是造成電子構裝基板脫層主要因子之一，本文採用低真空除濕之方式降低基板內水分並進行相關實驗。針對構裝基板常用之有機材料(FR4)、樹脂(BT)與軟式電路板(PI)進行討論，探討低真空中對基板吸收水分後其機械性質變化，並以嵌合曲線(Curve Fitting)描述各材料在特定濕度下的非線性應力.應變關係方程式，建立材料與濕度之相關特性資料。
    實驗結果顯示，代表水分含量之相對濕度會影響材料的機械性質，其楊氏模數和極限強度、特性常數k及硬化指數n會隨著濕度的上升而下降。本文所設計之低真空方式則具有抑制基板材料之吸濕的效果，可控制材料內水分含量並維持其機械性質之效果

    Moisture content is one of the primary factors for the delamination of printed circuit board. In this paper, the effects of humidity and rough vacuum on the moisture content of printed circuit board and its resulting mechanical properties are investigated. Fiberglass/epoxy laminate (FR-4), Bismaleimide Triacine (BT) and Polyimides (PI) are used as the testing materials, which are commonly used to manufacture printed circuit board. In the study, the moisture content data for different humidity under the circumstance of rough vacuum are established and the curve fitting formulas are used to describe the corresponding stress-strain relationships. The experimental results indicate that the amount of moisture content in the printed circuit board will affect the mechanical properties. The Yong’s modulus, strength limit, character constant (k) and hardening exponent (n) decrease as the moisture content increases. In this work, the designed container of rough vacuum could suppress the moisture absorption of the printed circuit board. Accordingly, it could control the moisture content in the printed circuit board and maintain the desired mechanical properties.

    摘 要 .................................................................................. I Abstract..................................................................................... II 誌 謝 .................................................................................. III 目 錄 ................................................................................. IV 表 目 錄 ................................................................................. VII 圖 目 錄 ................................................................................. IX 符號說明 ................................................................................. XIII 第一章 緒 論 ................................................................. 1 1.1 前 言 ................................................................... 1 1.2 文獻回顧 ................................................................... 3 1.3 研究動機 ................................................................... 7 1.4 組織章節 ................................................................... 7 第二章 濕氣與真空理論原理 ............................................... 8 2.1 濕氣吸收 ................................................................... 8 2.1.1 構裝體內濕氣擴散 .............................................. 8 2.1.2 構裝體濕熱效應與應力分析 ................................ 10 2.2 真空理論 .................................................................. 11 2.2.1 氣體動力學 .......................................................... 12 2.2.2 氣體平均自由動徑(mean free path) ...................... 12 2.2.3 真空中的釋氣及吸附作用 ..................................... 13 2.2.4 絕熱膨脹 .......................................................... 16 第三章 實驗設備與方法 .................................................... 17 3.1 實驗方法 ................................................................. 17 3.2 實驗設備 ................................................................. 18 3.2.1 熱風循環式烤箱 .................................................. 18 3.2.2 精密天平 ............................................................. 18 3.2.3 真空儲存桶 ......................................................... 18 3.2.4 加壓馬達 ............................................................. 20 3.2.5 溫濕度表及數字壓力表 ....................................... 20 3.2.6 小型儲存箱及乾燥劑 ........................................... 20 3.2.7 萬能材料試驗機 ................................................... 21 3.3 實驗材料簡介 ............................................................. 21 3.3.1環氧樹脂基板 ....................................................... 21 3.3.2 PI樹脂基板 .......................................................... 21 3.3.3 BT樹脂基板 ......................................................... 22 3.4 實驗過程 .................................................................... 22 3.4.1漏氣測試 ............................................................... 22 3.4.2真空儲存桶釋氣現象及乾燥劑率定 ....................... 22 3.4.3 去濕過程 .............................................................. 23 3.4.4 吸濕過程 .............................................................. 23 3.4.5 低真空吸濕過程 ................................................... 24 3.4.6 量測過程 .............................................................. 24 3.4.7 材料曲線分析 ........................…............................... 25 3.4.7.1 Power Law .........................…............................. 25 第四章 結果與討論 .................................................................. 27 4.1恆溫恆溼實驗討論 ........................................................... 27 4.2 材料靜態拉升實驗討論 .................................................. 28 4.2.1 FR.4 試片 ................................................................ 28 4.2.2 BT 試片 ................................................................... 29 4.2.3 PI 試片 .................................................................... 31 第五章 結論 ............................................................................. 33 參考文獻 ...........................................................….................... 34 圖表附件 .................................................................................. 38 表2.1 各真空壓力範圍內的特微(以20度C之空氣為例) ... 39 表3.1 真空桶內0.1.1.0atm釋氣現象(24℃,40%R.H.,真空後靜置1小時) .............................................................. 40 表3.2 真空桶內微壓滲透率(24℃,50%R.H, 168hrs) ............ 40 表3.3 真空桶內微壓滲透率(24℃, 50%R.H, 168hrs, 0.5g 乾燥劑) ...................................................................... 41 表3.4 FR.4 去濕過程(48小時) . .......................................... 41 表3.5 PI 去濕過程(48小時) ................................................ 42 表3.6 BT 去濕過程(48小時) ............................................... 42 表4.1 飽和濕氣含量比較表(40%.70%R.H, 24℃,常壓, 168hrs) ...................................................................... 43 表4.2 飽和濕氣含量比較表(40%.70%R.H, 24℃,低真空, 168hrs) ...................................................................... 43 表4.3 低真空抑制濕氣含量 (40%.70%R.H, 24℃,168hrs).. 44 表4.4 抑制吸濕含量比例 (40%.70%R.H, 24℃,168hrs)..... 44 表4.5 FR.4 於24℃, 40%R.H, 常壓, 機械性質 ................ 45 表4.6 FR.4 於24℃, 50%R.H, 常壓, 機械性質 ................ 45 表4.7 FR.4 於24℃, 60%R.H, 常壓, 機械性質 ................ 45 表4.8 FR.4 於24℃, 70%R.H, 常壓, 機械性質 ................ 46 表4.9 FR.4 於24℃, 40%R.H, 低真空, 機械性質 ............. 46 表4.10 FR.4 於24℃, 50%R.H, 低真空, 機械性質 ............. 46 表4.11 FR.4 於24℃, 60%R.H, 低真空, 機械性質 ............. 47 表4.12 FR.4 於24℃, 70%R.H, 低真空, 機械性質 .............. 47 表4.13 PI於24℃, 40%R.H, 常壓, 機械性質 ....................... 48 表4.14 PI於24℃, 50%R.H, 常壓, 機械性質 ....................... 49 表4.15 PI於24℃, 60%R.H, 常壓, 機械性質 ....................... 50 表4.16 PI於24℃, 70%R.H, 常壓, 機械性質 ....................... 51 表4.17 PI於24℃, 40%R.H, 低真空, 機械性質 ................... 52 表4.18 PI於24℃, 50%R.H, 低真空, 機械性質 ................... 53 表4.19 PI於24℃, 60%R.H, 低真空, 機械性質 ................... 54 表4.20 PI於24℃, 70%R.H, 低真空, 機械性質 ................... 55 表4.21 BT於24℃, 40%R.H, 常壓, 機械性質 ...................... 56 表4.22 BT於24℃, 50%R.H, 常壓, 機械性質 ...................... 56 表4.23 BT於24℃, 60%R.H, 常壓, 機械性質 ...................... 56 表4.24 BT於24℃, 70%R.H, 常壓, 機械性質 ...................... 57 表4.25 BT於24℃, 40%R.H, 低真空, 機械性質 .................. 57 表4.26 BT於24℃, 50%R.H, 低真空, 機械性質 .................. 57 表4.27 BT於24℃, 60%R.H, 低真空, 機械性質 .................. 58 表4.28 BT於24℃, 70%R.H, 低真空, 機械性質 .................. 58 圖1.1 脫層(Delamination) .................................................. 59 圖1.2 爆米花現象( Popcorn ) ............................................. 59 圖1.3 氣壓與抽氣時間關係圖 ............................................ 60 圖2.1 位能曲線示意圖 ...................................................…. 61 圖2.2 Langmuir之吸附等溫圖 …........................................ 61 圖3.1 熱風循環式烤箱 ..............…...................................... 62 圖3.2 精密天平 ...........................….................................... 62 圖3.3 自製低真空儲存桶構造圖1 ..….................................. 63 圖3.4 自製低真空儲存桶構造圖2 ....…................................ 63 圖3.5 自製低真空儲存桶實品 ............…............................. 64 圖3.6 加壓馬達及浸水試驗 ..................…........................... 64 圖3.7 溫濕度表 .......................................…........................ 65 圖3.8 數字壓力表(Dwyer.DPGA.00) ..........…..................... 66 圖3.9 小型儲存箱及乾燥劑 .........................….................... 66 圖3.10 萬能材料試驗機 ......................….............................. 67 圖3.11 基板材料試片尺寸示意圖 ..........…........................... 67 圖3.12 基板材料試片圖 ..........................….......................... 68 圖3.13 Power law 應力.應變曲線圖 .........…....................... 68 圖3.14 真空桶內0.1.1.0atm, 相對濕度變化圖(24℃,40%R.H,真空後靜置24小時) …..................... 69 圖3.15 真空桶內微壓滲透率 (24℃,50%R.H.168hrs) ......…. 69 圖3.16 真空桶內微壓滲透率(24℃, 50%R.H, 168hrs, 0.5g乾燥劑) .......................................................................... 70 圖3.17 試片材料損失水份表(48 小時) ................................... 70 圖4.1 FR.4 (40%.70%R.H) . 24℃, 常壓, 168hrs ................ 71 圖4.2 PI (40%.70%R.H) . 24℃, 常壓, 168hrs .................... 71 圖4.3 BT (40%.70%R.H) . 24℃,常壓, 168hrs ..................... 72 圖4.4 FR.4(40%.70%R.H).24℃, 低真空,168hrs ................. 72 圖4.5 PI (40%.70%R.H) .24℃,低真空, 168hrs .................... 73 圖4.6 BT (40%.70%R.H).24℃,低真空, 168hrs .................... 73 圖4.7 試片材料 40%R.H, 24℃, 常壓/低真空, 吸濕過程 ... .. 74 圖4.8 試片材料 50%R.H, 24℃, 常壓/低真空, 吸濕過程 ... 74 圖4.9 試片材料 60%R.H, 24℃, 常壓/低真空, 吸濕過程 ... 75 圖4.10 試片材料 70%R.H, 24℃, 常壓/低真空, 吸濕過程 ... 75 圖4.11 FR.4 40%R.H, 24℃, 常壓, 應力-應變曲線圖 ........ 76 圖4.12 FR.4 50%R.H, 24℃, 常壓, 應力-應變曲線圖 ........ 76 圖4.13 FR.4 60%R.H, 24℃, 常壓, 應力-應變曲線圖 ........ 77 圖4.14 FR.4 70%R.H, 24℃, 常壓, 應力-應變曲線圖 ........ 77 圖4.15 FR.4 40%R.H, 24℃, 低真空, 應力-應變曲線圖 ..... 78 圖4.16 FR.4 50%R.H, 24℃, 低真空, 應力-應變曲線圖 ..... 78 圖4.17 FR.4 60%R.H, 24℃, 低真空, 應力-應變曲線圖 ..... 79 圖4.18 FR.4 70%R.H, 24℃, 低真空, 應力-應變曲線圖 ..... 79 圖4.19 FR.4 試片最大應力與相對濕度關係圖 .................... 80 圖4.20 FR.4 試片楊氏模數與相對濕度關係圖 .................... 80 圖4.21 FR.4 試片於Instron 萬能材料試驗機上夾持照片 ... 81 圖4.22 FR.4 試片於Instron 萬能材料試驗機上斷裂照片 ... 81 圖4.23 PI 40%R.H, 24℃, 常壓, 應力-應變曲線圖 ........... 82 圖4.24 PI 50%R.H, 24℃, 常壓, 應力-應變曲線圖 ........... 82 圖4.25 PI 60%R.H, 24℃, 常壓, 應力-應變曲線圖 ........... 83 圖4.26 PI 70%R.H, 24℃, 常壓, 應力-應變曲線圖 ........... 83 圖4.27 PI 40%R.H, 24℃, 低真空, 應力-應變曲線圖 ........ 84 圖4.28 PI 50%R.H, 24℃, 低真空, 應力-應變曲線圖 ........ 84 圖4.29 PI 60%R.H, 24℃, 低真空, 應力-應變曲線圖 ........ 85 圖4.30 PI 70%R.H, 24℃, 低真空, 應力-應變曲線圖 ........ 85 圖4.31 PI 試片彈性極限強度與相對濕度關係圖 .................. 86 圖4.32 PI 試片楊氏模數與相對濕度關係圖 ......................... 86 圖4.33 PI 試片0.2%截距降伏強度與相對濕度關係圖 ........ 87 圖4.34 PI 試片k與相對濕度關係圖 ................................... 87 圖4.35 PI 試片n與相對濕度關係圖 ................................... 88 圖4.36 PI 試片於Instron 萬能材料試驗機上夾持照片 ...... 88 圖4.37 PI 試片於Instron 萬能材料試驗機上斷裂照片 ...... 89 圖4.38 BT 40%R.H, 24℃, 常壓, 應力-應變曲線圖 ......... 89 圖4.39 BT 50%R.H, 24℃, 常壓, 應力-應變曲線圖 ......... 90 圖4.40 BT 60%R.H, 24℃, 常壓, 應力-應變曲線圖 .......... 90 圖4.41 BT 70%R.H, 24℃, 常壓, 應力-應變曲線圖 .......... 91 圖4.42 BT 40%R.H, 24℃, 低真空, 應力-應變曲線圖 ....... 91 圖4.43 BT 50%R.H, 24℃, 低真空, 應力-應變曲線圖 ....... 92 圖4.44 BT 60%R.H, 24℃, 低真空, 應力-應變曲線圖 ....... 92 圖4.45 BT 70%R.H, 24℃, 低真空, 應力-應變曲線圖 ....... 93 圖4.46 BT 試片彈性極限強度與相對濕度關係圖 ..... ........... 93 圖4.47 BT 試片楊氏模數與相對濕度關係圖 ........ ............... 94 圖4.48 BT 試片k與相對濕度關係圖 .........................…..... 94 圖4.49 BT 試片n與相對濕度關係圖 ..........................….... 95 圖4.50 BT 試片於Instron 萬能材料試驗機上夾持照片 ..... 95 圖4.51 BT 試片於Instron 萬能材料試驗機上斷裂照片 ..... 96

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