在半導體IC封裝產業中，封膠材料(Epoxy Molding Compound, EMC)在熟化(Curing)的過程中會包覆電子晶片，整個過程中會與封裝模具表面產生結合，造成黏著的情況，稱之為黏著效應(Adhesion effects)；而黏著效應會影響整個產線的生產過程，如果黏著效應過大，則在IC成品脫模的時候產生表面破壞、成品缺角，進而導致封膠失敗、生產率降低、信賴度不佳等結果。所以如何在維持現有模具的設計下，藉由鍍層(Coating)以及表面處理(Surface treatment)來有效降低黏著效應的影響，是目前產業界及研究單位所重視的議題。
本論文將利用實驗室自行研究完成的自動化電子封裝黏模力檢測設備與量測技術，配合一組與實際封裝產線相當接近的製程參數，進行一系列的黏模力量測，在以往的研究中，量測試片的表面處理皆是作霧面處理(Matted surface treatment)居多，並且搭配不同鍍層下去作探討，本實驗除了繼續進行霧面處理的探討之外，還會探討經過鏡面處理(Mirror surface treatment)的量測試片，將兩者皆搭配不同的鍍層，去研究其黏模效應，並觀察封膠材料在量測試片表面的情況。
最後，本論文也將針對不同的鍍層以及表面處理進行400模次的長效性連續實驗，觀察其黏模力的趨勢，透過線性迴歸分析(Linear regression)將實驗數據擬合出一條黏模力特性曲線(Characteristic curve)，將實驗所擬合出來的特性曲線進行比較，觀察不同鍍層以及表面處理對封膠材料的黏著影響程度，找出最佳的清模時機，並且判斷可以有效降低黏著效應的原因。

In the IC packaging industry, epoxy molding compound (EMC) in the curing process covers electronic chips. It causes the adhesion phenomenon on the surface of packaging mold called adhesion effects. Adhesion effects influence the entire process in production line. If adhesion effect is too large, it destroys the surface of IC productions during mold release and lead to the failure of IC packaging, low productivity, poor reliability, etc. Therefore, the current issues which in industry and research department are how to maintain existing mold design and use coating and surface treatment to decrease adhesion effects. This thesis will use adhesion force equipment by automation electronic packaging and measurement techniques which complete by our laboratory. We work with a set of process parameters which is close to the actual packaging line, and do a series of adhesion force testing. In previous research, the surfaces of specimen are in the matted surface treatment majority and collocate different coating. In addition to research of matted surface treatment, this research will investigate mirror surface treatment, too. The both specimens are collocated with different coating to do research and observe the surface condition of specimens. In the end, this thesis also carries out the continuous experiments on different coatings and surface treatment and observes the trend of adhesion force. Through the analysis of linear regression, the experiment results will be adapted a characteristic curve of adhesion force and then we will compare it to observe the degree which different coating and surface treatment on adhesion effect. According to experiment results, we find the best clean time on mold and judge the reasons which can reduce adhesion effects.

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