| 研究生: |
林昆眾 Lin, Kun-Zhong |
|---|---|
| 論文名稱: |
引入ESG探討台灣半導體產業的企業韌性效率 Incorporating ESG Factors to Explore Corporate Resilience Efficiency in the Taiwanese Semiconductor Industry |
| 指導教授: |
林泰宇
Lin, Tai-Yu 江宣怡 Jiang, Syuan-Yi |
| 學位類別: |
碩士 Master |
| 系所名稱: |
管理學院 - 企業管理學系 Department of Business Administration |
| 論文出版年: | 2026 |
| 畢業學年度: | 114 |
| 語文別: | 英文 |
| 論文頁數: | 138 |
| 中文關鍵詞: | 半導體產業 、企業韌性 、ESG 、資料包絡分析法 (DEA) 、效率分析 |
| 外文關鍵詞: | Semiconductor Industry, Corporate Resilience, ESG, Data Envelopment Analysis (DEA), Efficiency Analysis |
| 相關次數: | 點閱:30 下載:0 |
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隨著全球不確定性事件如Covid-19疫情、地緣政治衝突及貿易禁令頻發,半導體產業作為全球經濟命脈,其應對衝擊的「企業韌性」已成為經營重要核心 ,同時,環境、社會與公司治理(ESG)亦躍升為企業培養長期競爭力的關鍵指標 。然而,現有文獻多聚焦於供應鏈韌性或 ESG 與韌性的簡單相關性,鮮少針對半導體產業進行微觀層次的韌性效率分析。
本研究旨在分析台灣58家半導體企業在ESG實踐背景下的企業韌性效率表現 ,研究採用二階段資料包絡分析法之RDM DDF模型 ,將企業運作區分為「經營階段」與「企業韌性階段」。在變數設計上,本研究突破以往研究衡量韌性的限制,將其細分為抵抗力、獲益力、存續力與復原力四大面向,以求全面體現韌性內涵。
實證結果顯示:第一,2021年至2024年間,58家樣本公司的總效率平均值為0.68,其中包含TSMC、MTK及ASEH等14家標竿企業在各年度均達到最佳效率。第二,從產業鏈位置看,上游族群在經營階段與總效率的綜合表現上顯著優於中、下游公司,顯示其在資源分配與韌性轉化能力上更具優勢。第三,經營階段的平均效率0.59低於總效率,且公司間差異較大,顯示多數企業在將員工投入轉化為經濟與永續績效ESG分數的過程中仍有提升空間。
本研究不僅填補了半導體產業在企業韌性效率分析上的文獻缺口,亦為管理者與政策制定者提供實務建議,強調企業應透過強化ESG績效與營運效率,多方面地建構抵禦外部不穩定環境的韌性基石。
Amidst frequent global uncertainties—including the COVID-19 pandemic, geopolitical conflicts, and trade bans—the "corporate resilience" of the semiconductor industry has become a core operational pillar for the global economy. Simultaneously, Environmental, Social, and Governance (ESG) criteria have emerged as key indicators for cultivating long-term competitiveness. However, existing literature primarily focuses on supply chain resilience or simple correlations between ESG and resilience, with limited micro-level analysis specifically targeting resilience efficiency within the semiconductor sector.
This study aims to analyze the corporate resilience efficiency of 58 Taiwanese semiconductor firms within the context of ESG practices. Utilizing a two-stage Data Envelopment Analysis (DEA) with the Range Adjusted Measure (RDM) Directional Distance Function (DDF) model, this research divides corporate operations into two stages: the "Operational Stage" and the "Corporate Resilience Stage." To overcome the limitations of traditional resilience measurements, the variable design is categorized into four dimensions—Resistance, Profitability, Survival, and Recovery—to provide a comprehensive representation of resilience.
The empirical results indicate: First, from 2021 to 2024, the average total efficiency of the 58 sample companies was 0.68, with 14 benchmark firms, including TSMC, MTK, and ASEH, consistently achieving optimal efficiency across all years. Second, from the perspective of the industry chain, upstream companies significantly outperformed midstream and downstream firms in both the operational stage and overall efficiency, demonstrating superior advantages in resource allocation and resilience transformation. Third, the average efficiency of the operational stage (0.59) was lower than the total efficiency, with significant variance among companies, suggesting that most firms still have room for improvement in converting employee input into economic and ESG performance.
This study not only fills the literature gap in corporate resilience efficiency analysis for the semiconductor industry but also provides practical recommendations for managers and policymakers, emphasizing that enterprises should build a cornerstone of resilience against external instability by strengthening both ESG performance and operational efficiency.
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