在電子IC構裝封膠製程中，封膠材料（EMC；Epoxy Molding Compound）在熟化成型過程中會與IC模具表面產生黏著的現象，稱之為黏著效應（Adhesion Effects）；而此黏著效應對於脫模作業過程會有所影響，甚至可能會造成封膠失敗、可靠度不佳與生產良率降低等結果。對於模具而言，黏著效應會造成產品脫模不易而影響產品的品質。所以如何在不影響現有模具設計前提下，能夠藉由適當的表面處理以及鍍膜選擇，來有效改善封裝生產線產能，是目前產業界及研究單位所重視的主題。
　　本論文針對此黏著效應，自行研發一套電子構裝黏著力的量測技術，用來量測膠體與模具表面之間的正向與剪向黏模力。本研究配合田口氏實驗設計法，針對影響IC封裝模具與塑料膠體間黏著力可控制之重要製程參數進行因子效應的研究，進而得知各製程參數控制因子對黏著效應的關係，其中模具的表面處理對黏模效應的貢獻度最大。此外，藉由觀察黏著力量變化的趨勢，希望可以找出黏著效應發生的原因，確實掌握清模時機，進而增加產能，解決黏模問題，以減少黏著效應所產生的不良影響。
關鍵詞：IC構裝、黏著效應、黏著力

　　In IC packaging, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion occurs in the interface between EMC and mold surface. Too large an adhesion force can damage an IC and lower the yield rate. Many parameters will affect the mold adhesion force. However, there was no report showing how to measure the mold adhesion force and discussing the effect of process parameters on the mold adhesion force.
　　This paper described the design and fabrication of an automatic EMC adhesion force test instrument that will measure adhesion force between mold surface and EMC. Several important parameters that affect the mold adhesion force in IC packaging process were also discussed in this paper. A series of experiments were done using the EMC adhesion force test instrument designed by ourselves. By using Taguchi’s method, one can determine what parameters are important for reducing the magnitude of adhesion force between EMC and mold surface.

Keyword: EMC, Mold Adhesion Force, Taguchi's Parameter Design

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