本研究為使用本研究團隊所開發的三維列印切層軟體為基底，成功將圖像轉換為BMP圖檔並利用Labview軟體影像判讀傳輸至Altera DE0開發板上，實際結合石膏粉末做成型列印。
本機器使用市面上可取得的Toshiba CA4壓電噴頭，使用Microchip dsPIC30F4011單晶片進行機台的控制，並搭配壓電噴頭驅動開發板，進行訊號傳輸以此達到壓電噴頭在三維平台上噴印成型。噴印實驗中，以UV膠與UV光做為噴印的材料及應用，測試與實驗後，以照射時間為3秒鐘、層厚為0.06mm做為一層列印的標準，可以把翹曲的問題很明顯的解決，最後成功印製出50mm*50mm*3mm的三維模型。
這項技術未來可以運在不同粉末上面，如金屬粉末、陶瓷粉末等等，可以提升材料的多元性進而擴展到航太業、汽車工業、生醫產業等等應用，這一系列的開發有助於促進產業的提升與發展。

This research is based on the three-dimensional slicing which was developed by our research group, converting image files to BMP image files. Convert image which identified by Labview to Altera DE0 and combine plaster powder to do the printing process.
The machine uses Toshiba CA4 piezoelectric nozzle. Integrating microchip dsPIC30F4011 which is used to control the machine and piezoelectric nozzle drives the board for signal transmission to achieve 3D printing by using piezoelectric nozzle. In the experiment, using UV-curable resin and UV light as the materials and application. It is successful to improve warping problems obviously and to print the 50 mm*50 mm*3 mm 3D model by setting 3 seconds irradiation time and 0.06mm thickness as a layer to print one page.
In the future, the technique is able to apply the different type of powder such as metallic powder, ceramic powder, etc. Due to the diversity of the material, it could apply to other territories like aerospace industry, automobile industry, biomedical industry, etc. The series research is favor of promoting industry’s development.

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