本論文為PC-Based即時影像伺服自動化微組裝系統，搭配影像演算法，發展自動化微組裝系統，系統主要分為影像系統、微物件安置與定位系統及微組裝系統三大部份。
系統以工業電腦並搭配LabVIEW做為人機介面發展軟體，該軟體提供相當友善的圖形化人機介面，系統藉LabVIEW整合三個子系統。首先為影像系統，為改善置物平台光場以透光平台提高影像辨識度，省去影像前處理減少運算時間，達到即時影像伺服，應用曲線擬合區域邊緣統計演算法與樣板比對達成影像定位控制，並透過光場與影子之關係發展出單CCD三維空間之定位。接著為微物件安置與定位系統，以操縱器安置並定位微物件，操縱器外型為圓錐狀，尖端直徑為150μm，利用狀態機對各個狀態的監控，經由狀態的轉換有效的安置與定位微物件。最後為微組裝系統部份，利用PU材料以準分子雷射加工，製造出微夾持器，其尺寸約為546x669x100μm3，並以壓電致動器驅動的撓性微夾持器，以夾持圓柱型微物件直徑約為60~90μm，可搬運並執行組裝任務。
本研究成功的安置並定位微物件，並且成功的以影像識別自動化組裝，物件直徑88μm，組合件孔徑100μm，其間隙比為0.12。

In this paper, A PC-Based real-time visual-servo automatic microassembly system was developed and tested, the system is composed of three systems, which are visual-servo system, micro object alignment system and microassembly system.
The system is developed on the industrial computer with LabVIEW man-machine interface software, the software provides friendly GUI, the system integrates three subsystems through LabVIEW. The first one is the visual-servo system, the object stage of light field is improving, and then to improve the image recognition and reduce operational time of image pretreatment and the image servo achieved real-time, the image positioning control applies the RES with curve fitting and template matching, developing the single-CCD three-dimensional positioning through light field and the shadow of relationship. Next is the micro object alignment system, using the manipulation to alignment and position micro object, the shaped of manipulation is cone and the tip diameter is about 150μm, the state machine monitors individual states, through the states transition effectively align and position objects. At last is microassembly system, the tool of object transport system is utilizing a piezo-drived compliant micro gripper with size of 669×546×100μm3, which can grasp the thin cylinder with diameter 60~90μm, so can move and assemble tasks.
The research achieved to supply alignment and positioning micro object, and automatically assembly through visual-servo, the peg size of the diameter is 88μm, the hole size of the diameter is 100μm, that clearance ration is 0.12.

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