| 研究生: |
陳冠龍 Chen, Kuan-Lung |
|---|---|
| 論文名稱: |
靜電放電耐受測試與試驗環境特性之關係分析探討 Relation Analysis of Electrostatic Discharge Immunity Tests and Testing Environment Characteristics |
| 指導教授: |
黃世杰
Huang, Shyh-Jier |
| 學位類別: |
碩士 Master |
| 系所名稱: |
電機資訊學院 - 電機工程學系碩士在職專班 Department of Electrical Engineering (on the job class) |
| 論文出版年: | 2017 |
| 畢業學年度: | 106 |
| 語文別: | 中文 |
| 論文頁數: | 67 |
| 中文關鍵詞: | 靜電放電耐受測試 、水平耦合面 、電容效應 |
| 外文關鍵詞: | electrostatic discharge immunity test, horizontal coupling plane, capacitance effect |
| 相關次數: | 點閱:53 下載:7 |
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本論文針對電磁相容之靜電放電耐受測試環境提出分析建議,此乃考量現今電子產品日益精密,但卻容易受到靜電干擾,因此務須審慎進行測試,而肇因於測試進行中之不同環境,其中包括洩放電阻接地位置、靜電電壓激發點、不同接地情形以及水平耦合板間的電容效應,均可能影響測試結果,故本文即基於測試環境之一致性,致力建構一套實際測試系統,並且詳以監控記錄水平耦合板電壓暨分別探討接地點及電壓激發點之變動,同時觀察水平耦合板電壓變化以及探討周邊儀器造成之電容效應,進而彙整評估靜電耐受測試與試驗環境之特性關係。兹由測試結果分析可知,本文所提方法確已含括測試環境布建時之整體考量,頗有助於降低測試過程之不確定度,預將有助於靜電測試相關產業參考施行。
This thesis is focused on the analysis and suggestion for the environment of electrostatic discharge immunity tests in electromagnetic compatibility. The study is motivated because modern electronic products becomes more sophisticated that are susceptible to electrostatic interferences, meanwhile manifesting the importance of electrostatic tests before marketing. Yet, it is found that different testing environments such as the grounding location of resistance, the electrostatic discharge excitation point, the grounding conditions, and the capacitance effects between horizontal coupling planes, may all affect the testing outcome. Therefore, by considering reaching the consistence of testing environment, the thesis is devoted to constructing a practical testing system, by which the voltage of horizontal coupling plane is closely monitored and the changes in the grounding points along with the discharge excitation points are well investigated. In the mean time, the voltage changes of horizontal coupling plane and the capacitance effect caused by the surrounding instruments are also prudently analyzed, through which the relations between electrostatic discharge immunity tests and environment characteristics are extensively collected and assessed. The assessment results gained from different test scenarios help validate the overall consideration contributed by this proposed testing system, thereby assisting in the reduction of uncertainty during the testing process and serving as beneficial references for electrostatic testing industry applications.
[1] IEC Publication, “Electromagnetic Compatibility (EMC) – Part 4-2: Testing and Measurement Techniques – Electrostatic Discharge Immunity Test,” 2008.
[2] BSI Standards Publication, “Information Technology Equipment – Immunity Characteristics – Limits and Methods of Measurement,” 2015.
[3] N. A. Thomson, Y. Xiu, and E. Rosenbaum, “Soft-Failures Induced by System-Level ESD,” IEEE Transactions on Device and Materials Reliability, Vol. 17, No. 1, pp. 90-98, March 2017.
[4] A. Boyer, S. Ben Dhia, C. Lemoine, and B. Vrignon, “Characterizing Integrated Circuit Susceptibility with On-Chip Sensors,” Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, Singapore, pp. 73-76, May 2012.
[5] J. H. Jin, C. P. Jeon, J. H. Kim, and Y. C. Hwang, “System-level ESD Failure Analysis Depending on Source Generators,” Asia Pacific International Symposium on Electromagnetic Compatibility, Shenzhen, China, pp. 289-291, May 2016.
[6] J. Koo, Q. Cai, D. Pommerenke, K. Wang, J. Mass, M. Hirata, and A. Martwick, “The Repeatability of System Level ESD Test and Relevant ESD Generator Parameters,” International Symposium on Electromagnetic Compatibility, Detroit, USA, pp. 1-6, August 2008.
[7] J. Zhou, S. Shinde, Y. Guo, A. Talebzadeh, S. Marathe, Y. Gan, K. H. Kim, and D. Pommerenke, “IEC 61000-4-2 ESD Test in Display Down Configurationfor Cell Phones,” International Symposium on Electromagnetic Compatibility, Ottawa, Canada, pp. 713-718, July 2016.
[8] K. Soohoo and M. Wielgos, “Case Study of Product Defects Found by Air Discharge Mode ESD but Missed by Contact ESD,” Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, Singapore, Singapore, pp. 136-139, May 2008.
[9] I. Mori and and O. Fujieara, “Severity Evaluation of Immunity Test for Air and Contact Discharges of ESD Generators,” Asia-Pacific Conference on Environmental Electromagnetics, Xian, China, pp. 110-113, September 2009.
[10] J. Koo, Q. Cai, K. Wang, J. Maas, T. Takahashi, A. Martwick, and D. Pommerenke, “Correlation Between EUT Failure Levels and ESD Generator Parameters,” IEEE Transactions on Electromagnetic Compatibility, Vol. 50, No. 4, pp. 794-801, November 2008.
[11] S. C. Lou, F. M. Ruan, M. Su, T. Wang, H. Wang, W. J. Xiao, and Q. J. Zhi, “Gap Detecting System Design for Measurement System ofNon-contact Electrostatic Discharge,” International Conference on Anti-counterfeiting, Security, and Identification, Xiamen, China, pp. 83-85, September 2016.
[12] Z. Li, P. Maheshwari, and D. J. Pommerenke, “Measurement Methodology for Field-Coupled Soft Errors Induced By Electrostatic Discharge,” IEEE Transactions on Electromagnetic Compatibility, Vol. 58, No. 3, pp. 701-708, June 2016.
[13] J. Zhang, X. Li, R. Moseley, D. Pommerenke, and D. G. Beetner, “Predicting Field Coupling to an IC Using Measured Coupling Factors,” IEEE Transactions on Electromagnetic Compatibility, Vol. 56, No. 6, pp. 1287-1294, December 2014.
[14] A. Mircea-Emilian and N. Paul, “Experimental Determination of the ESD Immunity of Some Electronic Equipment,” International Conference on Applied and Theoretical Electricity, Craiova, Romania, pp. 1-5, October 2016.
[15] F. M. Ruan, X. L. Wang, H. Y. Wang, F. Zhou, and T. Dlugosz, “Analysis of Discrete Property of Electrostatic Discharge with Moving Electrode,” International Symposium on Electromagnetic Compatibility, York, UK, pp. 464-467, September 2011.
[16] J. Xiao, D. Pommerenke, J. L. Drewniak, H. Shumiya, J. Maeshima, T. Yamada, and K. Araki, “Model of Secondary ESD for a Portable Electronic Product,” IEEE Transactions on Electromagnetic Compatibility, Vol. 54, No. 3, pp. 546-555, June 2012.
[17] K. H. Oh, J. H. Chun, K. Banerjee', C. Duvvury, and R. W. Dutton, “Modeling of Temperature Dependent Contact Resistance for Analysis of ESD Reliability,” Annual International Reliability Physics Symposium Proceedings, Dallas, USA, pp. 249-255, April 2003.
[18] X. X. Liu, F. M. Ruan, J. H. Zhang, T. Dlugosz, W. J. Xiao, X. P. Xun, X. H. Yang, X. J. You, Y. Y. Jiang, and E. P. Chen, “Effect Analysis of Relative Humidity on Non-contacted Electrostatic Discharge,” Asia-Pacific Conference on Environmental Electromagnetics, Hangzhou, China, pp. 221-224, November 2015.
[19] F. Wan, J. X. Ge, and D. Pommerenke, “Absolute Humidity, Relative Humidity: Which Is More Important In Representing Severity of Electrostatic Discharge,” Electronics Letters, Vol. 49, Iss. 23, pp. 1451-1452, December 2013.
[20] Z. Fu, Y. F. Qiu, H. N. Chen,W. J. Xiao,F. M. Ruan, T. Dloguzs, C. Zhang, X. X. Liu, X. H. Yang, J. H. Zhang, X. J. You, Y. Y. Jiang, and B. X. Gong, “Humidity Detecting System Design for New Measurement System of Electrostatic Discharge,” Asia-Pacific Conference on Environmental Electromagnetics, Hangzhou, China, pp. 258-261, November 2015.
[21] C. Zhang, Y. F. Qiu, F. M. Ruan, W. J. Xiao, D. Pommerenke, X. H. Yang, and X. J. You, “Automatic Control Process Analysis of Gas Pressure in Electrostatic Discharge Measurement System,” Asia-Pacific Conference on Environmental Electromagnetics, Hangzhou, China, pp. 202-205, November 2015.
[22] T. Ohtsu and K. Sagisaka, “Study on Discharge Characteristics of the ESD Protection Material and the Effect of Protection Element,” Asia-Pacific International Symposium on Electromagnetic Compatibility, Shenzhen, China, pp. 426-428, May 2016.
[23] F. Liu, X. G. Gao, X. Xiang, X. Z. Huang, and Z. W. Liu, “Design of Radiation-hardened ESD Protection for RS485 Drivers,” International Nanoelectronics Conference, Chengdu, China, pp. 1-2, May 2016.
[24] D.A. Case, “The Role of Individual Certification for EMC Engineers and Technicians,” International Symposium on Electromagnetic Compatibility, Atlanta, USA, pp. 444-446, August 1995.
[25] B. Oana and B. Razvan, “3D Assessment of ESD Field Level for Protection Devices Safety,” International Symposium on Advanced Topics in Electrical Engineering, Bucharest, Romania, pp. 354-357, March 2017.
[26] J. Liu, Z. L. Tan, and L. Ni, “Immunity Model Study on Irradiation Effect of Electrostatic Electromagnetic Pulses,” International Conference on Computer Design and Appliations, Qinhuangdao, China, pp. 146-149, June 2010.
[27] C. Ji, D. Anzai, J. Wang, I. Mori, and O. Fujiwara, “A Case Study on ESD Immunity Test for a Small-Type Control Board,” International Symposium on Electromagnetic Compatibility, Tokyo, Japan, pp. 725-728, May 2014.