本研究是於超高真空系統中，藉由程序控溫反應/脫附(Temperature-programmed reaction/desorption，TPR/D)、X-光光電子譜(X-ray Photoelectron Spectroscopy，XPS)及近緣X-光吸收細微結構 (Near Edge X-ray Absorption Fine Structure, NEXAFS)探討2,3-二溴吡啶(2,3-dibromopyridine，C5NBr2H3)在銅(100)表面上的吸附及熱反應。
TPR/D得知，2,3-dibromopyridine/Cu(100)的單層與多層分子脫附峰溫度分別為270 K和220 K。XPS的證據顯示C5NBr2H3→C5NBrH3→C5NH3逐步斷C-Br鍵的過程。110 K的低溫C-Br鍵就會開始斷裂，並於400 K完全解離。C5NH3中間物在表面上會穩定存在至約480 K才開始斷C-H鍵。C5NH3熱分解會產生H2 (650 K)、HCN (676 K, 872 K)、HBr (686 K)及C2N2 (842 K)的脫附產物。NEXAFS的結果顯示推測C5NBr2H3、 C5NBrH3或C5NH3的環面與表面的夾角在45-55o之間。

The adsorption and thermal reactions of 2,3-dibromopyridine on Cu(100) in ultra-high vacuum system have been studied using the surface techniques of temperature-programmed reaction/desorption (TPR/D), x-ray photoelectron spectrocopy (XPS) and near edge x-ray absorption fine structure (NEXAFS).
The TPR/D study shows that the molecular desorption from the multilayer amd monolayer occurs at 270 K and 220 K. The XPS evidence reveals the stepwise C-Brdisoociation of C5NBr2H3→C5NBrH3→C5NH3. The C-Br bond of C5NBr2H3 can be broken at 110 K, but is completed prior to 400 K. The C5NH3 is stable upto 480 K and then dissociates by C-H scission. Thermal decomposition of C5NH3 causes the desorption of H2 (650 K), HCN (676 K, 872 K), HBr (686 K) and C2N2 (842 K). NEXAFS suggests that the angle between the aromatic plane of C5NBr2H3,C5NBrH3 or C5NH3 and the copper surface is at 45-55o.

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