近年來低尺度奈米結構如奈米碳管和奈米薄膜，因具有獨特的尺寸效應、奈米尺寸等優點，，因此已漸被應用於微奈米電子及機電系統中。然因高功能及高效能的需求造成系統元件功率的大幅增加更由於高攜帶性極高電性效能的要求使得原件尺寸日益微縮，因此系統元件走向高功率密度的趨勢。高功率密度不可避免帶來高溫，高溫可能改變材料之物理性質，且降低電子元件的電性品質。因此，奈米材料之熱機械及熱力性質與熱力行為對其工業應用有重大的影響。文獻上，針對奈米材料溫度特性模擬常採用分子動力學法搭配定原子數、定體積及定溫熱容法。這些熱容法源自於不考慮原子間的交互作用力之單原子氣體模型，不同於稀薄氣體，強鍵結系統(如分子、晶體及固體)原子間的交互作用力並不可忽略。分子動力學中，其速度為隨機分佈且平衡時將滿足馬克斯威爾分佈，而在模型建立過程中，是以氣體動力學為基礎。當建立模型並非為氣體時，其速度分佈是否仍符合馬克斯威爾分佈是想得知的部分。文獻指出，在不同壓力下的材料熔點皆為不同。除了壓力對熔點溫度的影響之外，透過拉伸行為來觀察薄膜的熔點變化。

Due to the improved manufacturing techniques, the applications of nano-materials in various electronic devices have become more and more popular. Since the temperature cycles are usually involved in the production process, it is important to understand the thermal properties of nano-materials (ex: nano-film and nano-carbon-tube) so that the designers could have appropriate guideline for device design. Hence, this research is aim to explore the size and difference dimensions of nano-materials effects on the thermal properties and melting temperature and research the velocity of copper cubic and nano-carbon-tube for using molecular dynamics methods.

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