打線接合為目前最主流的封裝製程，其中使用鋁導線的封裝成本較低。然而過去使用鋁導線時，即因鋁的電遷移阻抗較低、延性偏低等因素，而限制其應用端。因此，本研究利用鋅添加、熱處理與表面處理，以改善鋁導線的性能，並擴展鋁線的應用層面。
本研究所使用的導線材料為Al-3Zn-0.3Si (AZS303) 與Al-7Zn-0.3Si (AZS703)，其中AZS303另經表面鍍金製程製成AC-AZS303導線。三者進行分別進行300℃、400℃與500℃之30分鐘熱處理後發現，500℃熱處理會使AC-AZS303表面鍍金層發生反應，而經400℃熱處理即能有效提升線材延性。
氯化試驗為利用飽和之氯化鈉水溶液，將AZS303、AC-AZS303、AZS703與H400-AZS303 (經400℃ 30分鐘熱處理之AZS303) 於常溫下分別進行一、二、四小時之浸泡，結果顯示表面鍍金處理並無法幫助鋁導線提升抗氯抗性，而400℃ 30分鐘熱處理與AZS703均有抑制氯化環境下其機械性質劣化的趨勢。
打線接合試驗則是分別進行AZS303、AZS703與H400-AZS303之第二銲點打線接合之後，量測其接合強度與拉力測試後之痕跡 (Footprint) 觀察，H400-AZS303之接合強度與接合情形均為三者中最佳者，顯示其具有良好之接合性，可應用於打線接合。

Applying aluminum wire for the consideration of cost reduction, wire bonding is a dominative interconnection technique of electronic packaging industry nowadays. However, the application of aluminum wire has been confined due to its low electromigration resistance and poor ductility over the past few decades. As a result, in this study, the drawbacks of aluminum wire mentioned above are improved by zinc addition, heat treatment and surface modification for expanding its application.
The wire materials used in this study consist of AZS303 wire and AZS703 wire. The AZS303 wire was coated with a thin layer of gold in addition. After all the three wires were applied with 300℃, 400℃ and 500℃ heat treatment for 30 minutes respectively, we found that the coating of AC-AZS303 would react in the condition of 500℃ heat treatment, and the temperature of 400℃ is adequate for enhancing the ductility of aluminum wire.
For chlorination test, we immersed AZS303, AC-AZS303, AZS703 and H400-AZS303 in the saturated brine for 1 hour, 2 hours, and 4 hours at room temperature respectively. The result shows that the chlorination resistance was not enhanced by coating a thin film of gold. Both H400-AZS303 and AZS703 show the potential of inhibiting the corrosion of chlorination.
After bonding with AZS303, AZS703 and H400-AZS303 wire, the result of measuring their bonding strength by pull test and observing their footprints after pull test shows that H400 AZS303 performed the best bonding of all, and it is suitable for wire bonding process.

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