研究使用幾丁聚醣為基材，利用三聚磷酸鹽以及氫氧化鈉將其製備為膠體以及薄膜，經由冷凍乾燥後可以將膠體以及薄膜乾燥。乾燥後的幾丁聚糖膠體直徑為3 mm而薄膜的厚度為2 mm。乾燥後的膠體以及薄膜接著置於微波電漿改質機台中進行氨氣或氬氣的改質。首先，藉由化學分析電子光譜儀可以觀察到經由氨氣電漿改質的薄膜，其化學結構上的改變。接著，經由感應式偶合電漿質譜儀可以分析幾丁聚糖膠體對於低濃度的銅離子以及鎳離子的吸附特性。而完成吸附的膠體可以藉由1 M的硫酸進行脫附反應並以感應式偶合電漿質譜分析儀進行分析。最後，由以上的實驗可以得到電漿改質對於幾丁聚糖膠體在吸附以及脫附能力上的影響。實驗結果顯示以2%的幾丁聚醣-醋酸溶液滴入2 g氫氧化鈉以及2 g的三聚磷酸鹽中成形的幾丁聚糖膠體可以在較短的時間內成形。依據感應式偶合電漿質譜分析儀定量金屬吸附實驗的結果可以得到幾丁聚醣膠體對於銅離子的吸附選擇性大於鎳離子，而幾丁聚醣膠體在pH 5.1環境時的吸附量大於在pH 2.1。比較電漿改質對於幾丁聚醣膠體吸附的影響可以發現經由氨氣電漿改質後其吸附速率大於氬氣電漿改質以及未改質的幾丁聚醣膠體。由化學分析電子光譜儀可以發現幾丁聚醣在吸附金屬後，可以於金屬的束縛能位置(銅: 933.1 eV；鎳:852.5 eV)發現峰值，如此可以得知金屬被幾丁聚醣所吸附。比較氨氣電漿改質以及未改質的幾丁聚醣可以發現10秒氨氣電漿改質後的幾丁聚醣其N/C比增加10%，因此推論藉由氨氣電漿改質所增加的氮含量為促進幾丁聚醣膠體吸附速度的原因。對於完成吸附的幾丁聚醣膠體進行脫附實驗可以發現經由氨氣電漿改質與未經電漿改質之膠體均可以脫附60%以上的金屬離子。

In this study, chitosan was prepared in a form of hydrogel bead and of thin film using tripolyphosphate and sodium hydroxide as the cross-linking agent. The as-prepared chitosan hydrogel beads and films were then frozen and dried. Beads with a rough diameter of 3 mm and films with a thickness of 2 mm were thereafter obtained. The dried chitosan beads and films were furthermore modified by either argon or ammonia plasma. New chemical structures on the plasma-modified chitosan film were measured using XPS (X-ray Photoelectron Spectroscopy). The low concentration copper or nickel-ions containing solution was used for the evaluation of beads’ adsorption characteristic and analyzed by ICP-MS (Inductively Coupled Plasma/Mass Spectroscopy). Desorption rate of the post-adsorption beads was conducted in 1 M sulfuric acid, while the change of low concentration metal ions was also analyzed by ICP-MS. The adsorption-desorption effect of the plasma-modified chitosan-containing beads was thereafter discussed. Experimental results exhibited that the formation of hydrogel beads was completed within short preparation time using 2% chitosan-acetic acid solution in 2 g of tripolyphosphate and 2 g of sodium hydroxide. The as-prepared chitosan hydrogel beads were capable to adsorb more copper ions, in comparison with nickel ions. At the same time, the adsorption capacity exhibited higher at the pH value of 5.1 than that of 2.1, while ammonia plasma treatment is much efficient than argon plasma treatment on the adsorption rate of the plasma-modified chitosan hydrogel beads. From XPS, metallic species could be found on the chitosan hydrogel film at the binding energies of 933.1 eV for the copper-N bond and 852.5 eV for the nickel-N bond, which showed the presence of metal ions on chitosan. The N/C ratio increased 10% after 10 sec of ammonia plasma treatment. The increase of nitrogen content on the ammonia plasma treated chitosan resulted in the increase of ion adsorption rate. Desotpion rate of the ion-containing samples was capable to reach 60% by adding 1 M sulfuric acid.

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