本研究的目的為探討Sn-Ag基底無鉛銲料( Sn-3.5Ag、Sn-3Ag 0.5Cu、Sn-3Ag-2Sb與Sn-3Ag-2Sb-3In )與銅銲接後，銲點內部微結構、硬度、界面IMC層厚度與結合強度之差異；並討論測試溫度、應變率與高溫時效對銲點結合強度與破壞模式的影響，以評估各銲料之銲點機械性質與抗熱性之優劣。
研究結果顯示，與Sn-3.5Ag銲料相較之下，添加Cu元素能提升銲料機械性質，但於As-soldered狀態時即具有較厚之界面IMC層，且經高溫時效後會有大量Cu6Sn5化合物形成。添加Sb元素能有效抑制組織受熱粗大化的現象與界面IMC層之成長。Sn-3Ag-2Sb-3In銲點中In元素會固溶於界面IMC層中形成Cu6(Sn,In)5，且經高溫時效後界面IMC層會大幅成長。
於拉伸試驗中顯示銲點結合強度會隨測試溫度上升而下降，隨應變率變快而上升。於As-soldered狀態下，大多以Sn-3Ag-2Sb-3In銲點結合強度為最高，其後依序為Sn-3Ag-2Sb、Sn-3Ag-0.5Cu與Sn-3.5Ag。經150°C ×625hrs高溫時效後所有銲點結合強度皆呈下降趨勢，其中又以Sn-3Ag-2Sb-3In銲點結合強度下降幅度最大，而Sn-3Ag-2Sb銲點擁有最高的結合強度。
隨著測試溫度上升與應變率的減緩，破壞模式會從斷裂於銲料內部之延性破壞轉換成斷裂於界面處且同時包括延性與脆性兩種破壞模式的混合型，推測其主要原因與慢應變率會降低銲料拉伸變形時之應變硬化效應與測試溫度會造成銲料軟化有關。試件經高溫時效後破壞模式皆呈現混合型。
綜合本研究討論結果顯示銲點界面IMC層厚度、硬度、測試溫度與應變率對於結合強度及破壞模式都有很大的影響，且研究結果顯示Sn-3Ag-2Sb銲料具有最佳之抗熱性與良好機械性質。

This research evaluates the microstructure, microhardness, adhesive strength, and the thickness of interfacial intermetallic compound layer of Sn-Ag-X/Cu (Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3Ag-2Sb, Sn-3Ag-2Sb-3In) solder joints. After thermal aging at 150°C for 625 h, the tensile tests were carried out at 25, 75, 125°C and strain rate ranging was 2.78×10-2 - 2.78×10-4 s-1 to study the effects of thermal aging, testing temperature and strain rate on adhesive strength of solder joints.
Adding 0.5 wt.% Cu to Sn-3Ag solder can strengthen the solder material, but in as-soldered condition the interfacial IMC layer of Sn-3Ag-0.5Cu/Cu is more thicker than other solder joints. Adding 2 wt.% Sb can depress the IMCs from coarsening. Sn atoms in Ag3Sn and Cu6Sn5 compound are substituted by In atoms in Sn-3Ag-2Sb-3In solder alloy, and the interfacial IMC layer grown rapidly after thermal aging.
Experimental results show that the adhesive strength of solder joints decreased with increasing temperature and decreasing strain rate. In the as-soldered condition, the adhesive strength of Sn-3Ag-2Sb-3In/Cu solder joints was almost higher than other solder joints. After 150°C for 625 thermal aging, the adhesive strength of all solder joints decreased. The adhesive strength of Sn-3Ag-2Sb-3In/Cu solder joints decreased seriously, and Sn-3Ag-2Sb/Cu solder joints show the highest adhesive strength.
When the testing temperature increased or the strain rate decreased, the fracture behavior of solder joints would chang from ductile mode to mix mode (combination of both ductile and brittle modes), with testing temperature increasing and strain rate decreasing. This phenomenon may be attributed to the strain hardening and thermal softening of solder. After 150°C for 625 h thermal aging, all samples presented mix mode.
This study shows that the adhesive strength and fracture mode of solder joints are strongly affected by variable interfacial IMC layer, microhardness of solder, testing temperature and strain rate. In this study the Sn-3Ag-2Sb/Cu solder joints has better mechanical properties, it has relations with that Sn-3Ag-2Sb has nice thermal resistance.

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