雖然LIGA製程、類LIGA製程已發展多年，但是，微結構多為平面基板的三維微結構，對於製作曲面基板的微結構製程探討並不多。本研究即是以微機電系統的製造技術—類LIGA製程的UV-LIGA製程技術，在曲面基板上製作出光阻微結構，經微電鑄製程後，翻模出具微結構的鎳金屬模仁，製作出適用於微射出成型的曲面模仁。實驗以壓克力、不鏽鋼板、鋁基板和鍍鎳鋁基材作為基板，將各材質基板加工為三種不同的曲面，其曲面半徑分別為150mm、130mm和100mm，以乾膜光阻於曲面基板上製作出高度為110μm圓柱狀微結構，再配合鎳微電鑄製程，翻模出射出成型用金屬模仁。本研究主要在改善製作曲面金屬模仁的製程：比較溼式光阻和乾膜光阻在曲面基板上使用的限制和優缺點，並改善、解決乾膜光阻在微影製程時產生的問題，以及曲面基板在微電鑄時產生的現象探討，並以ANSYS作微電鑄實驗的電場分析，將模擬結果和實驗結果做比較。

Although LIGA process and LIGA-Like process have been developed for many years, most microstructures are defined and fabricated on planar substrates. There are few research focusing on micro structures with curved substrates. In this study, UV-LIGA technique is used to pattern photoresist microstructures on a curved substrate. By using micro electroforming process, molds with microstructures on curved surface can be fabricated for the process of micro-injection molding. In this experiment, the substrate materials including PMMA, stainless steel, aluminum and nickel plating are studied. Three different curvatures, 150mm, 130mm and 100 mm are employed respectively. By pasting the dry film photoresist and using micro electroforming process, we could form mold inserts for micro-injection molding. The objective of this research is to investigate the related parameters of processes, such as comparing the dry and wet film photoresist on the curved substrates, solving the problems caused by dry film photoresist on a curve surface during lithography process, discussing the phenomena of curved substrates electroforming, analyzing electric field by ANSYS, comparing the electroforming results of simulations and experiments.

[1]陳建人, “微機電系統技術與應用”, 行政院國家科學委員會精密儀器發展中心, 民國92年7月。
[2]韋乾佑, “以微電鑄法製造高填充率之微透鏡陣列模仁研究”, 國立台灣科技大學機械工程研究所碩士論文, 民國94年6月。
[3]鍾震桂, “LIGA and LIGA-like技術”, 國立成功大學機械學系暨研究所。
[4]W. J. Li, J. D. Mai, and C. M. Ho,“A MEMS Fabrication Technique for Non-Planar Substrates”, IEEE MEMS Heidelberg, pp. 268-273, 1998.
[5]D. C. Duffy, R. J. Jackman, K. M. Vaeth, K. F. Jensen, and G. M. Whitesides, “Patterning Electroluminescent Materials with Feature Sizes as Small as 5 μm Using Elastomeric Membranes as Masks for Dry Lift-Off”, Adv. Mater., No.7, 1999.
[6]P. Ruchhoeft, M. Colburn, B. Choi, H. Nounu, S. Johnson, T. Bailey, S. Damle, M. Stewart, J. Ekerdt, J. C. Wolfe, and C. G. Willson, “Patterning curved surfaces: Template generation by ion beam proximity lithography and relief transfer by step and flash imprint lithography”, J. Vac. Sci. Technol. B, 17(6), 1999.
[7]Department of Automatic Engineering and Department of Mechanical Engineering, “Improvement of thickness uniformity in nickel electroforming for the LIGA process”, International Journal of Machine Tools & Manufacture, 40, 1065-1072, 2000.
[8]E Kukharenka, M M Farooqui, L Grigore, M Kraft and N Hollinshead, “Electroplating moulds using dry film thick negative photoresist”, J. Micromech. Microeng., 13, S67-S74, 2003.
[9]R. Ong, F. M. Liu and X. T. Zeng, “Copper plating and patterning on non-planar polymer composite for circuitry applications”, SIMTech technical reports, Volume 6, Number 1, Jan~Jun, 2005.
[10]K. J. Lee, L. A. Fossser, and R. G. Nuzzo, “Fabrication of Stable Metallic Patterns Embedded in Poly(dimethylsiloxane) and Model Applications in Non-Planar Electronic and Lab-on-a-Chip Device Patterning”, Adv. Funct. Mater., 15, No. 4, 2005.
[11]I. Kim and P. F. Mentone, “Electroformed nickel stamper for light guide panel in LCD back light unit”, Electrochemica Acta, 52, 1805-1809, 2006.
[12]H. Xiao著, 羅正忠、張鼎張譯, “半導體製程技術導論”, 台灣培生教育出版股份有限公司, 民國95年9月。
[13]林晃業, “微米級結構射出成型之研究”, 國立成功大學航空太空工程研究所碩士論文, 民國94年6月。
[14]友野理平, 青谷薰, 今井雄一, 川合慧共著, 賴耿楊譯著, “實用電鍍技術全集”, 復漢出版社印行, 民國71年1月。
[15]Specialty Materials Laboratory, and Fine Electric Research Laboratories, “JSR Materials for C4 Process”, JSR Corporation.
[16]TOKYO OHKA KOGYO CO., LTD, “TECHNICAL DATA ORDYL P50120” , HISSAN TRADING CO., LTD.
[17]H. Lorenz, L. Paratte, R. Luthier, N. F. de Rooij and P. Renaud, “Low-cost technology for multilayer electroplated parts using laminated dry film resist”, Sensors Actuators A, 53, 364-368,1996.
[18]P. Vulto, N. Glade, L. Altomare, J. Bablet, L. D. Tin, G. Medoro, I. Chartier, N. Manaresi, M. Tartagni and R.Guerrieri, “Microfluidic channel fabrication in dry film resist for production and protyping of hybrid chips”, Lab on a Chip, 2004.
[19]Sheng Hung Chemicalengineering CO. LTD, “胺基磺酸鎳浴”, Sheng Hung Chemicalengineering CO. LTD.
[20]C. M. Rodia, “Electroforming”, Consultant, Trumbull, Conn.
[21]G. A. DiBari, “NICKEL PLATING”, International Nickel Inc., N.J.
[22]楊芯蘋, “應用於微流體元件之微射出成型研究”, 國立成功大學航空太空工程研究所碩士論文, 民國92年6月。