| 研究生: |
詹承偉 Chan, Cheng-wei |
|---|---|
| 論文名稱: |
Sn-3.0Ag-0.5Cu-xNi無鉛銲錫合金拉伸及振動破壞特性之研究 The Tension and Vibration Fracture Characteristics of Sn-3.0Ag-0.5Cu-xNi Lead-Free Solders |
| 指導教授: |
呂傳盛
Lui, Truan-Sheng 陳立輝 Chen, Li-Hui |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 材料科學及工程學系 Department of Materials Science and Engineering |
| 論文出版年: | 2007 |
| 畢業學年度: | 95 |
| 語文別: | 中文 |
| 論文頁數: | 64 |
| 中文關鍵詞: | 振動 、無鉛銲錫 |
| 外文關鍵詞: | Sn-3.0Ag-0.5Cu |
| 相關次數: | 點閱:67 下載:1 |
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銲錫材料使用時可能會受外力影響而產生破壞,因此銲錫材料的機械性質有其探討的必要性。本實驗主要探討不同Ni添加量對Sn-3.0Ag-0.5Cu-xNi銲錫材料之拉伸以及振動破壞特性之影響。
Sn-3.0Ag-0.5Cu之微觀組織為初晶Sn相與Sn-Ag-Cu共晶區。添加Ni之後的微觀組織,則會另出現(Cu,Ni)xSny金屬間化合物。經由EPMA分析Sn-3.0Ag-0.5Cu-0.3Ni之元素分布情形,發現Ag原子及Cu原子存在於共晶區;Ni原子會與Cu原子及Sn原子形成(Cu,Ni)xSny金屬間化合物。透過EPMA之EDS分析,長條狀金屬間化合物之化學式為(Cu,Ni)3Sn4,顆粒狀金屬間化合物之化學組成為(Cu,Ni)6Sn5。
於相同初始拉伸應變速率之結果顯示,Ni添加量增加會使得UTS及YS下降,TE皆能達到40%的應變量,而UE約7~10%的應變量。於不同初始拉伸應變速率之結果顯示,UTS及YS會隨著應變速率增加而上升,且添加Ni之銲錫合金會有較大的應變速率敏感度。
由等出力值1.8G之振動試驗中,可知各組材料之制振性,其中以Sn-3.0Ag-0.5Cu-0.1Ni有較佳的制振性。各組材料之共振壽命由高至低依序為:Sn-3.0Ag-0.5Cu-0.1Ni > Sn-3.0Ag-0.5Cu-0.02Ni ≒ Sn-3.0Ag-
0.5Cu。於相同初始偏移量之共振壽命,可知各組材料之裂縫傳播阻抗能力的優劣,依序為:Sn-3.0Ag-0.5Cu-0.1Ni ≒ Sn-3.0Ag-0.5Cu > Sn-3.0Ag-0.5Cu-0.02Ni,且振動破壞裂縫沿著初晶Sn相的層狀變形傳播,因此振動變形機制由初晶Sn相的層狀變形所主導。
The solder may be damaged by external force. So it is worthwhile to know the mechanical properties of the solder during alloy design. The aim of this study is to explore the tensile and vibration properties of the solder with changing of Ni adding to Sn-3.0Ag-0.5Cu.
The microstructure of Sn-3.0Ag-0.5Cu solder alloy is composed of the primary phase β-Sn and the eutectic phase of Sn-Ag-Cu. We could observe (Cu,Ni)xSny intermetallic compouds in the microstructure of Sn-3.0Ag-0.5Cu-xNi with Ni addition. From the analyzing of EPMA, we can analyze Sn-3.0Ag-0.5Cu-0.3Ni to know how every element(s) distribute in the matrix. After analyzing, we could find that Ag and Cu exist in the eutectic area, and Ni would form the (Cu,Ni)xSny intermetallic compounds with Cu and Sn elements. From the analyzing of EDS, one of the intermetallic compound’s chemical composition was (Cu,Ni)3Sn4, and the other was (Cu,Ni)6Sn5.
The results from the tensile tests performed under the condition of constant strain rate showed that the more addition of Ni, the lower UTS and YS would be. The TE reaches about 40%, and UE is about 7~10%. The results from the other ones performed under different strain rate show that the UTS and YS would increase when rising strain rate of the tensile tests, and the specimens which Ni addition to had larger strain rate sensitivity.
The results of the vibration tests performed under the condition of constant force indicated that the damping capacity of Sn-3.0Ag-0.5Cu-0.1Ni was the best, and the vibration life of specimens in descending order was: Sn-3.0Ag-0.5Cu-0.1Ni > Sn-3.0Ag-0.5Cu-0.02Ni ≒ Sn-3.0Ag-0.5Cu. From the vibration tests performed under the condition of constant deflection, we could know the vibration resistance of the solder alloy. According to the results, the resistance of Sn-3.0Ag-0.5Cu-0.1Ni and Sn-3.0Ag-0.5Cu was better than that of Sn-3.0Ag-0.5Cu-0.02Ni, and the vibration crack propagates along the layer-like deformation of primary β-Sn. Therefore, in the Sn-3.0Ag-0.5Cu-xNi alloys, the vibration deformation mechanism is dominated by the layer-like deformation.
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