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研究生: 施佑澤
Shi, You-Ze
論文名稱: 探討以微熱成型法製作高深寬比之高分子微結構
Fabrication of High Aspect Ratio Polymeric Microstructures by Micro Thermoforming Process
指導教授: 莊怡哲
Juang, Yi-Je
學位類別: 碩士
Master
系所名稱: 工學院 - 化學工程學系
Department of Chemical Engineering
論文出版年: 2007
畢業學年度: 95
語文別: 中文
論文頁數: 101
中文關鍵詞: polymethyl methacrylate(PMMA)放電加工微熱成型加工高深寬比高分子薄膜
外文關鍵詞: microthermoforming, polymer thin film, polymethyl methacrylate(PMMA), high aspect raio, electrical discharge machininng(EDM)
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  • 本研究探討以微熱成型加工,製作高深寬比的高分子微結構。使用的微結構模具是以微放電加工及線放電加工製作而成。透過改變溫度、壓力、及加壓時間等變數進行微熱成型實驗,並分別討論其對微熱成型加工的影響。結果顯示,實驗裝置預抽真空為一必要程序,由於模具之製作方法及實驗裝置的設計,使用微放電加工製得的模具,薄膜較易在邊緣處破裂或使成品形成馬鞍狀之微結構。溫度過高、壓力過大也容易使薄膜產生馬鞍狀。相對地,使用線放電加工所製得的模具,由於可以從微結構底部抽真空,因此微結構內可以完全抽真空,且實驗裝置的設計也可以減少上述缺點的發生。因為微放電加工模具,其微結構寬度大於線放電加工模具,所以,在相同的操作條件下,薄膜較容易下陷。當使用微放電加工之模具(寬260μm、深1000μm)時,在薄膜溫度大於Tg(10℃),加壓時間2min內,PMMA film下陷的深度與施加的壓力有正比的關係,薄膜溫度大於Tg(20℃),加壓時間30s內,下陷深度與施加壓力亦為正比關係。當薄膜溫度大於Tg(20℃),薄膜下陷深度與加壓時間為線性關係。當使用線放電加工模具( 寬200μm、深3500μm),在薄膜溫度大於Tg(20℃),加壓初期,下陷深度與施加壓力有正比關係,但此情況並不適用於薄膜溫度高於Tg(30℃)時。推導的理論值高估薄膜厚度與高分子下陷深度的關係,這乃是因為模具在高分子下陷的過程中,其溫度仍保持在高於Tg的緣故。本研究利用微熱成型加工,可製得寬100μm、深260μm,深寬比為2.6的高分子微結構。

    In this study, we have investigated the micro thermoforming process for fabrication of high aspect ratio polymeric microstructures. The molds used for thermoforming were fabricated by electrical discharge machining, (EDM), and the processing parameters include the mold temperature, applied pressure and pressuring time. The results showed that pre-vacuum is an essential process for micro-EDM mold because of its mold design and device assembly. When using micro-EDM mold, the thermoformed film has a shape like“saddle”and it usually breaks near the edge of the microstructure. In contrast, for wire-EDM mold, the vacuum path is established through the bottom of the microstructures which prevents from lower vacuum level and non-uniform applied pressure. We also found that the wider the microstructure is, the easier the film sags. In addition, when using micro-EDM mold, the postive proportional relation between sagging of PMMA film and the applied pressure was obtained at film temperature 10 and 20℃ above Tg in the beginning. As to the wire-EDM, the postive proportional relation was obsesrved at film temperature 20℃ above Tg in the beginning but not at the film temperature 30℃ above Tg. As to the the relationship between film thickness and film sagging distance, the theoretical calculation overpredicts the experimental data, which can be reasonably justified by using an adjustable parameter. The aspect ratio of the polymer microstructures fabricated in this study can be up to 2.6.

    目錄 摘要 i Abstract ii 誌謝 iii 目錄 iv 表目錄 vii 圖目錄 viii 符號說明 xvi 第一章 前言 1 第二章 文獻回顧 4 2.1 高深寬比微結構模具製作 4 2.1.1 X光源深蝕刻電鑄模造(LIGA)5 2.1.2 類LIGA製程技術(LIGA-like) 6 2.1.3 矽基加工技術(silicon-based micro-machining) 7 2.1.4 微機械加工技術(micro-mechanical machining) 8 2.2 模造具高深寬比高分子微結構的方法 10 2.2.1 微射出成型(micro-injection molding) 10 2.2.2 熱壓成型(hot-embossing) 11 2.2.3 注模成型(casting method) 13 第三章 實驗部份 28 3.1 微熱成型實驗裝置 28 3.2 微結構模具的製作 29 3.2.1 前言 29 3.2.2 微放電加工(micro-EDM)30 3.2.3 線放電加工(wire-EDM)30 3.3 實驗設備與研究方法 31 3.3.1 實驗設備 31 3.3.2 研究方法與實驗步驟 31 3.3.2.A 實驗步驟及各項時間的定義 31 3.3.2.B 量測方法 32 3.3.2.C 實驗變數 33 第四章 結果與討論 43 4.1 薄膜與模具的探討 43 4.1.1 高分子薄膜物性 43 4.1.2 OM觀察微結構模具 43 4.2 加熱曲線的建立 43 4.2.1 微放電加工微結構模具的量測 44 4.2.2 線放電加工微結構模具的量測 44 4.2.3 結論 45 4.3 具備高深寬比之高分子微結構(微放電加工模具) 45 4.3.1 抽真空路徑的建立 46 4.3.2 預抽真空的影響 47 4.3.3 40μm PMMA film 47 4.3.3.A 模具溫度115℃ 47 4.3.1.B 模具溫度125℃ 48 4.3.4 薄膜原始厚度與操作變數之關係 48 4.3.5 薄膜下陷深度與操作變數之關係 49 4.3.6 膜厚與微結構深度之關係 50 4.4 高分子高深寬比之微結構(線放電加工模具) 52 4.4.1 抽真空路徑的建立 52 4.4.2 40μm PMMA film 53 4.4.2.A 模具溫度120℃ 53 4.4.3.B 模具溫度130℃ 53 4.4.3 薄膜原始厚度與操作變數的關係 54 4.4.4 薄膜下陷深度與操作變數之關係 54 第五章 結論與建議 92 第六章 未來工作 94 參考文獻 95 自述 101

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