近年來，3C產業朝向尺寸縮小、降低成本、儲存空間增大及功能性整合等方向發展。RCP的技術可使傳統封裝體顯著縮小，加上3D疊合封裝可使產品達到上述的要求，同時將邏輯電路和記憶體結合以達到縮小系統尺寸的目的。
本研究之RCP疊合封裝體由上方超薄型細間距球柵陣列封裝體(VFBGA)經RCP多佈線層技術與下方球閘陣列封裝體(SPBGA)疊合而成。本文採用ANSYS有限元素軟體配合Global/Local 方法，在JEDEC規範下施予RCP疊合封裝體-40ﾟC到125ﾟC的溫度負載，並根據Coffin- Mansong與Morrow之能量觀點，計算出關鍵錫球之疲勞壽命，其中錫球以亞蘭德黏塑性模型描述之，其他材料視為彈性。
隨後，進行單一因子實驗分析RCP疊合封裝體之各元件材料之楊氏模數、熱膨脹係數與幾何尺寸對於可靠度之影響，藉以篩選影響顯著的因子，再將此類因子利用田口品質設計法求得最佳參數設計。最後，藉由田口方法所得最佳參數設計，使RCP疊合封裝體壽命比原始水準提升86.5%。

In recent years, the electronics industry tends to offer products with smaller size, lower cost, larger storage space and integration of function.The RCP (Redistributed Chip Package) technology is facilitated to reduce the size of the traditional package, and the application of 3D integrating technology ensures the products with the requirements mentioned above. Meanwhile, the logic unit is combined with the memory unit to achieve the goal of size reduction of the system.

The RCP with PoP (Package on Package) package is constructed by stacking the upper very fine pitch ball grid array (VFBGA) with RCP’s multiple redistribution layers technology on the lower stack package ball grid array (SPBGA). The finite element software ANSYS with the Global/Local approach is adopted for this study .Based on the JEDEC, the package is subjected to a thermal cycle of -40℃~125℃.Then the Coffin-Manson model and the Morrow’s energy-based model are applied to predict the fatigue life of solder ball (95.5Sn3.8Ag0.7Cu), which is described by the viscoplastic Anand model and other materials are assumed to be elastic.

Afterwards, the one factor at a time analysis is conducted to investigate the impact on reliability of RCP with PoP package, in which the factors of CTE and Young’s Modulus of materials and geometric size of components are considered. Then the most significant factors are filtered out and applied to obtain the optimal design of parameters by the Taguchi method. As a result, such an optimal design to increase the fatigue life of the package by 86.5% compared to that of the original design

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