隨著半導體技術不斷的進步，微處理器的發熱功率亦不斷地攀升，一般傳統的散熱方式，勢必不能夠滿足此趨勢。於是微小型液冷散熱系統的研發便應運而生。

　　本研究是以實驗方式探討液冷散熱模組在不同的冷卻液體、不同流量、散熱板偏置角度、冷板於自然對流與強制對流之散熱效益。實驗量測結果顯示散熱板於不同角度偏置下，對於液冷系統熱阻值之變化不大。冷卻液體為水或EG，當增加流量時，確實能降低模擬晶片之接面溫度，增加散熱效益。於冷板上加裝散熱鰭片及風扇，與自然對流比較，依照發熱瓦數30W至70W其改進之效率為10-15％。冷卻液體比較方面，在流量同為0.1LPM，冷卻液體為水時其散熱效率較佳。

　　With the development of semiconductor manufacturing technology, the power dissipation of the microprocessor raises. Conventional cooling-by-air methods will be limited when the power dissipation increases. To accomplish high power dissipation, small liquid cooling modules have emerged for personal and notebook computers.

　　In this study, liquid cooling modules are study experimentally with different cooling liquids, flow rates, radiator angles, and the cold plate under free convection/ forced convection. The results indicate that the thermal resistance of liquid cooling modules changes little with different radiator angles. When the flow rates of cooling liquids, water or EG, increase, the surface temperature of the simulation chip is reduced and the cooling efficiency increases. Comparing with free convection, the efficiency can be improved by 10-15% for power dissipation from 30 W to 70 W with the addition of heat sink and a fan on the cold plate. The cooling efficiency of water is better than that of EG with the same flow rate of 1.1 LPM.

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