本研究藉由不同冷卻速率4.7oC/s~1.4oC/s，探討Sn-Ag系無鉛銲料( Sn-3.5Ag 、Sn-3.0Ag-0.5Cu與Sn-3.8Ag-0.7Cu)與銅銲接之銲點部結構，界面層厚度、生長機制與銲點強度之差異。並探討高溫時效後探討銲點機械性質與抗熱性。
研究結果顯示，冷卻速度越快時會影響銲點凝固溫度，使凝固溫度下降，此外，結晶時間也較為小。在界面層形態上，無鉛銲料界面層厚度隨著冷卻速度的下降而增大，當冷卻速度越慢時，表面形貌由原先較為平坦轉變為粗糙；相對於Sn-3.5Ag銲料，SAC系合金銲料與銅銲接中界面層生長較為快速，而隨Cu含量的增加界面層厚度也較為厚。在時效後，界面層與銅交界處有明顯Cu3Sn的生成，Cu6Sn5晶粒數目由多變少，表面生長也較為粗糙。而冷卻速度只影響初始界面層厚度，在時效後界面層厚度主要以固體擴散為主。界面層表面會有Ag3Sn相嵌，Ag3Sn分佈處表面較為平坦，而Ag3Sn化合物亦隨著時效時間增加而有粗大化現象。
在Sn-Ag-Cu合金銲料系剪切強度比Sn-3.5Ag來的高，當時效後銲料強度均有下降趨勢，而時效後冷卻速度較快，剪切強度下降幅度也較為快。在As-soldered下，銲料斷口在銲料中，當經由時效後銲點破換轉移到銲料與界面層交界處，在經由625hr時效斷口破壞轉移到界面IMC層中，界面層生長會造成界面層強度下降，主要破壞處在界面層隆起處。在冷卻速度快時，韌窩組織會較為細小，而時效後斷面主要以劈裂狀為主。

The objective of this study was to investigate the microstructure, adhesive strength, and the thickness of interfacial intermetallic compound layers of Sn-Ag-X/Cu (Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3.8Ag-0.7Cu)solder joints under different cooling rate (4.7oC/s~1.4oC/s). The SnAgCu/Cu soldered joints were isothermally aged at 200oC,for different storage time of 0, 25, 225 and 625 hrs respectively to study the thermal aging effects on adhesive strength of solder joints.
The results showed that the solder layer adjacent to the Cu substrate of temperature below the actual melting point of solder due to quick cooling rate. The IMC(Intermetallic Compound) growth rate increases with increasing Cu content of solder and decreasing cooling rate。The morphology of IMC become rougher by slow cooling, and conversely, flat by quick cooling.
The shear strength results show that the average shear strength of SAC solder higher than the average shear strength of SA35 sodler. The shear strength of solder joints decreased with increasing temperature and increasing cooling rate. The fracture position of solder joints at as-soldered occurred at the inside of solder. When the testing temperature increased, that fracture behavior of solder joints would chang from the inside of solder to the IMC layer . The shear strength of solder joints breaked at the inside of solder is higher than solder joints breaked at the interfacial surface. The fracture behavior of the joints is closely linked with the growth of the IMC layer and the variations of the mechanical properties of the IMCs .

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