本論文探討，氯化亞銅和氯化錫在空氣與水穩定的室溫離子液體1-Ethyl-3-Methylimidazolium Dicyanamide ( EMI-DCA )內的電化學應用來估量其潛在實用性。
(A) 測量EMI-DCA在溫度範圍297.0 ~ 343.0 K內與溫度相關的密度以及絕對黏度,它們的關係方程式也已被敘述。由於DCA-陰離子的配位基特性，令CuCl、CuCl2和SnCl2都能全部完全溶解於EMI-DCA內。
(B) Cu(I)在EMI-DCA的循環伏安圖與其它兩種離子液體──EMI-Cl-BF4和 EMI-TFSI相較可得，Cu(I)皆可以在這些溶液內被氧化成Cu(II)或被還原為銅金屬。銅沉積在玻璃碳與鎳電極上是牽涉三維逐步成核生長過程。掃描式電子顯微鏡和X光繞射儀的結果都顯示銅鍍層的形態會因施加的沉積電位有關，而且以奈米晶粒組成的緻密銅鍍層可以利用低過電位的定電位電解來得到。
(C) 比較Sn(II)在EMI-DCA和EMI-Cl-BF4的循環伏安圖可知，Sn(II)皆可在這兩離子液體內被還原成錫金屬；而在EMI-DCA內，Sn(II)只能在玻璃碳電極上被氧化成Sn(Ⅳ)。錫在玻璃碳上沉積是牽涉三維逐步與瞬間成核生長過程之間。掃描式電子顯微鏡、X光繞射儀、穿透式電子顯微鏡的結果都顯示錫鍍層的形態和沉積電流密度有關，而以奈米線形成的高表面積錫鍍層可由在定電流密度0.30 ~ 1.21 mA/cm2範圍內得到。
低黏度的EMI-DCA與其對金屬氯化物有高溶解度，令此離子液體在電沉積金屬上更容易。

In this study, the potential utility of the air- and water-stable 1-ethyl-3-methylimidazolium dicyanamide (EMI-DCA) room temperature ionic liquid for electrochemical application was evaluated with copper(I) chloride, copper(II) chloride and tin(II) chloride.
(A) The temperature dependency of the density and absolute viscosity of EMI-DCA were measured over a temperature range from 297 to 343 K, and equations describing the dependencies are presented. Due to the ligand property of the DCA- anion, CuCl, CuCl2 and SnCl2 are soluble in EMI-DCA.
(B) Cyclic voltammograms of Cu(I) in EMI-DCA and other two ionic liquids (EMI-Cl-BF4 & EMI-TFSI) were compared. Cu(I) can be oxidized to Cu(II) or reduced to Cu metal in these solutions. The electrodeposition of Cu on glassy carbon and nickel electrodes involves a three-dimensional progressive nucleation and growth process. Scanning electron microscopy and X-ray diffraction results indicate that the morphology of the copper electrodeposits is dependent on the deposition potential, and compact coatings containing nanocrystalline copper could be obtained by potentiostatic electrolysis at low overpotentials.
(C) Cyclic voltammograms of Sn(II) in EMI-DCA and EMI-Cl-BF4 ionic liquids were compared. Sn(II) can be reduced to Sn metal in these ionic liquids, Sn(II) can only be oxidized to Sn(Ⅳ) on glassy carbon electrode in EMI-DCA. The electrodeposition of Sn on glassy carbon electrode involves between a three-dimensional progressive and instantaneous nucleation and growth process. Scanning electron microscopy, X-ray diffraction and transmission electron microscopy results indicate that the morphology of the tin electrodeposits is dependent on the deposition current density, and high surface area coatings with nanowire could be obtained by applied amperostatic electrolysis over a current density range from 0.30 ~ 1.21 mA/cm2.
The low viscosity of EMI-DCA and the high solubility of metal chlorides in it would facilitate the electrodeposition of metals using this ionic liquid.

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