本研究的目的在於利用三種不同方式的薄膜機械性質檢測技術，對厚度範圍在30~100nm的類鑽碳薄膜進行楊氏模數的量測實驗。第一種方式，我們使用奈米壓痕試驗來計算類鑽碳薄膜的楊氏模數與硬度值。第二種方式我們使用掃描探針顯微鏡(Scanning Probe Microscopy，SPM)，利用鑽石探針對鍍於矽基材上的薄膜樣品進行接觸負載試驗，配合彈性接觸變形理論以計算出類鑽碳膜之楊氏模數。第三種方式為本論文所研究的重點，我們以Nanosensor製造的矽探針懸臂樑為基底，在其上鍍製不同厚度之類鑽碳膜；同時配合探針顯微鏡對類鑽碳複合懸臂樑結構進行負載變形實驗，以得到類鑽碳膜的楊氏模數值。
　　將此三種方式所得之類鑽碳楊氏模數結果進行分析，發現當薄膜厚度極低時，壓痕試驗所得結果易受到底材效應的影響而呈現偏低的趨勢。而以探針顯微鏡對樣品之接觸負載實驗結果，可知厚度對楊氏模數的影響並不明顯，但表面粗糙度越大時，量測結果的誤差範圍也越高。而使用類鑽碳複合懸臂樑進行負載實驗時，則需考慮到殘留應力的效應、懸臂樑尺寸的估算誤差、以及不同量測位置等因素對楊氏模數的影響；當量測鍍膜應力較大的薄膜試件時，殘留應力有可能導致懸臂樑結構的降伏。這些因素使得以懸臂樑負載模式進行薄膜楊氏模數檢測時，在使用條件受到相當的侷限。

　　There are three methods developed to determine the Young’s modulus of DLC thin films with thickness of 30~100nm experimentally in this study. The first method is nanoindentation used to determine the Young’s modulus and hardness of DLC films. The second method is contact test performed by a SPM (Scanning Probe Microscope) with a probe made of diamond. In the second method, the theory about elastic contact deformation is the basis of determination. The third method, the point of this study, is deformation test of cantilever which is coated DLC film with different thickness on the silicon substrate by Nanosensor.
　　Through comparison of the analysis by these three methods, the Young’s modulus obtained by nanoindentaion is observed to go a lower value due to the effect of the substrate as the film is very thin. And the results obtained by SPM shows its invariant to film thickness; however, the error of measurement is greater as the sample surface is rougher. For the third method, several effects, such as residual stress, size of the cantilever, position of loading…etc, are considered. Especially for the effect of residual stress, the cantilever could be yielded before loading. The above effects constrain the operating conditions in using the third method.

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