本論文主要應用光散射成像於微組裝系統的設計，目標應用公設設計理論、DFMEA與OPV建立微組裝系統設計流程圖；本文以微夾具之夾持力、微物件之品質檢測系統與組合件表面之光散射現象為分析重點。
運用PRBM建立微夾爪之數學模型，模擬其夾持力並以ANSYS驗證；分析微作用力於微組裝系統之影響；以影像處理技術之邊緣偵測與曲線擬合建立微物件品質檢測演算法；建立光散射強度量測儀量測組合件表面之光散射函數；最後將微組裝系統之設計方案以模擬夾持力與光散射函數進行分析，以評估設計方案可行性；並藉由降低環境濕度以改良夾爪釋放成功率；最後，將微物件品質檢測演算法加入微組裝系統，驗證該系統可透過影像伺服排除不合格物件並完成組裝，物件直徑88 μm、長1 mm，組合件孔徑100 μm，其間隙比為0.12。

In this paper, light scattering imaging is applied to the design of micro-assembly system. The design flow chart of micro-assembly system is established by utilizing axiomatic design, DFMEA and OPV. The analysis of present research focuses on the gripping force, quality inspection system, and light scattering phenomenon in the micro-assembly system.
A mathematical model of micro gripper is built by using PRBM, which is verified by ANSYS. The effects of stiction forces are analyzed in micro-assembly system. The algorithm of quality inspection system is developed by using both edge detection and curve fitting of image processing. The light scattering intensity measurement instrument is constructed and to measure the light scattering function of surface of assembly part. Finally, the result of design case is analyzed through simulation of gripping force and light scattering function, to assess the feasibility of the design. The success rate of gripper release is improved by reducing the humidity. Finally, the quality inspection system is included in the micro-assembly system to verify the performance of excluding the unqualified object in the assembly of micro peg of diameter 88μm and hole diameter 100μm, with clearance ration 0.12.

參考專利文獻
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[US5355577] M.B. Smith, “Method and apparatus for the assembly of microfabricated devices” patent number: US5355577, 1994.

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