本論文旨在研究球柵陣列封裝BGA (Ball Grid Array)，於板級高低冷熱循環測試BL-TC ( Board Level Thermal Cycling Test )下的失效模式與構裝內各因子的影響力。為此，三個尺寸相同的BGA封裝採用了兩種不同晶片尺寸、兩種封膠材料、兩種黏晶膠、三種基板佈線並完成BL-TC測試。透過韋伯分析得知楊氏係數較高、熱膨脹係數較接近印刷電路板(PCB)的封膠材、較厚的黏晶膠會有較好的可靠度結果；其次為使用較小的晶片。經過剖面分析、紅墨水試驗，可得知失效模式為錫球疲勞導致斷裂，且斷裂面皆在錫球頂部。
後續透過數值模型計算累積塑性形變量與單向形變量，得知(1) 體積最大的封膠體與晶片對板級高低溫循環影響最大，肇因為熱膨脹係數與楊氏係數。其次為黏晶膠厚度與晶片尺寸。基板線路則影響最小，甚至可以忽略。(2)角落錫球的失效模式為錫球疲勞斷裂且斷裂面呈不規則狀，因其同時承受縱向與橫向形變；晶片底下之錫球則由因晶片底下的熱膨脹係數差異大，導致大的橫向應變，進而讓斷裂面皆位於錫球頂部。而在晶片邊緣底下時，橫向應變達最大值，導致失效分佈皆位於晶片邊緣附近。

This research examines the failure mode of large Ball Grid Array (BGA) packages after board level thermal cycling (BL-TC) and the relationship of between BL-TC life and package structure. BL-TC was performed on three BGA packages with 15x15x1mm in size. Cross-sectional and penetration tests were performed for failure mode analysis. Numerical simulations were also conducted for failure mechanism analysis.
From BL-TC tests and numerical simulations, it’s confirmed the relationship between BL-TC life and mold compound, die size, die attach & substrate layout.

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