近年來微機電技術已逐漸發展成熟，其商品及功能需求也漸漸邁向多元化，二維微結構已逐漸無法滿足設計上的需求，因此微機電系統在未來的設計以及應用，將與三維微結構製程技術的能力息息相關。本文對三维微機電製程技術的研究，主要分為兩大部分，第一部分對光阻表面張力自動組裝技術做研究，以及第二部份對電子束微影技術搭配奈米壓印技術，直接加工製作3D微結構做研究。在本文的第一部分，我們利用2D的半導體製程製作微結構，並且經過加熱BCB光阻使其產生回熔，將微平板結構抬升起來，成功地自動組裝成3D微結構。而我們也改變光阻的幾何尺寸，研究討論光阻的幾何尺寸與微平板抬升角度的關係，以作為設計上的參考依據。在本文的第二部分，我們利用電子束微影技術在SU-8光阻上，直接加工製作3D微結構，並討論其曝光反應機制。而由於電子束在對於光阻進行曝光時會因為電子束的鄰近效應問題，使得負型光阻曝光後的形狀形成一個特殊的3D輪廓，所以我們發展建立一套電子束微影模型，藉由對核心函數之線性操作，可模擬預測經由電子束微影後的負型光阻3D微結構表面輪廓，作為我們是否需要修正製程參數的依據。最後我們可將電子束微影技術結合奈米壓印技術，利用電子束微影技術在SU-8光阻上製作微結構，直接應用於奈米壓印製程上，作為高分子微結構模仁，可在NEB光阻底材上壓印獲得與SU-8微結構模仁相反的圖案。我們可再利用PDMS對NEB光阻底材進行鑄模製程，如此可達到大量製作微結構的效果，以改善電子束微影技術製作緩慢的缺點。

　　With the rapid growth in RF, Optical, and Bio MEMS industries, three-dimensional microfabrication technologies become more important than ever. In this thesis, the process development and parameter sensitivities of two types of 3D fabrication technologies, namely self-assembly process and electron-beam lithography (EBL) based nanoimprinting lithography (NIL), are discussed. For the study on self-assembly process, the current analytical model, which based on solder reflow, has been proven to be inadequate, and the effect of fabrication process parameters must be experimentally investigated. In this thesis, a commonly used negative photoresist, BCB, is selected as the primary target for study. The effect of the dimension and process parameters such as temperature and time period for reflow on lifting angle, which is a critical performance index of the self-assembly process, are experimentally investigated. The results should be useful for optimizing process design for optical and RF MEMS devices such as optical scanners. For the study on electron-beam lithography based nanoimprinting, a novel fabrication process has been developed by using EBL to create 3D microstructures on Su-8 resists as primary molds for subsequent nanoimprinting (NIL) applications. The relationship among the spatial distribution of electron beam irradiation and the spot size and the dosage of irradiation are firstly experimentally determined and a mathematical model is subsequently proposed to describe such a relationship to depict the EBL process using a mathematical manner for the purpose of process design. Experiments are performed to validate this model. Once the model is established, one can convert the desired 3D geometry to a series of EBL fabrication process parameters to create the primary molds and subsequently reproduced by nanoimprinting techniques. Experimental study validates the feasibility of this proposed method and this should be very useful for creating sub-micrometer level 3D microstructures such as micro channels or lens.

[1] G. T. A. Kovacs, Micromachined Transducers, McGraw-Hill, New York, 1998.
[2] S. D. Stenturia, Microsystem Design, Kluwer Academic, Boston, 2001.
[3] 美商Iolon公司網站, http://www.iolon.com/literature.html.
[4] Y. Fu, and N. K. A. Bryan, ‘‘Investigation of integrated diffractive -refractive microlens microfabricated by focused ion beam,’’ Journals of the American Institute of Physics, vol. 71, no. 6, pp. 2263-2266, 2000.
[5] B. Morgan, C. M. Waits, J. Krizmanic, and R. Ghodssi, ‘‘Development of a deep silicon phase fresnel lens using gray-scale lithography and deep reactive ion etching,’’ Journal of microelectromechanical system, vol. 13, pp.113-120, 2004.
[6] G. M. Rebeiz, RF MEMS: Theory, Design and Technology, John Wiley & Sons, New Jersey, 2003.
[7] T. Ebefors, E. Kälvesten, and G. Stemme, ‘‘Three dimensional silicon triple-hot wire anemometer based on polyimide joints,” Proceeding of the IEEE MEMS’98 Workshop, pp. 93-98, 1998.
[8] L. J. Guerin, M. Bossel, M. Demierre, S. Calmes, and P. Renaud, ‘‘Simple and low cost fabrication of embedded micro-channels by using a new thick-film photoplastic,’’ International Conference on Solid State Sensors and Actuators, vol. 2, pp. 1419-1422, 1997.
[9] T. Nyberg, F. Zhang and O. Inganäs, “Macromolecular nanoelectronics,” Current Applied Physics, vol. 2, pp.27-31, 2002.
[10] C.S. Lin, W. Z. Wu, Y. L. Lay, and M.W. Chang, ‘‘A digital image -based measurement system for a LCD backlight module,’’ Optics & Laser Technology, vol. 33, pp. 499-505, 2001.
[11] R. Yeh, E. J. Kruglick, and K. S. J. Pister, “Surface Micromachined components for articulated microrobots,” Journal of Microelectromechanical Systems, vol. 5, pp. 10-17, 1996.
[12] L. Y. Lin, J. L. Shen, S. S. Lee, and M. C. Wu, “Surface micromachined micro-xyz stages for free-space microoptical bench,” IEEE Photonics Technology Letters, vol. 9, no.3, pp. 345-347, 1997.
[13] S. Reyntjens, and R.Puers, “Focused ion beam induced deposition: fabrication of three-dimensional microstructures and Young’s modulus of the deposited material,” Journal of Micromechanics and Microengineering, vol.10, pp. 181-188, 2000.
[14] T. Akiyama, D. Collard, and H. Fujita, “Scratch drive actuator with mechanical links for self-assembly of three-dimensional MEMS,” Journal of Microelectromechanical Systems, vol. 6, no. 1, pp. 10-17, 1997.
[15] Y. C. Tai, L. S. Fan, and R. S. Muller, “IC-processed micro-motors: design, technology, and testing,” Proceeding of the IEEE MEMS’89 Workshop, pp.1-6, 1989.
[16] M. A. Helmbrecht, U. Srinivasan, C. Rembe, R. T. Howe and R. S. Muller, “Micromirrors for adaptive-optics arrays,” The 11th International Conference on Solid-State Sensors and Actuators, pp.1290-1293, 2001.
[17] K. F. Harsh, V. M. Bright, Y.C. Lee, ‘‘Solder self-assembly for three-dimensional microelectromechanical systems,’’ Sensors and Actuators, vol. 77, pp.237-244, 1999.
[18] R. R. A. Syms, ‘‘Surface tension powered self-assembly of 3-D micro-optomechanical structures,’’ Journal of Microelectromechanical Systems, vol. 8, no. 4, pp.448-455 , 1999.
[19] V. Kaajakari, and A. Lal, “Pulsed ultrasonic release and assembly of micromachines,” International Conference on Solid-State Sensors and Actuators, pp. 212-215, 1999.
[20] 郭晉良, 準分子雷射加工微形3D微結構, 國立成功大學機械工程研究所碩士論文, 2002.
[21] H. Hocheng, C. T. Pan, and C. C. Cheng, ‘‘Formation of Microlens by Reflow of Dual Photoresist,’’ Jpn. J. Appl. Phys, vol. 42, pp. 4044-4047, 2003.
[22] 陳宣克, 電子束微影製作三維非平面結構及結構表面改質, 國立中央大學化學工程與材料工程研究所碩士論文, 2003.
[23]荷蘭公司Institut für Mikrotechnik Mainz GmbH 網頁http://www.imm-mainz.de/products/lens.html4.
[24] R. R. A. Syms, ‘‘Equilibrium of hinged and hingeless structures rotated using surface tension force,’’ Journal of Microelectromechanical System, vol.4, no. 4, pp.177-184, 1995.
[25] 何亦平, 微結構自組裝技術之研究, 國立清華大學動力機械工程研究所碩士班, 2002.
[26] 范姜國皓, 自我組裝鏡面旋轉式光通訊開關, 國立清華大學動力機械工程研究所碩士班, 2003.
[27] M. M. Alkaisi, W. Jayatissa, and M. Konijn, “Multilevel Nanoimprint Lithography,” Current Applied Physics, vol. 4, no.2-4, pp. 111-114, 2004.
[28] T. Nyberg, F. Zhang, O. Inganäs, “Macromolecular nanoelectronics,” Current Applied Physics, vol. 2, no.1, pp. 27-31, 2002.
[29] A. Lebib, M. Natali, S. P. Li, E. Cambril, L. Manin, Y. Chen, H. M. Janssen, and R. P. Sijbesma, “Control of the critical dimension with a trilayer nanoimprint lithography procedure”, Microelectronic Engineering, vol. 57-58, pp. 411-416, 2001.
[30] T. A. McMahon and J. T. Bonner, On Size And Life, Scientific American Books, New York, 1983.
[31] R. R. A. Syms, ‘‘Equilibrium of hinged and hingeless structures rotated using surface tension forces,’’ Microelectromechanical Systems, vol. 4, no. 4, pp.177-184, 1995.
[32] R. R. A. Syms, ‘‘Self-assembly of three-dimensional microstructures using rotation by surface tension forces,’’ Electronics Letters, vol. 29, no. 8, pp.662-664,1993.
[33] K. F. Harsh, and Y.C. Lee, ‘‘Modeling for solder self-assembly MEMS,’’ Proceedings of the International Society for Optical Engineering , vol. 3289, 1998.
[34] P.W. Green, R. R. A. Syms, E. M. Yeatman, ‘‘Demonstration of Three-dimensional Microstructure Self-Assembly,’’ Journal of Micro-electromechanical Systems, vol. 4, no. 4, pp. 170-176, 1995.
[35] K. F. Harsh, V. M. Bright, and Y.C. Lee, ‘‘Study of Micro-Scale Limits of Solder Self-Assembly for MEMS,’’ Electronics and Components Technology Conference, pp. 1690-1695, 2000.
[36] K. F. Harsh, R. S. Irwin, and Y.C. Lee, ‘‘Solder self-assembly for MEMS,’’ Proceedings of the 44th International Instrumentation Symposium, 1998.
[37] B. McCarthy, V. M. Bright, and J. A. Neff, ‘‘A solder self-assembled large angular displacement torsional electrostatic micromirror,’’ Micro Electro Mechanical Systems, pp. 499-502, 2002.
[38] R. R. A. Syms, ‘‘3D micro-optomechanical devices by surface tension powered self-assembly,’’ Microengineering in Optics and Optoelectronics, pp. 4/1-4/6, 1999.
[39] R. R. A. Syms, ‘‘Surface tension powered self-assembly of 3-D micro-optomechanical structures,’’ Microelectromechanical Systems, vol. 8, no. 4, pp. 448-455, 1999.
[40] R. R. A. Syms, ‘‘Self-assembled 3-D silicon microscanners with self-assembled electrostatic drives,’’ Photonics Technology Letters, vol. 12, no. 11, pp. 1519-1521, 2000.
[41] 謝清霖, BCB光阻再流動特性探討及其應用, 國立成功大學造船暨船舶工程研究所碩士論文, 2003.
[42] K. A. Brakke, Surface Evolver Meanual: version 2.01, University of Minnesota.
[43] 美國Dow公司網頁:http://www.dow.com/ cyclotene /lit.htm
[44] R. L. Alley, R. T. Howe and K. Komvopoulos, “The Effect of Release-Etch Processing on Surface Microstructure Stiction”, International Conference on Solid State Sensor and Actuator Workshop, P. 202-207, 1992.
[45] 張俊彥, 鄭晃忠, 積體電路製程及設備技術手冊, 中華民國電子材料與元件協會, 1997.
[46] H. C. Pfeiffer, ‘‘Variable spot shaping for e-beam lithography,’’ Journal of vacuum Science and Technology, vol. 15, no. 3, pp. 887-890, 1978.
[47] 郭政達, 廖明吉, ‘‘先進電子束微影系統設備在特大型積體電路的應,’’科學發展月刊, 第28卷, 第3期，2000
[48] 邱燦賓, 施敏, ‘‘電子束微影技術,’’ 科學發展月刊, 第28卷, 第6期, 2000.
[49] 施錫龍, ‘‘電子束晶圓步進系統簡介,’’ 電子月刊, 第二卷, 第二期, 1996.
[50] 劉正財, 電子束鄰近效應的校正與具鰭狀通道之SOI場效電晶體製作及研究, 國立交通大學電機資訊學院碩士論文, 2003.
[51] L. F. Thompson, C. G. Willson, and M. J. Bowden, Introduction to Microlithography, American Chemical Society, Washington, 1994.
[52] 邱燦賓, ‘‘電子束微影技術之鄰近效應修正,’’ 毫微米通訊, 第七卷, 第三期, 2000.
[53] 徐俊成, 化學微縮技術應用於電子束微影製程與電子束阻劑線寬變異原因及其微波消化效率之探討, 國立清華大學原子科學研究所碩士論文, 2002.
[54] H. Eisenmann, T. Waas, Hartmann, ‘‘PROXECCO-proximity effect correction by convolution,’’ Journal of vacuum Science and Technology, vol. 11, no. 6, pp.2741-2745, 1993.
[55] A. A. Kumar, M. Alagar and R. M. V. G. K. Rao, ‘‘Synthesis and characterization of siliconized epoxy-1,3-bis(maleimido)benzene intercrosslinked matrix materials,’’ Polymer, vol. 43, no. 3, pp. 693-702, 2002.
[56] W. G. Kim and J. Y. Lee, ‘‘Contributions of the network structure to the cure kinetics of epoxy resin systems according to the change of hardeners,’’ Polymer, vol. 43, no. 21, pp. 5713-5722, 2002.
[57] K. Mimura and H. Ito, ‘‘Characteristics of epoxy resin cured with in situ polymerized curing agent,’’ Polymer, vol. 43, no. 21, pp. 7559-7566, 2002.
[58] S. Y. Chou, R. K. Peter and J. R. Preston, ‘‘Imprint of Sub-25 Vias and Trenches in polymers,’’ Appl. Phys. Lett., vol. 67, no.21, pp. 3114-3116, 1995.
[59] S. Y. Chou and Z. Lei, ‘‘Lithography Induced Self-Assembly of Periodic Polymer Micropillar Arrays.’’ J. Vac. Sci. Technol., vol. 17, no. 6, pp. 3197-3202, 1999.
[60] K. Pfeiffer, et al., ‘‘Polymer Stamps for Nanoimprinting,’’ Microelectronic Engineering, vol. 61-62, pp.393-398, 2002.
[61] F. Gottschalch, et al., ‘‘Polymer Issue in Nanoimprinting technique,’’ Solid-state Electronics, vol. 43, pp.1079-1083, 1999.
[62] Y. Xia and G. M. Whitesides, ‘‘Soft Lithography,’’ Angew. Chem. Int. Ed., vol. 37, pp.551-575, 1998.
[63] Q. Xia, C. Keimel, H. Ge, Z. Yu, W. Wu and S. Y. Chou, ‘‘Ultrafast patterning of nanostructures in polymers using laser assisted nanoimprint lithography,’’ Appl. Phys. Lett., vol. 83, no. 21, pp.4417-4419, 2003.