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研究生: 張育棋
Chang, Yu-Chi
論文名稱: 基於鐵酸鉍交叉式電阻記憶體之電性與照光研究
The Study of Electrical Properties and Photoresponsivity of BiFeO3 Crossbar Resistive Random Access Memory
指導教授: 莊文魁
Chuang, Wen-Kuei
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 微電子工程研究所
Institute of Microelectronics
論文出版年: 2021
畢業學年度: 109
語文別: 中文
論文頁數: 96
中文關鍵詞: 鐵酸鉍薄膜電阻式記憶體交叉式陣列電阻記憶體光譜響應紫外光
外文關鍵詞: BiFeO3 film, resistive random-access memory (ReRAM), crossbar ReRAM, photoresponsivity, ultraviolet illumination
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  • 近年來,隨著AI、物聯網以及大數據等等科技的蓬勃發展,需要大量的計算以及儲存空間,記憶體的要求以及需求也日益增加,由於電阻式記憶體(ReRAM)具有結構簡單、低功耗、讀寫速度快等優點,但要如何達到高密度、低功耗的記憶體,一直是一個待解的議題。
    為了達到高密度的需求,本論文製備了1×1和2×2交叉式陣列電阻記憶體,使用射頻磁控濺鍍法製備的鐵酸鉍薄膜作為介電層材料,上、下電極分別為氧化銦錫和鋁,並量測此結構ReRAM電性及穩定性,經由量測,此元件具有能辨識的開關電流比值(on/off ratio > 100),接著在高、低阻態維持時間都可以維持11000秒以上,並且在耐用度測試上,可以穩定的達到約200次的開關切換次數。
    除了一般的電性量測分析,也對鐵酸鉍薄膜進行XRD和吸收等量測,並計算其能隙,本論文也探討了其燈絲傳導機制以及高、低阻態的導通機制,除了歐姆傳導、空間電荷侷限電流外(SCLC),發現在高電場下的傅勒-諾德翰穿隧(Fowler-Nordheim Tunneling)也有參與其中。
    接著探討電阻式記憶體對光之響應,以及不同波段的光對元件的影響,
    進而去探討在紫外光下,進行元件阻態切換,以及低阻態的電流變化。

    In recent years, the demand for IoT, big data, and AI have increased phenomenally, all come at the expense of requiring an astronomical amount of computing power and storage memory. With various types of memory considered, resistive memory (ReRAM) stands out due to its inherent advantages including a simple structure, low power consumption, and fast read and write speed.
    To create a plausible ReRAM, the present work has prepared 1×1 and 2×2 crossbar arrays of ReRAM based on a bismuth ferrite film as prepared by radio frequency magnetron sputtering as the dielectric layer material, the top and bottom electrodes adopted are indium tin oxide(ITO) and aluminum(Al), respectively. The electrical properties and stability of the crossbar ReRAM are measured and the subsequent results have revealed in a sequence that the device has a recognizable switching current ratio (on/off ratio > 100), the retention time in both high and low resistance states could be maintained for more than 11000 seconds, while during the endurance test, over 200 switching cycles are also realized.
    In addition to the general electrical measurement and analysis, XRD and absorption measurements are also performed on the bismuth ferrite film to determine the energy gap. This thesis also discusses the filament conduction mechanism that dictates the high and low resistance states, including the ohmic conduction, space charge limited current (SCLC), and Fowler-Nordheim tunneling under a high electric field.
    Finally, the response of ReRAM under illumination and in particular with the influence of illumination of different wavelengths on the device are also discussed to investigate their impacts on the resistance switching of ReRAM and in particular the current in the low-resistance state under the ultraviolet irradiation.

    中文摘要 I 英文摘要 III 誌謝 XIV 目錄 XV 表目錄 XVIII 圖目錄 XX 第一章 緒論 1 1-1前言 1 1-2研究背景與動機 3 第二章 文獻回顧 4 2-1非揮發記憶體簡介 4 2-1-1鐵電記憶體 (FeRAM) 6 2-1-2磁阻式記憶體 (MRAM) 7 2-1-3相變式記憶體 (PCRAM) 8 2-1-4電阻式記憶體 (ReRAM) 9 2-2鐵電材料特性 10 2-2-1鐵電材料極化與介電特性 11 2-3鈣鈦礦材料結構特性 13 2-3-1 BiFeO3 (BFO)簡介 14 2-4電阻切換機制 16 2-4-1燈絲理論 17 2-4-2焦耳熱效應(Joule-heating effect) 18 2-4-3金屬離子遷移機制 20 2-5薄膜電流傳導機制 21 2-5-1歐姆導通(Ohmic Conduction) 22 2-5-2蕭基發射(Schottky emission) 23 2-5-3普爾-法蘭克發射(Poole-Frenkel Emission) 24 2-5-4空間電荷限制電流(Space Charge Limit Current)[22][23] 25 2-5-5穿隧傳導(Tunneling Conduction) 27 2-6交叉式陣列電阻記憶體(Crossbar ReRAM) 30 第三章 實驗方法及儀器簡介 32 3-1 Crossbar ReRAM實驗步驟 33 3-1-1試片清洗 34 3-1-2光罩設計 34 3-1-3 BiFeO3 Crossbar ReRAM製作流程以及俯視圖 39 3-2上光阻、曝光及TMAH顯影 43 3-2-1旋轉塗佈機旋塗S1813正光阻 44 3-2-2曝光及TMAH顯影 46 3-3下電極製作以及鍍SiO2絕緣層 47 3-3-1下電極製作 47 3-3-2鍍SiO2絕緣層 49 3-3-3厚度量測以及計算鍍率 50 3-4蝕刻Via hole以及介電層(BiFeO3)製作 52 3-4-1蝕刻Via hole 52 3-4-2沉積介電層(BiFeO3) 54 3-5製作上電極以及蝕刻下電極PAD區域 56 3-5-1製作上電極 56 3-5-2蝕刻下電極PAD區域 58 3-6退火製程 60 第四章 元件量測與結果討論 61 4-1 BiFeO3薄膜XRD薄膜分析 61 4-2 BiFeO3薄膜能隙 62 4-3氧化銦錫(ITO)電性分析 64 4-4 Crossbar ReRAM 元件電性分析 67 4-4-1 ReRAM 元件量測流程 67 4-4-2量測元件I-V特性曲線 68 4-4-3電阻式記憶體的耐久度 71 4-4-4電阻式記憶體的維持時間 73 4-4-5電阻式記憶體的切換電壓及高低阻態 75 4-4-6電阻式記憶體的導通機制圖 77 4-5 Crossbar ReRAM 元件照光之分析 84 第五章 結論與未來工作 89 5-1結論 89 5-2未來工作 91 第六章 參考文獻 92

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