隨著高功率與高整合度電子元件之快速發展，元件運作過程中所產生之熱量若無法有效散除，將導致效能衰退與可靠度下降，因此熱管理技術成為關鍵課題之一。銅因具備高熱導率而被廣泛應用於散熱基板，而透過微結構設計可進一步調控其熱傳行為；此外，石墨烯因具備優異的面內熱導特性，亦被視為潛力材料之一。
本研究以微結構銅基板為基礎，探討結合石墨烯後對其熱管理效能之影響。研究中設計並比較不同幾何形狀與特徵尺寸之微結構陣列，包括圓形、正方形與菱形結構，於固定間距條件下分析其熱傳行為差異。透過高溫冷卻過程中的溫度分佈與終態溫度變化，評估微結構尺寸效應及幾何形貌對散熱表現之影響，並進一步比較有無石墨烯塗佈時之熱管理差異。
研究結果顯示，微結構幾何形狀與特徵尺寸皆對銅基板之熱管理行為具有顯著影響，在特定尺寸條件下可有效促進熱擴散並降低最終溫度。此外，石墨烯之引入可進一步改善熱通量分佈，使熱傳路徑更為均勻，提升整體散熱效能。綜合而言，本研究證實透過微結構設計結合石墨烯材料，能有效提升銅基板之被動熱管理表現，並可作為未來高功率電子元件散熱設計之參考依據。

With the rapid development of high-power and highly integrated electronic devices, the heat generated during device operation, if not effectively dissipated, can lead to performance degradation and reduced reliability. Consequently, thermal management has become one of the critical challenges in electronic system design. Copper is widely used as a heat dissipation substrate due to its high thermal conductivity, and its heat transfer behavior can be further regulated through microstructural design. In addition, graphene, owing to its exceptional in-plane thermal conductivity, has been regarded as a promising material for thermal management applications.
In this study, microstructured copper substrates were employed to investigate the effect of incorporating graphene on thermal management performance. Microstructure arrays with different geometric shapes and characteristic sizes, including circular, square, and diamond configurations, were designed and compared under a fixed spacing condition to analyze their heat transfer behaviors. The effects of microstructure size and geometric morphology on heat dissipation performance were evaluated through temperature distribution and final steady-state temperature during high-temperature cooling processes. Furthermore, the thermal management performance with and without graphene coating was systematically compared.
The results indicate that both the geometric shape and characteristic size of the microstructures have a significant influence on the thermal management behavior of copper substrates. Under specific size conditions, microstructured designs can effectively enhance heat spreading and reduce the final temperature. Moreover, the introduction of graphene further improves heat flux distribution, leading to more uniform heat transfer paths and enhanced overall heat dissipation performance. Overall, this study demonstrates that the integration of microstructural design with graphene materials can effectively improve the passive thermal management performance of copper substrates, providing valuable insights for the thermal design of future high-power electronic devices.

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