本研究目的是針對Sn-Ag系銲料中幾項重要議題進行研究，包含Ag3Sn化合物形貌變化、Ag3Sn化合物粗大化抑制，以及界面介金屬層過度成長等議題。首先透過冷卻速率研究Sn-3.5Ag銲料中Ag3Sn形貌演變與機械性質之關係；之後在Sn-3.5Ag銲料中添加微量稀土元素以改善Ag3Sn化合物粗大化與界面層過度成長之問題，藉此深入研究Sn-Ag銲料系。
Ag3Sn形貌演變研究利用連續冷卻、水冷、空冷及爐冷方式，探討不同冷卻速率對Sn-3.5Ag共晶銲料中Ag3Sn形貌之變化，進而分析不同形貌Ag3Sn對銲料抗拉強度與破壞行為之影響。研究顯示銲料凝固時間受冷卻速率影響，進而影響Ag3Sn形貌與尺寸，隨冷卻速率高至低其形貌演變如下：次微米顆粒狀 →次微米顆粒狀+微米針狀 → 微米針狀 → 微米針狀且尾部為小片狀 → 片狀 → 大板片狀，而大板片狀Ag3Sn僅形成於銲點的界面的Cu6Sn5界面層上，由於Cu6Sn5界面層的形成降低界面局部Sn濃度，使Ag濃度升高，導致Ag3Sn變為系統中初析相，以及界面層可提供初析Ag3Sn非均質成核位置，使初析Ag3Sn在液態錫水中快速成長為形成巨大板狀。在抗拉強度的表現上，隨著冷卻速率的降低，銲料之最大抗拉強度亦隨之下降，銲料延性表現也隨冷速變慢而隨之下降，因Ag3Sn為細小顆粒狀時，強度與延性最佳且裂紋不會開裂於Ag3Sn顆粒中；當Ag3Sn成長為針狀時，強度與延性次之，但裂紋則開裂於針狀Ag3Sn中或共晶區(針狀Ag3Sn+β-Sn)中；而當Ag3Sn成長為片狀，強度與延性均最差，裂紋易開裂片狀Ag3Sn/β-Sn界面。
Sn-3.5Ag銲料性質之改善研究，利用0-1.0wt.% La添加入Sn-3.5Ag銲料，藉此探討對微結構、微硬度、附著強度以及破壞模式之影響。研究結果顯示Sn-3.5Ag-xLa銲料之微結構與Sn-3.5Ag相似之初析β-Sn與網狀共晶結構，但La的添加細化β-Sn及Ag3Sn，使銲料組織細化且更均質。當La添加至0.1wt.%時基地中開始生成fcc結構LaSn3，且LaSn3化合物尺寸與數量隨La添加量增加而增加，添加超過0.5wt.%La後基地則出現大量的LaSn3化合物，大量的LaSn3化合物可提銲料凝固大量的非均質成核位置，以細化組織及減緩Cu6Sn5界面層之成長。時效後，添加La之銲點減緩Cu6Sn5界面層的成長，但對Cu3Sn層並無顯著影響。銲料微硬度隨著La添加量增加而提升，主要因銲料組織細化效應；在附著強度上，未時效Sn-3.5Ag-La銲點之附著強度並不隨La添加量增加而增加，但延性隨添加量增加而下降，因LaSn3化合物內部及LaSn3/β-Sn matrix界面上的孔洞與缺陷，導致裂紋快速在銲料內部發展與傳遞，使得銲點強度無法因微結構細化而大幅提昇。

The effect of Ag3Sn morphologies, Ag3Sn coarsening and excessive growth of IMC layer are concerned with the problems of Sn-Ag solder. The aim of this study is expected to solve the problems of Sn-Ag solder.
In evolution of Ag3Sn morphology, an experimental investigation is performed to examine the effect of the cooling rate on the morphology of the Ag3Sn intermetallic compounds (IMCs) formed during the solidification of bulk eutectic Sn-3.5Ag solder and Sn-3.5Ag/Cu joints. It is shown that the cooling rate has a significant effect on the solidification time and therefore influences both the size and the morphology of the final Ag3Sn compounds. Specifically, the Ag3Sn compounds exhibit a particle-like → needle-like → needle-like with plate-like tails → plate-like → large plate-like evolution as the cooling rate is reduced. The large plate-like Ag3Sn compounds are observed only in the Sn-3.5Ag/Cu specimens. The large plate-like Ag3Sn formed at the interface layer due to the formation of a Cu6Sn5 IMC layer at the interface. Thus, it is inferred that the Cu6Sn5 interfacial layer in the Sn-3.5Ag/Cu specimens leads to a local enrichment of Ag at the interface and prompts the formation of large Ag3Sn IMCs via the Cu6Sn5 heterogeneous nucleation sites. The tensile strength and ductility of Sn-3.5Ag solder drops apparently with Ag3Sn evolution by cooling rate decreasing due to the fracture behaviour changes. The crack easily initiates and propagates in the solder when Ag3Sn compounds grow into plate-like thus causing stress concentration effect at β-Sn/Ag3Sn plate interface. Therefore, Sn-3.5Ag containing Ag3Sn plates have lowest mechanical properties.
The effects of lanthanum (La) additions on the microstructure, microhardness, adhesive strength and fracture behavior of Sn-3.5Ag solders. Sn-3.5Ag-xLa ternary solders were prepared by adding 0-1.0wt% La to Sn-3.5Ag alloy. The Sn-3.5Ag-xLa solders comprised -Sn, Ag3Sn, and LaSn3 phases, and their microstructure was refined by La additions. The electron backscatter diffraction (EBSD) results confirmed that the face-centered cubic (fcc) structure of LaSn3 compounds distributed randomly in the -Sn matrix had no obvious preferred orientation. As-cast, the addition of La increased the microhardness of the Sn-Ag solder due to the refining effect of Ag3Sn particles and increased formation of LaSn3 compounds. As aging time was increased, the microhardness of the solders decreased and the Ag3Sn compounds coarsened. However, the coarsening of Ag3Sn compounds was retarded by the La, and the size and amount of LaSn3 compounds did not change perceptibly with aging time. La additions reduced the ripening reaction rate of the scallop-type Cu6Sn5 compounds at the interface layer. IMC layer in the aged samples, trace amounts of La addition suppressed the Sn diffusion and retarded the growth of the Cu6Sn5 layer, but not that of the Cu3Sn layer. In spite of the significant refinement of microstructure and suppression of the growth of Cu6Sn5 IMC layer caused by the La additions, the expected enhancement of adhesive strength and ductility did not occur apparently. With the aid of Argon Beam Milling, we have found defects and voids inside the LaSn3 compounds; these features were closely related to the crack initiation and formation during the adhesive tensile test. Consequently, the beneficial effect due to the refinement of microstructure and suppression of interfacial layer compounds was retarded.

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