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研究生： 范盛維
Fan, Sheng-Wei
論文名稱： 半導體工程鏈資料交換機制之設計與實作
Data Exchange Mechanism Design and Implementation of Semiconductor Engineering Chain
指導教授： 鄭芳田
Cheng, Fan-Tien
洪敏雄
Hung, Min-Hsiung
學位類別： 碩士
Master
系所名稱： 電機資訊學院 - 製造工程研究所
Institute of Manufacturing Engineering
論文出版年： 2006
畢業學年度： 94
語文別： 中文
論文頁數： 107
中文關鍵詞： 商業流程處理 、巨大檔案傳輸 、資料傳輸安全 、工程鏈
外文關鍵詞： Data Transmission Security, Business Process Handling, Large Data Transmission, Engineering Chain
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    • IC生產進入奈米製程世代，許多良率(Yield)問題與設計有很大關係，傳統將晶片設計、光罩製造及晶圓代工分離獨自運作的模式將難以適用。這促使許多IC設計公司採用「可製造性設計」(Design for Manufacturability, DFM)策略，亦即藉由半導體生產鏈協力廠商(特別是設計公司、光罩廠、晶圓代工廠)間彼此緊密分享資訊，以確保在設計階段便能將可製造性及良率因素納入考量，使得新的IC晶片得以提高良率，並有效降低成本及上市時間(Time to Market)。因此，半導體業急需要有工程鏈管理系統，來有效解決合作的半導體公司間工程資料交換與分享問題。本論文針對工程鏈管理系統中工程資料交換之需求，研發ㄧ個以網路服務(Web Services)為基礎的「半導體工程鏈資料交換機制」。本研究除了系統架構設計外，還發展與實作了4個機制：(1)資料溝通與整合機制、(2)資料傳輸安全機制、(3)巨大檔案傳輸機制及(4)商業流程處理機制。最後，本研究建構了一個工程鏈管理系統雛型，以進行系統之功能驗證與效能測試。實驗測試結果顯示，本工程鏈資料交換機制可以符合設計之功能需求，也有不錯之效能表現，相信能夠被應用來有效解決半導體工程鏈之資料交換問題。

    When IC production enters nano-meter generation, many yield problems are related to design. The traditional mode of letting IC design, mask fabrication, and foundry service operate independently may not be applicable. This forces many IC design companies to adopt the Design-for-Manufacturability (DFM) strategy, which tightly shares information among cooperative semiconductor companies, especially Design House, Masking House, and Foundry, to make sure that the manufacturability and yield factors are considered in the IC design phase. Consequently, the yield can be increased, and the cost and time to market can be reduced for a new IC. Thus, the semiconductor industry is eager to have engineering chain management systems (ECMS) to solve the problem of exchanging and sharing engineering data among cooperative semiconductor companies. This thesis aims at the data exchange requirements in the engineering chain management system, and develops a Web Services-based semiconductor engineering chain data exchange scheme. In addition to designing the system framework, this research also develops and implements four mechanisms: (1) Data Communication and Integration Mechanism, (2) Data Transmission Security Mechanism, (3) Large File Transmission Mechanism, and (4) Business Process Handling Mechanism. Finally, a prototype ECMS is constructed to verify the system functions and to test the performance. Experimental test results show that the proposed engineering chain data exchange scheme can fulfill the desired functional requirements and demonstrate a good performance. Thus, it can be a valid solution to the data exchange problem of the semiconductor engineering chain.

    中文摘要 英文摘要 誌謝 目 錄.............................................................I 圖目錄............................................................IV 表目錄............................................................VI 第一章、緒論.......................................................1 1.1 研究背景.......................................................1 1.2 研究動機.......................................................5 1.3 研究目的.......................................................6 1.4 論文架構.......................................................10 第二章、核心技術...................................................11 2.1 網路服務(Web Services)技術.....................................11 2.1.1 XML (eXtensible Markup Language).............................11 2.1.2 SOAP (Simple Object Access Protocol).........................13 2.1.3 WSDL (Web Services Description Language).....................14 2.1.4 UDDI (Universal Description, Discovery, and Integration).....14 2.1.5 HTTP (Hyper Text Transfer Protocol)..........................16 2.2 分散式網路安全技術.............................................16 2.2.1 單一認證服務(Single Sign-On, SSO)............................16 2.2.2 SSL (Secure Sockets Layer)...................................17 2.2.3 XML簽章(XML Signature)與XML加密(XML Encryption)..............19 2.3 巨大檔案傳輸技術...............................................20 2.3.1 使用URL引用的訊息傳送方式....................................21 2.3.2 使用編碼的訊息傳送方式.......................................21 2.3.3 使用帶附件的SOAP訊息傳送方式.................................22 2.3.4 以MTOM和XOP技術的訊息傳送方式................................23 2.3.4 MTOM架構及優勢...............................................25 2.3 商業流程處理技術...............................................26 2.3.1 BizTalk Framework............................................27 2.3.2 BizTalk訊息結構..............................................28 2.3.3 BizTalk核心功能..............................................29 2.3.3.1 配接器(Adapter)............................................29 2.3.3.2 資料的轉換及轉譯(Data Transform and Translation)...........30 2.3.3.3 管線(pipeline).............................................31 2.3.3.4 商業規則...................................................33 2.3.3.5 協調流程(Orchestration)....................................33 第三章、工程鏈管理系統之需求.......................................35 3.1 系統發展步驟...................................................35 3.2 系統需求分析...................................................37 3.3 系統架構設計...................................................38 3.3.1 建構架構模型.................................................38 3.3.2 系統功能需求分析.............................................39 3.3.3 設計系統元件模型.............................................41 第四章、工程鏈資料交換機制之分析與設計.............................48 4.1 資料溝通與整合機制.............................................48 4.2 資料傳輸安全機制...............................................49 4.3 巨大檔案傳輸機制...............................................54 4.4 商業流程處理機制...............................................57 第五章 系統之物件導向分析與設計....................................60 5.1工程鏈代理人分析與設計..........................................61 5.1.1 功能需求分析.................................................62 5.1.2 使用者案例圖.................................................63 5.1.3 物件導向分析設計.............................................65 5.2 通用通訊代理人分析與設計.......................................70 5.2.1 功能需求分析.................................................70 5.2.2 使用者案例圖.................................................71 5.2.3 物件導向分析設計.............................................72 5.3 溝通管理者.....................................................76 5.3.1 使用者案例圖.................................................77 5.3.2 物件導向分析設計.............................................78 5.4 商業流程處理伺服器.............................................82 5.4.1 使用者案例圖.................................................83 5.4.2 物件導向分析設計.............................................84 第六章、系統實作與整合測試.........................................87 6.1 系統實作.......................................................87 6.1.1 開發環境.....................................................87 6.1.2 軟體需求.....................................................87 6.1.3 硬體需求.....................................................88 6.1.4 實驗步驟.....................................................88 6.1.5 圖形使用者介面...............................................89 6.2 系統實例建構...................................................92 6.2.1 Mask訂單作業.................................................93 6.2.2 Mask House訂單處理商業流程...................................95 6.2.3 Foundry House訂單處理商業流程................................95 6.3 系統整合測試...................................................96 6.3.1資料切割大小效能分析..........................................96 6.3.2 各傳輸機制的效能比較.........................................97 6.3.3 訂單商業流程處理效能.........................................99 第七章、結論......................................................100 7.1 論文總結......................................................100 7.2 重要成果與實用價值............................................101 7.3 未來研究方向..................................................103 參考文獻..........................................................104

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