本論文之目的為利用準分子雷射加工製作特殊形貌之3D微結構。主要重點是利用準分子雷射孔洞面積法（Hole Area Modulation）搭配投射鏡產生的繞射現象，能達到加工任意形貌3D微結構。採用此法可避免灰階光罩製作成本過高，且不須像傳統式孔洞面積法移動工件的方法來降低表面粗糙度。
本論文包含理論分析、實驗驗證、與加工測試三大部分。理論分析部分將完整地解析準分子雷射微加工系統中的光學繞射現象，並完成數值模擬；實驗驗證部分將針對所建置的準分子雷射微加工系統，以實驗的方式，建構透光機率與加工率對照曲線圖，作為之後設計光罩的對照準則；加工測試部分將根據所建立之理論與實驗結果，選擇幾種具複雜形貌的3D微結構，實際設計與製作光罩，在試片上進行繞射光學的加工，以驗證此一3D微結構加工方法的可行性、加工精度、適用範圍與限制。
實驗結果證實可透過此方法加工任意形貌3D微結構，其誤差量大致可控制在1 μm內，但在錐體尖銳處的加工結果為圓弧狀的形貌，此外在垂直壁處會被稍微平滑化。

The purpose of this thesis is to use an excimer laser micromachining system to fabricate 3D microstructures with quite arbitrary profiles. The key point of this method depends on the optical diffraction phenomenon when applying a Hole Area Modulation (HAM) method with an optical image projection system. The advantages of this method are its straightforwardness, easiness in application, low-cost, and most importantly, its capability to produce three-dimensional (3D) microstructures with versatile surface profile.
In this thesis, the optical diffraction effect existing in an excimer laser micromachining system will be first studied both theoretically and experimentally. The first goal is to determine quantitatively how the laser machining rate is affected by the optical diffraction of mask patterns with different hole-radius and pitches. Based on this result, several 3D microstructures with different surface profiles are chosen and implemented through photo-mask design and excimer laser machining. The experiment results are compared with simulation data to verify the feasibility, precision, and limitations of this 3D microstructure fabrication method.
Using this method, 3D microstructures with complicated profiles can be easily fabricated and the surface roughness is significantly improved. As can be expected, surface profiles containing sharp edges and pointed angles are less applicable by this laser machining method. Otherwise, the machining accuracy can be controlled within 1 μm.

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