本研究成功以有機酸保護的方式，製備出保護劑具有在180 ℃裂解脫附的特性，藉由控制保護劑比例、反應時間等參數，得到最佳粒徑為18.5 ± 4.1 nm的奈米銀粒子，以FTIR鑑定外為保護劑的官能基及鍵結的種類。並合成出於160 ℃裂解的銀前驅物2-乙基己酸銀，與奈米銀粒子及溶劑混練，即可得到低溫燒結的奈米銀漿料，透過調整2-乙基己酸銀在漿料中的添加量，並測量漿料的電性及接合強度來找尋最佳的比例。奈米銀粉與2-乙基己酸銀的比例為6 : 1時的比例，擁有最低的電阻率(12.7 ± 3.7 x10^-8 Ω*m)，及最強的接合強度(27.7 ± 1.2 MPa)。低溫燒結奈米銀漿料在高溫儲藏測試1000小時後，電阻率並無顯著的上升。

Nanoization of silver nanopartilces significantly reduces the melting temperature of bulk silver. With the usage of silver nanoparticles and precursor additive, we have successfully synthesized low-temperature sintering silver paste which can be sintered at 200 ℃.We optimized proportion of silver nanoparticles and silver precursor to obtain the best performance. Specific amount of silver precursor leads to lower resistivity and higher bonding strength. After thermal compression process at 200 ℃ for 30 min, the paste produced high bonding strength up to 27 MPa. Without Silver precursor additive the bonding strength is only 17 MPa. There is obvious difference in the micro structure image showing addition of silver precursor has more connection between particles.(better sintering degree) Low electrical resistivity around 12.7 ± 3.7 x10-8 Ω*m were obtained.

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