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研究生: 葉曉嵐
Yeh, Hsiao-Lan
論文名稱: 台灣半導體設備產業的競爭策略研究—以漢微科與弘塑科技為例
A Study on The strategy of Taiwan Semiconductor Equipment Vendor – HMI (Hermes Microvision Inc.) and GPT (Grand Plastic Technology Corp.)
指導教授: 李昇暾
Li, Sheng-Tun
學位類別: 碩士
Master
系所名稱: 管理學院 - 高階管理碩士在職專班(EMBA)
Executive Master of Business Administration (EMBA)
論文出版年: 2014
畢業學年度: 102
語文別: 中文
論文頁數: 57
中文關鍵詞: 架構-行為-績效模型競爭者分析架構半導體
外文關鍵詞: S-C-P model, Competitor analysis and interfirm rivalry, Semiconductor
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  • 台灣半導體產業在政府長期的規劃與培植下已成為世界級的產業,成就今天的台灣被譽為半導體界的矽島美稱,在全球科技產品高度的競爭模式下,台灣以半導體產業代工模式,讓全球科技產業的產品得以大量生產成為生活化的主要推手,現代科技的進步與半導體產業發展息息相關;然而半導體產業本身就是高度資本投資與技術整合的產業,有別於傳統產業的規模與製造技術,在2010年後全球半導體晶圓廠的資本支出平均每年在600億美金左右,這也是全球半導體設備場商所覬覦的必爭之地。
    本研究旨在了解全球半導體設備業者所在的競爭環境,探討台灣半導體設備業者在整體產業環境中的的競爭狀況,透過S-C-P(Structure-Conduct-Performance)分析模型與競爭者分析架構(Competitor analysis and interfirm rivalry,M.J. Chen,1996),針對半導體設備產業來研究,並以漢微科(漢民微測公司;HMI)與弘塑科技(GPT)兩家台灣的半導體設備公司來研究探討台灣半導體設備商的競爭模式。歸納研究結果,用以了解台灣半導體設備商所面臨困境與突破機會,以提供台灣半導體晶圓製造的優勢,協助半導體設備產業的技術取得與供應鏈整合,來提升台灣半導體設備商的自主能力,真正落實半導體產業在地化的目標與競爭力。

    The research is meant to understand the environment of global semiconductor equipment suppliers and simultaneously discuss the competitive situation among Taiwanese suppliers in this very environment. Through S-C-P (Structure-Conduct-Performance) analysis model, competitor analysis, and interfirm rivalry, our research subjects are the semiconductor equipment suppliers which are two companies in Taiwan, HMI (Hermes Microvision Inc.) and GPT (Grand Plastic Technology Corp.). We conclude that this given research method can help to realize the adversity the industry encounters and to come up with systematic solutions, providing the suppliers a chance to take advantage of Taiwan's leading technique in wafer manufacturing. Furthermore, the contributions of our study for the semiconductor equipment suppliers are to facilitate the acquisition of technique, integration of the supply chain, promoting the independence of companies, and achieving the goal of localization of the semiconductor industry.
    Given that semiconductor equipment market provides a harsh competitive environment, only those who remain the advanced position in technology can set foot in the field. In HMI’s case, the company has more international strategies and advantages in technology than GPT. Moreover, HMI is active in expanding their external supply chain and optimizing the internal organization. Namely, HMI isolates the core department and transforms it to a division as the preparation for future industry.

    摘要...............................................................................III Abstract …………………………………………………..…..IV 誌謝 ……………………………………………………..…VIII 目錄...............................................................................IX 表目錄 .........................................................................XI 圖目錄 ........................................................................XII 第一章 緒論 ……………………….………………….…….1 1.1 研究動機…………………………………………….………………..…1 1.2 研究目的……………………………………………………..…...…..…2 1.3 研究範圍……………………………………………………………..….3 1.4 研究架構流程………………………………………………….…...…..4 第二章 文獻探討 …………………………………………...5 2.1 S-C-P 分析方法……………………………………….………………..5 2.1.1 產業結構(Structure)…………………………………....….6 2.1.2 產業行為(Conduct)…………………………………….…..8 2.1.3 產業績效(Performance)…………………………….…..…9 2.2 競爭敵對分析(Competitor analysis and interfirm rivalry)....... 10 2.3 半導體產業架構敘述 ………………………………………….…... 13 2.4 半導體產業資料分析……………...………………………………....16 2.5 半導體技術發展與設備關係………………………………………...19 第三章 半導體設備產業分析………………………….....22 3.1 半導體設備產業架構………………………………………………....22 3.2 半導體設備S-C-P分析…………………………………………..….…25 3.2.1 半導體設備產業結構(Structure)…..………….………….25 3.2.2 半導體設備產業行為(Conduct)……………….…….…...28 3.2.3 半導體產業績效(Performance)…………..….…….…..…30 3.3 台灣半導體設備市場分析……………………………….…….........32 3.3.1 台灣半導體設備產業結構 …………………….….…..…….32 3.3.2 台灣半導體設備產值與未來 ………………………..….…..34 第四章 研究個案討論……………………………….….….36 4.1 個案ㄧ、漢微科的競爭策略分析…………..…….…………….......36 4.1.1漢微科與KLA-Tencor競爭分析(電子束缺陷檢測)……...36 4.1.2 漢微科的發展策略 …………………………………….….…40 4.2 個案二、弘塑科技的模式分析………………………………………44 4.2.1 弘塑科技與TEL-NEXX競爭分析 …………….………….....44 4.2.2 弘塑科技的發展策略 ……………………………………….. 47 4.3 個案模式分析比較…………...........................………………….…48 第五章 結論與未來展望…………………………………...49 5.1 結論………………………………………………………..…..…....…..49 5.2 未來展望……………………………………………………….…….…52 參考文獻…………………………..………………….……...54

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