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研究生: 莊友任
Chuang, You-Ren
論文名稱: 應用於無線區域網路802.11ax之高增益高功率密度堆疊式砷化鎵異質接面雙載子電晶體功率放大器
A Stacked-HBT Based High Gain and High Power Density GaAs HBT Power Amplifier for WLAN 802.11ax
指導教授: 鄭光偉
Cheng, Kuang-Wei
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電腦與通信工程研究所
Institute of Computer & Communication Engineering
論文出版年: 2024
畢業學年度: 112
語文別: 英文
論文頁數: 120
中文關鍵詞: 無線區域網路802.11ax砷化鎵異質接面雙載子堆疊式高增益高功率功率放大器自適應偏壓電路負載牽引
外文關鍵詞: Wireless Local Area Network (WLAN), 802.11ax, Gallium Arsenide (GaAs), Heterojunction Bipolar Transistor (HBT), stacked-HBT, high gain, high power, power amplifier (PA), adaptive bias circuit, load-pull
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  • 本論文提出一個應用於無線區域網路 802.11ax 之基於砷化鎵異質接面雙載子電晶體的堆疊式架構功率放大器。為了能達到 Wi-Fi 6E 之規格需求,本研究設計了一個三級串接架構的功率放大器。由於對於功率放大器而言輸出功率、效率以及增益之間的權衡關係相當緊張,因此對於電晶體的尺寸及偏壓條件的挑選便成為設計的第一步。其次,為了能夠更加提升電路在高功率操作下的線性度表現,本研究設計了一個能夠補償直流偏壓衰減的自適應偏壓電路。最後,透過負載牽引模擬找出最適當的負載值,並透過級間匹配的適當設計來確保在不產生級間震盪的情況下能夠同時擁有良好的增益與輸出功率。然而,三級的串接架構將消耗非常大的面積在於匹配電路的設計上,而為了在縮小面積的同時能夠繼續保持高增益及輸出功率,本研究又提出了堆疊式的架構。堆疊式架構有別於傳統的疊接架構,其差別在於在電晶體的基極多接上一個對地電容,使得其與電晶體本身的寄生電容產生電壓分壓的效果,讓電晶體的基極不再是訊號接地的情形,進一步提升電晶體集極的擺幅,來提升電路的輸出功率。本研究使用穩懋以及宏捷科的砷化鎵異質接面雙載子電晶體製程實現此電路。此電路最後的量測結果在集極電源電壓為 5 伏特的情況下在中心頻率為 6.525 千兆赫茲的頻帶裡達到增益為 27.2 dB,,和輸輸出功率為 25.4 dBm,,值值功率附加效率為 37.8 %,面積為 1.6 平方毫米,以及功率密度為 216.7 毫瓦/平方毫米。

    This thesis presents a stacked architecture power amplifier (PA) based on Gallium Arsenide (GaAs) Heterojunction Bipolar Transistor (HBT) technology, designed for application in wireless local area network (WLAN) 802.11ax. To meet the specifications of Wi-Fi 6E, a three-stage cascade architecture PA was designed. The first step in the design process involves selecting the transistor sizes and bias conditions, given the critical tradeoffs among output power, efficiency, and gain for PAs. Next, to enhance the linearity performance of the circuit under high-power operation, an adaptive bias circuit was designed to compensate for DC bias degradation. Finally, an optimal load value was determined through load-pull simulations, and appropriate interstage matching design was implemented to ensure good gain and output power without causing inter-stage oscillation. However, the three-stage cascade architecture consumes significant area due to the matching circuit design. A stacked architecture was proposed to reduce the area while maintaining high gain and output power. The stacked architecture differs from traditional cascade structures by adding a capacitor to the ground at the transistor's base. This creates a voltage divider effect with the transistor's parasitic capacitance, preventing the base from being at AC ground and enhancing the collector swing to improve the circuit's output power. The circuit was implemented using the GaAs HBT processes from WIN Semiconductors and AWSC. The final measurement results show that, with a collector supply voltage of 5 V, the PA achieves a gain of 27.2 dB, a saturated output power of 25.4 dBm, a peak PAE of 37.8%, an area of 1.6 mm², and a power density of 216.7 mW/mm² at a center frequency of 6.525 GHz.

    摘要 i Abstract iii Table of Contents v List of Tables viii List of Figures x 1. Introduction 1 1.1 Motivation 1 1.2 Specification for WLAN 802.11ax 2 1.3 Analysis of Gallium Arsenide Heterojunction Bipolar Transistors 4 1.4 Wide Bandgap Transistors 5 1.5 Comparison to Silicon Bipolar Junction Transistor 6 1.6 Thesis Overview 7 2. Fundamental Power Amplifier 8 2.1 Fundamental Power Amplifier Performances 8 A. Gain 8 B. Output Power 8 C. Efficiency 9 D. 1-dB Compression Point 9 E. Third Intercept Point 11 F. Error Vector Magnitude 13 G. Power Density 16 2.2 Classification of Linear Power Amplifier 16 A. Class A Power Amplifier 17 B. Class B Power Amplifier 18 C. Class C Power Amplifier 19 2.3 Overview of Power Amplifier Architecture 20 A. Doherty Power Amplifier 20 B. Power-Combining Power Amplifier 22 C. Multistage Power Amplifier 23 2.4 Target Specification for WLAN 802.11 ax 24 3. Three-Stage Cascaded Power Amplifier with Adaptive Bias Circuit 26 3.1 Architecture of Proposed Power Amplifier 26 3.2 Circuit Implementation 28 A. Transistors Sizing and Stabilization Circuit 28 (A). Analysis of Gain and Stability 30 (B). Load-Pull Simulation 36 B. DC Adaptive Bias Circuit 41 C. Matching Network 46 (A). Output Matching Network 48 (B). Second Interstage Matching Network 50 (C). First Interstage Matching Network 52 (D). Input Matching Network 54 3.3 Simulation Results 56 A. Small-Signal Simulation 56 B. Large-Signal Simulation 57 3.4 Measurement Results 60 A. Measurement Setup 60 B. Small-Signal Measurement 62 C. Large-Signal Measurement 64 4. Two-Stage Stacked-HBT Cascaded Power Amplifier 67 4.1 Concept of Stacked-HBT Architecture 67 4.2 Architecture of Proposed Power Amplifier 70 4.3 Circuit Implementation 71 A. Transistors Sizing and Stabilization Circuit 71 (A). Analysis of Gain and Stability 71 (B). Load-Pull Simulation 74 B. DC Adaptive Bias Circuit 79 C. Matching Network 86 (A). Output Matching Network 86 (B). Interstage Matching Network 87 (C). Input Matching Network 89 4.4 Simulation Results 91 A. Small-Signal Simulation 91 B. Large-Signal Simulation 92 4.5 Measurement Results 95 A. Measurement Setup 95 B. Small-Signal Measurement 96 C. Large-Signal Measurement 97 4.6 Comparison 99 5. Conclusion and Future Works 101 5.1 Conclusion 101 5.2 Future Works 101 Reference 103

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