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研究生： 謝承佑
Hsieh, Cheng-Yu
論文名稱： 高導熱氮化鋁陶瓷粉體在複合材料與電子基板應用之先導研究
A Preliminary Study on Applications of AlN Ceramic Powder for Polymer Composites and Electronic Substrates
指導教授： 鍾賢龍
Chung, Shyan-Lung
學位類別： 博士
Doctor
系所名稱： 工學院 - 化學工程學系
Department of Chemical Engineering
論文出版年： 2006
畢業學年度： 94
語文別： 中文
論文頁數： 123
中文關鍵詞： 複合材料 、高導熱 、氮化鋁 、電子基板 、微波燒結
外文關鍵詞： high thermal conductivity, composites, microwave sintering, electronic substrate, aluminum nitride
相關次數： 點閱：115  下載：15 
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    • 摘要
    本論文主要在於研究燃燒合成之氮化鋁粉體在複合材料與基板應用的可行性。在複合材料方面，本實驗將氮化鋁粉體與CNE摻合製作成EMC複合材料，當使用平均粒徑35.3 μm的氮化鋁粉體，披覆1 wt%的silane，填充量為67 vol%時，使用不含溶劑的製程可得到緻密的EMC試片，其熱傳導值可達14 W/mK；在燒結方面，本實驗採用微波加熱技術進行氮化鋁燒結，並自行開發單模與多模腔體進行實驗，實驗結果發現，在添加3 wt% Y2O3作為助劑時，於1900℃燒結30分鐘可得到熱傳導180 W/mK的試片，在還原氣氛當中進行後續熱處理時，於1800℃熱處理180分鐘可得到熱傳導235 W/mK的氮化鋁試片。本研究同時驗證了利用多模腔體製備氮化鋁基板的可行性，利用微波燒結可得到緻密的氮化鋁基板與高溫共燒陶瓷。

    Abstract
    AlN is acknowledgement as a high thermal conductivity ceramic material. In the present study, a combustion synthesized AlN powder was studied for its feasibility of composites and sintered body or substrate. The AlN powder was used as a filler for epoxy molding compound (EMC). A thermal conductivity of 14 W/mK was obtained when the EMC was fabricated by a process involving no use of a solvent and a AlN powder with a particle size of 35.3 μm and a filler content of 67 vol% were used. In the experiments of AlN sintering, microwave heating technique was used to sinter the AlN specimens. A percent theoretical density of 99.5% was achieved with a sintering temperature of 1900℃, a soaking time of 30 min, and 3 wt% of Y2O3 added. The specimen sintered under such sintering conditions was measured to have a thermal conductivity of 186 W/mK. The thermal conductivity could be further significantly improved (up to 235 W/mK) by microwave reheating the sintered specimen under the reducing atmosphere. The results also showed the feasibility of microwave sintering on the fabrication of highly densified AlN substrates and high temperature cofired ceramics

    總 目 錄 中文摘要…………………………………………………………………I 英文摘要…………………………………………………………………II 誌謝…………………………………………………………………………III 總目錄……………………………………………………………………IV 表目錄……………………………………………………………………VIII 圖目錄……………………………………………………………………IX 第一章 緒 論…………………………………………………………1 1-1氮化鋁簡介………………………………………………………………1 1-2 氮化鋁合成簡介…………………………………………………3 1-3 氮化鋁粉體抗濕技術簡介……………………………………………6 1-4氮化鋁之前景……………………………………………………………9 第二章 原理與文獻回顧…………………………………………11 2-1氮化鋁物理性質………………………………………………………11 2-2熱傳導機構……………………………………………………………12 2-3 epoxy/AlN複合材料…………………………………………………14 2-3-1 有機/無機複合材料簡介………………………………………14 2-3-2 高導熱有機/無機複合材料簡介………………………………14 2-3-3 epoxy/AlN無機複合材料之文獻回顧…………………………15 2-4 AlN燒結簡介…………………………………………………………17 2-4-1 氮化鋁之液相燒結…………………………………………… 17 2-4-2 氮化鋁燒結助劑的選擇……………………………………… 23 2-4-3 氮化鋁燒結助劑的文獻回顧………………………………… 25 2-4-4 低溫燒結氮化鋁之文獻回顧………………………………… 27 2-4-5氮化鋁粉體純度對燒結的影響……………………………… 30 2-5 微波加熱原理…………………………………………………………31 2-5-1 微波簡介………………………………………………………31 2-5-2 微波加熱原件…………………………………………………32 2-5-3 微波加熱原理…………………………………………………35 2-5-4 微波加熱的優點………………………………………………39 2-5-5 微波效應………………………………………………………41 2-5-6 微波保溫裝置設計…………………………………………… 41 2-5-7 微波測溫………………………………………………………46 第三章 氮化鋁/環氧樹脂複合材料之開發……………………………50 3-1 簡介………………………………………………………………50 3-2 實驗方法………………………………………………………50 3-3 實驗結果……………………………………………………54 3-3-1氮化鋁粉體披覆APS……………………………………………54 3-3-2製程1……………………………………………………………56 3-3-2-1 氮化鋁粉體填充量與silane披覆的影響…………………56 3-3-2-2 EMC試片吸濕性測試……………………………………57 3-3-3 製程2……………………………………………………………58 3-3-4 氮化鋁粉體粒徑對熱傳導的影響……………………………60 3-4 討論…………………………………………………………………62 3-4-1 silane披覆………………………………………………………62 3-4-2 試片製作方法…………………………………………………63 3-4-3 氮化鋁粉體粒徑與填充量……………………………………64 3-5 結論……………………………………………………………………65 第四章 微波燒結氮化鋁粉體……………………………………………67 4-1 簡介…………………………………………………………………67 4-2實驗方法……………………………………………………………68 4-2-1粉體特性………………………………………………………68 4-2-2微波燒結…………………………………………………………69 4-2-3微波測溫…………………………………………………………71 4-3 實驗結果………………………………………………………74 4-3-1鋪粉的保溫效果…………………………………………74 4-3-2試片的緻密性……………………………………………74 4-3-3 XRD分析…………………………………………………77 4-3-4 熱傳導分析…………………………………………………77 4-3-5 微結構分析…………………………………………………77 4-4討論…………………………………………………………82 4-4-1鋪粉與保溫系統…………………………………………82 4-4-2氮化鋁粉體燒結性………………………………………83 4-4-3熱傳導與微結構…………………………………………84 4-5 結論……………………………………………………………85 第五章 微波燒結與熱處理製備高導熱氮化鋁…………………………87 5-1 簡介…………………………………………………………………87 5-2實驗方法……………………………………………………………88 5-2-1粉體特性與生胚製作………………………………………88 5-2-2微波燒結與熱處理…………………………………………89 5-3 實驗結果…………………………………………………………89 5-3-1氮氣氣氛燒結……………………………………………89 5-3-2還原氣氛燒結……………………………………………94 5-3-3還原氣氛熱處理…………………………………………96 5-4討論……………………………………………………………100 5-4-1氮氣氣氛燒結…………………………………………100 5-4-2還原氣氛燒結…………………………………………101 5-4-3還原氣氛熱處理………………………………………103 5-5 結論……………………………………………………………104 第六章 微波燒結氮化鋁基板……………………………………105 6-1多模腔體的設計…………………………………………………105 6-2 微波燒結氮化鋁基板……………………………………………108 6-3 微波高溫共燒AlN/W材料……………………………………110 第七章 結論…………………………………………………………113 參考文獻……………………………………………………………114 自述……………………………………………………………………123

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