在觸控面板技術的演進中，觸控線路常使用ITO材料，因為其具有較佳的導電及透光性能，但在外觀品味上則會有蝕刻紋路較明顯的問題。因此發展出搭配消影光學複合層的ITO膜，來改善面板的可視度；消影光學複合層使用SiO2及Nb2O5來改善光學差異；然而在製作複合層膜時，也可能產生微短路的問題。
本論文主要在探討於開發搭配消影光學複合層的ITO導電膜時，所發生之微短路問題。首先透過各層逆向拆解量測，定義出光學層之面阻抗特性指標，對異常光學複合層進行EDS、XPS等失效分析，觀察鍍膜品質；接著以田口方法規劃實驗，確定品質特性與理想機能，決定控制因子與變動水準，進行L9 (34直交表)實驗。結果顯示影響品質特性之顯著因子為鍍膜台車使用圈數，調整因子為鍍膜流程。經過參數的改善，預測的品質特性－光學複合層之片電阻，由4.5×1011Ω/□提升至1.4×1012Ω/□。改善後參數樣品量測結果為1.03×1012Ω/□，可符合規格1.0×1012Ω/□，對鍍膜品質有很大的提升；實際上線後，將測試品持續生產至電性檢測站量測，已完全改善微短路問題。

In the technology evolution of touch panels, ITO materials are always used in touch circuits because they have better electrical conductivity and light transmittance. On the other hand, the related etching lines are visually obvious which affect the visual appearance quality. Thus, ITO films with an anti-shadow optical composite layer were developed to improve visibility. The anti-shadow optical composite layer typically uses SiO2 and Nb2O5 to reduce the optical difference and is referred to as the Index Margin film (IM film). However, the micro-short circuits could occur in the process of making the IM film.
The goal of thesis is mainly to resolve this micro-short circuit problem that occurs in developing the ITO conductive film with the anti-shadowing optical composite layer. Through disassembly and measurement of each layer, the surface impedance characteristic index of the optical layer was defined and failure analysis by EDS and XPS was conducted to evaluate the quality of the optical composite layer. Then, experiments were planned by Taguchi method via an L9 table experiment.
The results show that the significant factor is the cart life used in the thin film process and the adjustment factor is the thin film process sequence. After adopting the improved parameters, the predicted surface sheet resistance of the optical composite layer increases from 4.5×1011Ω/□to1.4×1012Ω/□; thus, greatly improving the quality of the thin film. The resulted product sheet resistance measured is 1.03×1012Ω/□, which meets the specification of 1.0×1012Ω/□, completely resolved the micro-short circuit problem.

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