近年來由於電子構裝技術皆朝向高精密度之趨勢發展，因而造就了電子產品之微小化與輕量化。相對地，電子產品之可靠性就顯得日漸重要，亦成為日後設計時之首要重點工作。本研究主要是針對掉落試驗對電子構裝元件之影響，並以理論與實驗進行相互之驗證，而找出最佳之錫球成分配比，提高電子構裝產品之可靠性。
　　針對可攜帶式電子構裝產品，常因人為疏忽或搬運時而掉落地面，使得電子構裝產品因衝擊之影響，而造成內部元件之損壞或失效。因此，本文主要是根據JEDEC之標準衝擊規範，而進行電子構裝元件之掉落試驗。實驗方面，將電子構裝元件固定於衝壓模具上，且於落錘試驗機台上自由落下，再測其衝擊之響應。而數值分析方面，則以商用數值模擬軟體LS-DYNA3D進行數值模擬，並與實驗結果相互驗證，進行電子構裝元件之可靠性評估。本文結合理論與實驗之驗證，對於電子構裝元件之掉落試驗，提供一有效之設計與分析模式。

　　In recent years, the electronic products become tiny and slight due to the high packaging density for today’s electronic devices. The reliability of electronic products is getting more and more important, and become a first point of design section. This thesis focus on the response of electronic products under drop test and find the best compositive percentage of solder ball to increase the product reliability.
　　The failure of such electronic devices usually results from the drops onto the ground during the shipping processes or under user’s application. This study is according to the Impact Method of JEDEC Standard to proceed the drop test of component. Both the experiment and numerical analysis were conduced in this thesis. In experiment part, the component of electronic devices is fixed on a mold, then dropped from Drop -Weight Impact Tower and measured the response of shock. In numerical analysis, LS-DYNA3D is used to do the simulation. The result of experiment and simulation are compared to estimate the reliability of electronic products. It is useful for the construction of the methodology of designing and analysis mode for drop test.

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