半導體封裝廠是一典型的代工廠，產品大部分都以少量多樣的型態進行生產。然而，在製造過程中針對不同類型的產品時常需要進行製程參數的調整，若是參數水準設置不當，造成改機次數過多，會導致產能浪費。再者，隨著產品設計與生產流程的日益複雜，產品品質的良莠已非單一品質特性最佳化能滿足，往往需要同時同時考量多重品質特性最佳化。有鑑於此，本研究以模擬為工具，並結合田口方法、理想解類似度順序偏好法、主成份分析法、雙反應曲面法、分散式搜尋法等方法為主體來尋求多目標模擬模式最佳解。最後希望將得到的結果，透過模擬方法來評估製程參數水準調整的可行性，以作為現場管理者的決策參考依據，避免決策的錯誤及產能的浪費，真正解決實務上的問題為本研究之貢獻。

Semiconductor packing plant is a typical foundry factory and its products carry the feature of small in quantity and rich in variety. Since different products require various parameters, it leads to frequent changes in setup. Further, due to the increasing complexity of the product design, more than one quality characteristic must be considered simultaneously to improve the product quality. Therefore, this research uses simulation methods as the tool. Taguchi method, technique for order preference by similarity to ideal solution method, principal components analysis, dual response surface method and scatter search are used to optimize the multi-objective simulation models. At last, simulation methods are used to diagnose the possibilities in the parameters control. It can serve as a decision-marking reference for the on-the-scene regulators and avoid mistakes in decision-making and waste capacity. It aims to practically solve the problems in reality as the contribution of this research.

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