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研究生: 楊承學
Yang, Cheng-xiao
論文名稱: 彈性層界面黏著之穩定性分析
Stability Analysis of Interfacial Bonding in Elastic Layer
指導教授: 林育芸
Lin, Yu-yun
學位類別: 碩士
Master
系所名稱: 工學院 - 土木工程學系
Department of Civil Engineering
論文出版年: 2008
畢業學年度: 96
語文別: 中文
論文頁數: 115
中文關鍵詞: 穩定性準則、裂縫尖端擾動、應力強度因子
外文關鍵詞: stress intensity factor, variation at crack tip, stability criteria
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  • 近年來,從黏著實驗文獻中發現,在薄膜材料界面破壞中,常有手指狀或波浪狀的不穩定圖騰出現,而目前尚未有一個合適的理論模型去解釋此種現象的發生。本文主要引用Rice與Gao推導的對稱無限域中平面裂縫尖端擾動的第一階擾動理論,延伸得到具有限厚度之雙層材料界面裂縫尖端擾動波形之穩定性準則。利用有限元素數值模型求得特定施力方式下裂縫尖端應力強度因子,並得到彈性層厚度 與施力位置 之比值和不穩定圖騰之臨界波長 的關係式,發現臨界擾動波長不只跟薄膜厚度有關,與施力位置也有關係,但因施力形式為力控制,所以結果與材料參數無關,藉由理論分析的結果得以解釋實驗觀察之現象。

    In recent years, wavy patterns or fingers occurred in many adhesive experiments in the literature. These instability patterns were usually found at the interfacial fracture of thin film. So far, there is no adaptable analytical model to explain such a phenomenon occurring in the experiments. In this study, we refer to Rice and Gao’s first-order variation theory due to variation in location of planar crack front in the symmetric infinite body, and extended their theory to obtain a stability criteria for patterns at the interfacial crack between two dissimilar materials with finite thickness. We construct a finite element model to analyze the stress intensity factor near the crack tip at specified loading conditions. The relationship between the critical wavelength for the instability patterns and the ratio of the elastic layer thickness and the loading distance and was found. It is noted that the wavelength is related to not only the elastic layer thickness but also the loading distance. The results show no correlation with the materials’ properties because of load-controlled condition. Using this analytical model, we can explain the phenomenon observed in the experiments.

    中文摘要..............................................................................................I 英文摘要.............................................................................................II 誌謝....................................................................................................III 目錄....................................................................................................IV 圖目錄..............................................................................................VII 第一章 緒論.........................................................................................1 1.1 研究動機與目的............................................................................1 1.2 本文內容與組織............................................................................2 第二章 文獻回顧.................................................................................4 第三章 有限厚度之對稱彈性層界面穩定性分析...........................21 3.1 理論背景介紹..............................................................................21 3.1-1 含任意平面裂縫之無限域彈性體之開口位移差...................21 3.1-2 含半無限平面裂縫之無限域彈性體應力強度因子推導.......24 3.2 含平面裂縫之有限厚度彈性體應力強度因子變化量..............26 3.3 界面穩定性分析準則..................................................................28 3.4 利用有限元素模型計算應力強度因子......................................30 3.5 數值結果......................................................................................31 3.5-1 彈性層界面裂縫長度固定但施力位置變動...........................32 3.5-2 施力位置固定但彈性層界面裂縫變動...................................35 第四章 有限厚度之不可壓縮彈性層與剛體之界面穩定性分析...49 4.1 問題描述與分析方法..................................................................49 4.2 雙層材料裂縫尖端漸近理論介紹..............................................50 4.2-1 平面的應力強度因子與能量釋放率.......................................50 4.2-2 反平面的應力強度因子與能量釋放率...................................55 4.3 含半無限平面裂縫之雙層材料應力強度因子變化量..............57 4.4 含平面裂縫之有限厚度彈性體應力強度因子變化量..............60 4.5 雙層材料界面間的單位應力強度因子......................................61 4.6 不可壓縮之彈性層與剛體間的應力強度因子變化量..............64 4.7 不可壓縮之彈性層與剛體間之界面穩定性分析......................70 4.8 數值模型之建立與分析..............................................................73 4.8-1 數值模型的建立.......................................................................73 4.8-2 分析方法與結果.......................................................................73 第五章 結論與未來展望...................................................................88 參考文獻............................................................................................90 附錄A.................................................................................................92 附錄B.................................................................................................96 附錄C...............................................................................................100 附錄D...............................................................................................102 自述..................................................................................................104

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