在現今的電子產品中，小型化、高性能和低電耗趨勢日益重要，而在這些電子設備中，積層陶瓷電容 (Multilayer Ceramic Capacitor; MLCC)作為重要的被動元件之一，對其發展也是相當重要。因此本研究將針對MLCC的脫膠固化製程(Curing Process)製程做進一步的研究，目的為透過計算流體力學之數值分析，以減少在製造MLCC時所需之時間與能源的消耗，並且希望透過此研究，有效了解烤爐內部熱流場情形，將其流場可視化以觀察爐內氮氣濃度能否有效阻絕環境中之氧氣進入烤爐內，防止電容在燃燒時所產生的氧化反應，並針對端電極黏著劑燒除進行分析，觀察黏著劑移除率與溫度之間的關係、氣體產物經由表面擴散的濃度通量、以及熱降解所產生的內部中心壓力，並與實驗數據及文獻結果相互比對，以優化其製程為目的。期望能使MLCC之產品品質有所提升，以即將MLCC熱製程進行整合，以開發一套能一次完成MLCC製造的烤爐，以降低能源的損耗及成本的開銷。
在目前的結果中，已經成功建立出能與實驗溫度數據趨勢相同之曲線，並以此模型作為基準，對烤爐進行氣體濃度場之分析，藉由此分析可得，在多久的時間下可使其達到製程環境標準，以利於能源的節省。另外在Curing製程的BBO反應中，藉由所模擬出之熱流場，將其結果套用到MLCC的邊界條件中，並針對單一顆電容進行BBO反應計算，利用反應速率方程與Arrhenius方程所描述的一級降解反應，與多孔介質進行耦合。由目前模擬結果可得銅膏黏著劑與溫度之間的關係、黏著劑經熱降解由表面擴散的平均濃度通量、以及經降解後於MLCC內部產生的中心壓力，將其模擬結果與文獻、實驗進行比較，所得之趨勢都大致相同。
透過以上分析之方法，來驗證模型的可靠性，期望透過此模型建立一套完整的架構，並以此模型最為基準，調整相關參數，來觀察MLCC的內部變化，以幫助我們有效優化製程，達到最佳化之目的。
關鍵字:計算流體力學、熱流場、積層陶瓷電容、Curing製程、銅膏黏著劑燒除

Miniaturization, high performance, and low power consumption are becoming more and more crucial for today's electronic products, and multilayer ceramic capacitors (MLCCs) are one of the most crucial passive parts in electronic devices. Aiming to help reduce time and energy consumption in the manufacturing of MLCCs, in this study we have carried out a systematic study on the binder burn-out (BBO) and curing processes for MLCC manufacturing. Technically, by incorporating a first-order BBO kinetics model with the standard mass, momentum, and energy balance equations, a computational model is constructed in this study. By using this model, we successfully obtain numerical results for the temporal variations of the product gas concentrations and MLCC ambient temperature that compare favorably with experimental data. Using the temporally varying MLCC ambient temperature as the boundary condition, the BBO progress in the terminal electrodes of a single capacitor can then be calculated, by treating the capacitor as a porous dielectric and the aforementioned first-order kinetics model, with the reaction rate constant dependent upon temperature through the Arrhenius equation. Through a systematic parameter study, we determined how long it would take to ‘warm up’ the oven and complete the BBO process, which is helpful for energy conservation. It is arguable that through this study useful insights into the thermal and flow fields inside the MLCC curing oven have been gained. And the computational model constructed here can be used to help optimize the equipment and process parameter setting for MLCC manufacturing.

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