近年來台灣半導體工業開發技術進展非常迅速，隨著半導體產業競爭越來越激烈，製造業者無不致力於提昇生產能力，如晶圓尺寸由以往4吋、6吋、8吋進入到12吋晶圓時代，而12吋晶圓的良率即是衡量生產能力的一個重要指標。半導體界實務上，提升良率可從兩個方向著手，其一是製程方面之控管，其二是機台方面之控管。在半導體製程日趨精密下，對於12吋晶圓表面的潔淨程度要求亦愈來愈嚴格，以提高產品的可靠度及良率，而傳統潔淨室(ballroom)的生產型態已不能符合製程對環境的要求。微環境(mini- environment)乃成為必備的新式潔淨空間，同時晶圓傳送裝置及流程，也必須避免污染粒子問題產生，並進一步尋求解決方法。
本文主要針對如何降低半導體量測機台內部污染粒子問題，透過實驗方式期望能達到其目標值。首先，對所有量測機台進行一次因子分析法，以觀察各個因子對污染粒子(Particle)之影響。其次，再運用田口方法(Taguchi Methods)之實驗設計將量測機台內部污染粒子降到最低。最後，針對量測機台於生產線上之實際現況，透過實際實驗量測數據(Data)實施局部機構改造或調整，以達成潔淨度不佳之失敗率(Failure rate)於5%以下，使半導體量測機台內部之潔淨度處於最佳狀態，進而提高產品的良率，成為本實驗目的。
本文以半導體量測機台內部潔淨度為研究對象，欲將潔淨度不佳而導致機台無法使用之失敗率由原先15~20%降至5%以下，以驗證本研究所提方法的可行性與有效性。

Over the past few years, the semiconductor manufacturing process is developed very fast in Taiwan. Due to acute competition, the wafer sizes are developed from 4 inch, 6 inch and 8 inch to 12 inch in a new era. For increasing the productivity, semiconductor manufacturers have recognized that the percentage of fine output for 12 inch wafer is an important index to evaluate productivity. To lift up the percentage of fine output for 12 inch wafer, two methods are taken into account, i.e. process control and equipment control. Furthermore, as the process techniques become more precise in semiconductor manufacturing, the cleanliness of the 12 inch wafer surface has become critical to ensure the better reliability and yield of fine output. Thus the traditional clean room with the ballroom type will no more satisfy the process requirement. Instead the new mini-environment type clean spaces are crucially applied to provide ultra clean environment. Meanwhile, the transferring device and process avoiding from the impact of the polluted particles should be discussed to find some better solutions.

This study aims at reducing the impacts of polluted particles in the semiconductor metrology machines to achieve the goal through the experiment methods. First, one factor method is applied for all metrology machines to investigate the effect of each factor on polluted particles. Secondly, the Taguchi method is applied to reduce the polluted particles in the machines. Finally, based on the practical status on the production line, some metrology machines are partially amended or adjusted through the close-up. Hopefully, the failure rate will be controlled below 5% and an optimal status of the cleanliness of semiconductor machines can be obtained so that the yield of fine output for wafers can be ensured..

This paper focuses on the study of cleanliness of semiconductor metrology machines in which the failure rate is expected to reduce from 15~20% to 5%. Accordingly, the methodology proposed can hence be verified as reliable and effective.

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