本論文為研發一雷射感應器(Laser sensor)量測治具，包括光學路徑量測方式設計、製作，及量測數據的計算與分析，其功能主要為可量測八吋晶圓廠晶片盒底盤之變形量，並達到即時篩檢不良品的功能。此雷射感應器量測治具的特點包含 (1) 使用非接觸式的量測方式、避免量測因施力不當所造成的量測誤差，利用四組雷射感應器可兼顧受測物平面度的問題及增進量測效率；(2) 利用電腦程式分析計算量測數值、判斷受測物品質優劣並顯示結果於電腦螢幕，達到即時篩檢的目的。
就量測數值分析而言，可統計出晶片盒底盤四個量測點的平均變形量，以及不符合規格品所佔的比率，可作為不良品汰舊換新之成本評估作為參考。階段性的淘汰晶片盒底盤不良品，可大量減低因晶片盒底盤變形所造成晶片報廢。此外，亦可使用此一雷射感應器量測治具來進行新進廠之晶片盒底盤品質篩檢，避免不良品進入廠區使用。

In this thesis, a laser ranging sensor non-contact measuring tool based on optical path and real time data analysis has been developed and is used in 8” Fab. Currently, The laser sensor measuring tool is used to measure pod door distortion and to screen filter the bad pod doors. The laser sensor measuring tool has unique features, including (1) Non-contact characteristic to avoid default due to touching. It uses 4 sets of laser sensors to resolve the plane distortion issue of the pod door and speed up the measuring process ; (2) Real time measurement and analysis to screen the pod door into good and one through GUI of the computer.
In the screening analysis, The average thickness of pod door of the 4 measuring points is calculated and those not in the specification are halted for further action. and through the measurement and screening scheme, the situation of wafer scrap or damage by the robot arm is completely eliminated.

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