| 研究生: |
陳彥政 Chen, Yen-Cheng |
|---|---|
| 論文名稱: |
電弧放電之研究及應用 Research and Application of Arc Discharage |
| 指導教授: |
洪昭南
Hong, ChauNan |
| 學位類別: |
碩士 Master |
| 系所名稱: |
工學院 - 化學工程學系 Department of Chemical Engineering |
| 論文出版年: | 2004 |
| 畢業學年度: | 92 |
| 語文別: | 中文 |
| 論文頁數: | 115 |
| 中文關鍵詞: | 電弧 |
| 外文關鍵詞: | Arc |
| 相關次數: | 點閱:95 下載:4 |
| 分享至: |
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中文摘要
電漿在表面處理、微電子及 環境保護等領域的應用正逐漸的增加,常壓電漿由於不需真空設備,比其他電漿製程的設備成本便宜很多。本研究主要的目的是建立高功率的非常壓冷電漿,期望能提高化學反應的效率及選擇率。
本實驗利用電弧放電電漿來進行高分子表面處理,利用接觸角量測分析、原子力顯微鏡分析(AFM)、X光光電子儀(XPS)、附著力測試等分析方法來鑑定表面處理後的結果。PC、PMMA及PP基板在經過電弧放電電漿表面處理之後,有機基板的表面型態以及表面組成都有很大的改變。這三種基板在表面處理之後,接觸角很明顯的降低,隨著處理時間增加表面型態改變也越來越明顯,處理過後的表面被氧化,並且留下一些極性的官能機,這些含氧的官能機對表面潤濕性以及附著力的提昇有很大的幫助。
Abstract
The applications of plasma are constantly increasing in the fields of surface treatments, microelectronics and environmental protection. Atmospheric plasma do not require the need of vacuum equipments, and are inexpensive in capital investment as well as in operation cost. The main challenge of this study is to develop a powerful non-equilibrium cold atmospheric discharge for chemical applications with high efficiency and high selectivity.
Arc discharge plasma treatments of polymer for surface modifications have been studied using contact angle measurement, atomic force microscopy(AFM),X-ray photoelectron spectroscopy (XPS)and adhesive test. The arc discharge plasma is found to modify the PC、PMMA and PP surface in both the morphology and the composition. The contact angle is reduced dramatically for these three polymer substrates. AFM measurements show that changes in surface morphology appear to increase with extending processing time. Oxidation reaction results in oxidized polar groups on the processed polymer surface. These oxygen-containing groups contribute significantly to the increase of surface wettability and film adhesion.
[1] 賴耿陽編譯;電漿工學的基礎,復文書局 (2002)
[2] H.K. Yasuda, Plasma Polymerization, Academic Press, New York, 1985
[3] M Laroussi,Cold plasmas destroy bacteria,al. (2003) New J. Phys. to be published
[4] B.Chapman,Glow Discharge processes-Sputtering and Plasma Etching,John Wiley Sons,Canada,(1980).
[5] J.R.Roth Industrial Plasma Engineering-Volume,Institute of Physics Publishing ,London , (1995).
[6] 洪昭南,電漿反應器,化工技術,第三卷,第三期,(1995),124-135.
[7] B.Chapman Glow discharge processes, John Wiley & Sons, Inc., (1980) 52
[8] B. Eliasson, U. Kogelschatz “Non Equilibrium Volume Plasma Chemical Processing” IEEE transaction on plasma science, n 6, 19, (1991) , 1063-1077
[9] J. S. Chang, P. A. Lawless, T. Yamamoto “Corona Discharge Process” IEEE transactions on plasma science, vol. 19, no. 6, (1991) , 1152
[10] U. Kogelschatz, B.Eliasson, W. Egli “From ozone generators to flat television screens: history and future potential of dielectric-barrier discharges” Pure Appl. Chem., vol. 71, no. 10, (1999) , 1819-1828
[11] W. Siemens., Poggendorffs Ann. : Phys. Chem., 50, (1840) , 616
[12] T. Andrews, P. G. Tait. Phil. Trans. Roy. Soc. London 150, (1860), 113
[13] M.-P. Otto. Bull. Soc. FrancÀ. Electr. , 9, (1929) , 129.
[14] H. Becker. Wiss. Ver ff. aus dem Siemens-Konzern.1, (1920), 76; and 3, (1923), 243.
[15] T. C. Manley. Trans. Electrochem. Soc. 84, (1943),83.
[16] Y. Tanaka. J. Opt. Soc. Am. 45, (1955), 710.
[17] S. Yagi, N. Tabata. Proc. IEEE/OSA Conference on Lasers and Electro-Opt. Paper WE 5, p. 22, Washington, DC (1981).
[18] M. Konuma, Film Deposition by Plasma Techniques, Springer-Verlag, New York, (1992)
[19] M. A. Lieberman, and A. J. Lichtenberg, Principles of Plasma Discharges and Materials Processing. New York, Wiley, (1994)
[20] W. Elenbaas, The High Pressure Mercury Vapor Discharge. Amsterdam, The Netherlands, North-Holland, (1951)
[21] M. I. Boulos “Thermal plasma Processing” IEEE transactions on plasma science, n 6, 19, (1991), 1078-1089
[22] J. R. Roth, Industrial Plasma Engineering. Philadelphia, PA: IOP, 1, (1995),453–463.
[23] S. Kanazawa, M. Kogoma, T. Moriwaki, and S. Okazaki, “Carbon film formation by cold plasma at atmospheric pressure,” in Proc. 8th Int. Symp. Plasma Chemistry, Tokyo, Japan,3, (1987), 1839–1844.
[24] U. Kogelschatz “Filamentary, Patterned, and Diffuse Barrier Discharge” IEEE transactions on plasma science, no 4, 30, (2002)
[25] R. Bartnikass, “Note on discharges in helium under a.c. conditions” Brit. J. appl. Phys.,ser. 2, 1, (1968), 659-661
[26] K. G. Donohoe, “The Development and Characterization of an Atmospheric pressure Plasma Chemical Reactor,” Ph. D. dissertation, Calif. Inst. Tech., Pasadena CA, (1976)
[27] KG Konohoe and T. Wydeven “Plasma polymerization of ethylene in an atmospheric pressure discharge,” J. Appl. Polymer Sci., 23, (1979) 2591–2601
[28] S. Yagi, M. Hishii, N. Tabata, H. Nagai, and A. Nagai, “Silent dischargeCO laser,” Laser Eng., no. 3, 5 , (1977),171–176
[29] M. Tanaka, S. Yagi, and N. Tabata, “High frequency silent discharge and its application to cw CO laser application,” in Proc. 8th Ind. Conf Gas Discharges and Their Applications, Oxford, UK, 1, (1985), 551–554
[30] K. Yasui, M. Kuzumoto, S. Ogawa, M. Tanaka, and S. Yagi, “Silent-discharge excited TEM 2.5 kW CO laser,” IEEE J. Quantum Electron., 25, (1989) , 836–840
[31] H. Nagai, M. Hishii, M. Tanaka, Y. Myoi, H. Wakata, T. Yagi, and N. Tabata, “CW 20-KW SAGE CO laser for industrial use,” IEEE J. Quantum Electron., 29 , (1993) , 2898–2909
[32] S. Yagi and M. Kuzumoto, “Silent discharges in ozonisers and CO2 lasers,” Aust. J. Phys., 48 , (1995) , 411–418
[33] S. Kanagawa, M. Kogoma, T. Moriwaki, and S. Okazaki “Stable glow plasma at atmospheric pressure,” J. Phys. D, Appl. Phys., 21, (1988), 838–840
[34] T. Yokoyama, M. Kogoma, T. Moriwaki, and S. Okazaki, “The mechanism of the stabilized glow plasma at atmospheric pressure,” J. Phys. D, Appl. Phys., 23, (1990) , 1125–1128
[35] S. Okazaki, M. Kogoma, M. Uehara, and Y. Kimura, “Appearance of a stable glow discharge in air, argon, oxygen and nitrogen at atmospheric pressure using a 50 Hz source,” J. Phys. D, Appl. Phys., 26, (1993) , 889–892
[36] M. Kogoma and S. Okazaki, “Raising of ozone formation efficiency in a homogeneous glow discharge plasma at atmospheric pressure,” J. Phys. D, Appl. Phys., 27, (1994) , 1985–1987
[37] F. Massines, C. Mayoux, R. Messaoudi, A. Rabehi, and P. Ségur, “Experimental study of an atmospheric pressure glow discharge application to polymers surface treatment,” in Proc. 10th Ind. Conf. Gas Dischargesand Their Applications, Swansea, U.K., 2 , (1992) , 730–733
[38] F. Massines, R. B. Gadri, P. Decomps, A. Rabehi, P. Ségur, and C. Mayoux, “Atmospheric pressure dielectric controlled glow discharges: Diagnostics and modeling,” in Proc. 22rd Int. Conf. Phenomena in Ionized Gases, Hoboken, NJ, 363, (1996), 306–315.
[39] F. Massines, A. Rabehi, P. Decomps, R. B. Gadri, P. Ségur, and C. Mayoux, “Experimental and theoretical study of a glow discharge at atmospheric pressure controlled by a dielectric barrier,” J. Appl. Phys., 83, (1998), 2950–2957
[40] F. Massines and G. Gouda, “A comparison of polypropylen-surface treatment by filamentary, homogeneous and glow discharges in helium at atmospheric pressure,” J. Phys. D, Appl. Phys., 31, ( 1998), 3411–3420
[41] F. Massines, R. Messaoudi, and C. Mayoux, “Comparison between air filamentary and helium glow dielectric barrier discharges for the polypropylene surface treatment,” Plasmas Polymers, 3, (1998), 43–59
[42] N. Gherardi, G. Gouda, E. Gat, A. Ricard, and F. Massines, “Transition from glow silent discharge to micro-discharges in nitrogen gas,” Plasma Sources Sci. Technol., 9, (2000),340–346
[43] J. R. Roth, M. Laroussi, and C. Liu, “Experimental generation of a steady-state glow discharge at atmospheric pressure,” in Proc. 27th Int. Conf. Plasma Science, Tampa, FL, 1992.
[44] T. C. Montie, K. Kelly-Wintenberg, and J. R. Roth, “An overview of research using a one atmosphere uniform glow discharge plasma (OAUGDP) for sterilization of surfaces and materials,” IEEE Trans. Plasma Sci., 28, (2000), 41–50
[45] P. P. Tsai, L. C. Wadsworth, and J. R. Roth, “Surface modification of fabrics using a one- atmosphere glow discharge plasma to improve wettability,” Textile Res. J., 67, (1997),359–369
[46] Koinuma, H. Ohkudo, T. Hashimoto "Development and application of a microbeam plasma generator" Applied Physics Letters, no.7, 60, (1992), 816
[47] K. Inomata, H. Ha, K. A. Chaudhary, H. Koinuma "Open air deposition of SiO2 film from a cold torch of tetramethoxysilane-H2-Ar system" Applied Physics Letters, no.1, 64, (1992),46
[48] R. F. Hicks et al. “The Atmospheric-Pressure Plasma Jet: A Review and Comparison to Other Plasma Sources” IEEE transactions on plasma science, no. 6, 26, (1998),1685
[49] S. E. Babayan, J. Y. Jeong, V. J. Tu, J. Park, G. S. Selwyn and R. F. Hicks “Deposition of silicon dioxide films with an atmospheric-pressure plasma jet” Plasma Sources Sci. Technol. 7 (1998) 286-288.
[50] J. Park, I. Henins, H. W. Herrmann, G. S. Selwyn, R.F. Hicks “Discharge Phenomena of an Atmospheric Pressure Radio-Frequency Capacitive Plasma Source” Journal of Applied Physics, n1, 89, (2001) ,20-28
[51] G. R. Nowling, S. E. Babayan, V. Jankovic and R. F. Hicks “Remote plasma-enhanced chemical vapor deposition of silicon nitride at atmospheric pressure” Plasma Sources Sci. Technol. 11,(2002), 97-103
[52] R. F. Hicks et al. United States Patent Application Publication US2002/0129902 A1
[53] R. H. Stark and K. H. Schoenbach “Direct current high-pressure glow discharges” Journal of Applied Physcis, n 4, 85, (1999), 2075-2080
[54] A. Ei-Habachi and K. H. Schoenbach “Emission of excimer radiation from direct current, high-pressure hollow cathode discharges” Appl. Phys. Lett. 72(1), (1997), 22-24
[55] J. G. Eden et al. “Microdischarge devices fabricated in silicon” Appl. Phys. Lett., No. 9, 71, (1997),1165-1167
[56] J. W. Frame, P. C. John, T. A. DeTemple, and J. G. Eden “Continuous-wave emission in the ultraviolet from diatomic excimers in a microdischarge” Applied Physics Letters, n 21, 72 , (1998), 2634-2636
[57] J. G. Eden, C. J. Wagner, J. Gao, N. P. Ostrom, and S. J. Park “Microdischarge array-assisted ignition of a high-pressure discharge:Application to arc lamps” Applied Physics Letters, n 26, 79, (2001),4304-4306
[58] C. J. Wagner, N. P. Ostrom, S. J. Park, J. Gao, and J. G. Eden “Reduction in the Breakdown Voltage of a High-Pressure Discharge With an Array of 200-400-μm-Diameter Microdischarges: Application to Arc Lamp Ignition” IEEE Transactions on Plasma Science, n 1, 30, (2002), 194-195
[59] H. Barankova et al “Fused hollow cathode cold atmospheric plasma” APPLIED PHYSICS LETTERS , n 3, 76, ( 2000), 285-287
[60] L. Bardos,and H. Barankova “Radio frequency hollow cathode source for large area cold atmospheric plasma applications” Surface and Coating Technology, 133, (2000), 522-527,
[61] H. Barankova, and L. Bardos “Hollow cathode plasma sources for large area surface treatment” Surface and Coating Technology, 146, (2001),486-490,
[62] H. Barankova, and L. Bardos “Fused hollow cathode cold atmospheric plasma source for gas treatment” Catalysis Today, v 72 (2002) 237-241
[63] Yu. Akishev, A. Deryugin, A. Napartovich, N. Trushkin, J. Phys. D: Appl. Phys., n 10, 26 ,(1993),1630-1637,
[64] E. E. Kunhardt “Generation of Large-Volume, Atmospheric-Pressure, Nonequilibrium Plasmas” IEEE transactions on plasma science, n 1, 28, (2000),189
[65] K. S. Nam, S. R. Lee, J. J. Rha, K. H. Lee, and J. K. Kim “Apparatus for generating low temperature plasma at atmospheric pressure” United States Patent 6,441,554
[66] S. I. Kim and E. E. Kunhardt “Capillary electrode discharge plasma display panel device and method of fabricating the same” United States Patent 6,255,777
[67] S. I. Kim and E. E. Kunhardt “Method of fabricating capillary electrode discharge plasma display panel device” United States Patent 6,475,049
[68] D. Kim, S. Kim, W. Kokonaski “Capillary discharge plasma display panel with optimum capillary aspect ratio” United States Patent 6,545,411
[69] M. J. Shenton, M. C. Lovell-Hoare and G. C. Stevens "Adhesion enhancement of polymer surfaces by atmospheric plasma treatment" J. Phys. D: Appl. Phys., 34, (2001) ,2754–2760
[70] M. Laroussi et al “The Resistive Barrier Discharge” IEEE TRANSACTIONS ON PLASMA SCIENCE, n 1, 30, (2002) ,158-159
[71] F. Richard, J. M. Cormier, S. Pellerin, and J. Chapelle, J. Appl. Phys. 79, (1996),2245
[72] Ozlem Mutaf-Yardimci, Alexei V.Saveliev,J. Appl. Phys. 87, (1999),1632
[73] A. A. Naville and C. E. Guye, French Patent No. 350,(1904),120
[74] A. Fridman, S. Nester, L. A. Kennedy, A. Saveliev, and O. Mutaf- Yardimci , Prog. Energy Combust. Sci. 25, (1999),211
[75] 4 H. Lesueur, A. Czernichowski, and J. Chapelle, Int. J. Hydrogen Energy 19, (1994),139
[76] V. Dalaine, J. M. Cormier, and P. Lefaucheux, J. Appl. Phys. 83, (1998), 2435
[77] A. Czernichowski, H. Nassar, A. Ranaivosoloarimanana, A. A. Fridman,M. Simek, K. Musiol, E. Pawelec, and L. Dittrichova, Acta Phys. Pol. A89, (1996),595
[78] J. R. Dann, Journal of colloid and Interface Science, 32(2), (1970), 302
[79] E. Lugscheider, K. BobZin, M. Möller, Thin Solid Films, 355,(1999) ,367-373
[80] M. Strobel, C.S. Lyons and K.L. Mittal, Plasma surface modification of polymer: relevance to adhension(1994)
[81] 高正雄 “電漿化學” 復漢出版社印行
[82] R.D.Boyd, A.M. Kenwright, J.P.S.Badyal, Macromolecules, 30, (1997), 5429-5436
[83] W.Decker, S. Pirzada, M. Michel, A. Yializs, Long lasting surface activation of polymer Webs, (2000)
[84] G.Bing, C.F.Quate and Ch.Gerber, Phys. Rev. Lett. 56, (1986), 930
[85] 潘扶民,科儀新知,第十九卷,第二期,1997,118-127。
[86] ASTM D3359-95a,”Standard Test Methods for Measuring Adhesion byTape.Test 1996.
[87] M. Strobel, C.S. Lyons and K.L. Mittal, Plasma surface modification of polymer: relevance to adhension(1994)
[88] Nai-Yi Cui,Norman M.D. Brown , Applied Surface Science 189 , (2002) , 31-38
[89] S.Ben Amor,G.Baud,M.Jacquet,Applied Surface Science ,153, (2000), 172-183
[90] Kwang-Ryeol Lee etc.,Diamond and related Materials, 2 ,(1993),218-224
[91] US patent 5569497
[92] Cheng-Chung Lee,Jin-Cherng Hsu,Cheng-chung Jaing,Thin solid film 295,(1997),122-124.
[93] 何政昌,國立成功大學化工所碩士論文,2003