近年來由於花費與製程溫度考量，利用金屬奈米顆粒懸浮液製作導電電路與接點受到相當的矚目。本研究中，利用金奈米顆粒懸浮液作為金屬墨水進行掃描式熱微影。掃描探針顯微鏡裝載上微米尺寸熱探針，利用其熱誘發反應達到微影目的。此外，藉由添加高能物質過氧化二苯甲醯 (Benzoyl Peroxide, BPO)為熱輔助劑，提供額外的熱能，促進金奈米顆粒保護劑脫附，降低金奈米顆粒燒結所需的溫度。經添加過BPO的金奈米顆粒懸浮液，經旋轉塗佈於Polyimide (Kapton)基板形成一均勻薄膜，薄膜經恆溫熱處理後，會造成保護劑脫附和金奈米顆粒熔融燒結，實驗中，有效造成金奈米顆粒熔融燒結的最低恆溫熱處理溫度為120oC。利用定點熱分析，觀察金奈米顆粒微觀熱性質，發現隨BPO添加量增加，金奈米顆粒產生熔融燒結熱探針誘發溫度有往低溫位移的趨勢。使用添加BPO的金奈米顆粒懸浮液，經旋轉塗佈成一薄膜，在此薄膜上進行熱微影，利用熱探針與BPO自發裂解所提供的熱促使金奈米顆粒熔融燒結。當進行掃描熱微影時，使用微米尺寸的Walloston熱探針，溫度分別為300oC、350oC和400oC，掃描速率固定為1μm/s，使熱探針掃描區域的金奈米顆粒熔融燒結，建構出微米等級的金線熱微影圖形，最細線寬可達1.5μm。

Fabrications of electronic circuits and interconnects from metallic nanoparticle suspensions have attracted significant attentions in recent years under the considerations of the cost-effective fabrication processes and more-importantly the reduction of processing temperatures. In this research work, the gold nanoparticle suspensions were utilized as the metallic inks for the investigations of the scanning thermal lithography. A micro-scaled thermal probe was equipped with a scanning probe microscope to achieve the lithography of thermally-induced pattering mechanism. Moreover, an energetic reagent, benzoyl peroxide (BPO), was introduced to provide additional joule heat and consequently to reduce the required sintering temperatures. BPO was mixed with gold nanoparticle suspension. Spin-coated thin films of this suspension were sintered to encourage the surfactant desorption and nanoparticle sintering.
In the localized thermal analyses, the temperatures of thermal decompositions of the nanoparticle surfactants were found decreased with the BPO loadings. Isothermal treatments of these nanoparticles at the various temperatures revealed the significant reduction as high as 120oC in the minimum temperatures that were required for the effective sintering of gold nanoparticles. Scanning thermal lithography was also carried out using the micro-scaled thermal probe. In the present of BPO reagent, the thermal lithography of gold patterns was performed and investigated at the relatively low temperature of 300oC ~ 400oC. Desired gold patterns with line width as small as 1.5 μm was successfully fabricated.

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