本文主要以實驗與分析來找出晶片之捲帶包裝製程最佳製程參數，以防止密封後介於蓋帶與載帶之間的間隙過大，造成晶片自載帶之口袋中滑移出而造成損傷。

為了符合科技發展所需，電子產品朝向體積輕薄短小為目標，而越趨採用未經環氧樹脂封裝出貨之晶片。透過捲帶包裝製程的研發過程中發現，介於蓋帶與載帶之間的間隙是因密封時之加熱時間、加熱溫度與壓力所引發之帳篷效應(Tent Space)。

由於在產線有不少干擾因子，對此本論文之實驗採取全因子實驗。經由剝離測試、雷射顯微鏡量測Tent Space之數值分析後發現，製程參數中的密封壓力(Sealing Pressure)與密封溫度(Sealing Temperature)為影響帳篷區間(Tent Space)之關鍵因子，並與Tent Space之數值成正比發展。本論文之實驗得出於密封溫度為170℃、加熱時間為70 ms以及密封壓力為0.23 MPa時，可得到捲帶包裝之最佳製程參數。

This study via experiments and analysis to find the best process parameters of tape and reel (TnR). In order to prevent the gap between the cover tape and the carrier tape from being too large after sealing, causing the chip to slip out of the pocket of the carrier tape and cause damage.
In order to meet the requirements of technological development, electronic products are aiming to be lighter, thinner and smaller, and increasingly used chips without packaged with polyepoxide. Through the research and development the process of tape and reel (TnR), it is found that the gap between the cover tape and the carrier tape is the Tent Space caused by the heating time, heating temperature and pressure during sealing.
Because there are many interference factors in the production line, the experiment of this study adopted a full factor experiment. After analysis numerical that via peeling test and the measurement via laser microscope of Tent Space, it is found that the sealing pressure and sealing temperature in the process parameters are the key factors affecting the Tent Space, and they develop in direct proportion to the value of the Tent Space. The conclusion in this study shows that when the sealing temperature is 170°C, the heating time is 70 ms, and the sealing pressure is 0.23 MPa, the best process parameters for tape and reel (TnR) can be obtained.

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